BALL Multi-functional Peripherals 503

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
LS1027AXN7NNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1017ACN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	AEC-Q100	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1017ASN7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68
LS1046AXN8M1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14		GRID ARRAY, FINE PITCH		.87 V				BOTTOM	2.61 mm		23 mm		YES	64				23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780					76
MCIMX503CVK8B	NXP Semiconductors		COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	70 Cel	0 Cel		BOTTOM	1.52 mm		13 mm							13 mm	CMOS		1.05 V			.5 mm		S-PBGA-B416	3
LS1017AYE7PNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	125 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1027ASN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68
LS1027ACE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	AEC-Q100	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1027ACN7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	AEC-Q100	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1017ACN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	AEC-Q100	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1046ASE8PQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.61 mm		23 mm		YES	64				23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780					76
LS1027AYE7HQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	125 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1017AYE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	125 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1024ASE7JLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V		26		GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	900 MHz	30	250	21 mm	CMOS	1400 mA	1.1 V			.8 mm		S-PBGA-B625	3
MCIMX27LMOP4AR2	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.52 V		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.54 mm		19 mm	ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US	YES	16	26 MHz	40	260	19 mm	CMOS		1.45 V			.8 mm	FIXED POINT	S-PBGA-B473	3	400 rpm	YES	e1
LS1027ACN7KNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	AEC-Q100	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1046AXE8QQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.61 mm		23 mm		YES	64				23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780					76
LS1027ASE7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68
LS1026AXE8TQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.61 mm		23 mm		YES	64				23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780					76
LS1027ASN7HQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1017ASE7HQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
MCIMX6G2DVK05AA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V				BOTTOM	1.23 mm		9 mm		YES	16		40	260	9 mm	CMOS					.5 mm	FIXED POINT	S-PBGA-B272	3	528 rpm	YES
LS1017AYE7HQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	125 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1027ASE7HNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.87 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		.9 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68
LS1027AXN7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68
MCIMX6Q5EYM10CC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26		GRID ARRAY, HEAT SINK/SLUG		1.35 V				BOTTOM	1.6 mm		21 mm		YES	32		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS		1.4 V			.8 mm	FIXED POINT	S-PBGA-B624		1000 rpm	YES
LS1017ASE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68
LS1026ASN8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3			e1	76
LS1024ASN7MLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.164 V		26		GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.096 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	1200 MHz	30	250	21 mm	CMOS	1500 mA	1.13 V			.8 mm		S-PBGA-B625	3
LS1046AXE8M1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14		GRID ARRAY, FINE PITCH		.87 V				BOTTOM	2.61 mm		23 mm		YES	64				23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780					76
LS1027ASE7NNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1017ASE7KNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1046AXN8QQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.61 mm		23 mm		YES	64				23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780					76
MIMX8MD6CVAHZAA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, FINE PITCH		.9 V	105 Cel	-40 Cel		BOTTOM	2.18 mm	81920	17 mm	0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE	YES		40 MHz		260	17 mm	CMOS		1 V		ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB	.65 mm		S-PBGA-B621	3				16
LS1026AXE8QQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.61 mm		23 mm		YES	64				23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780					76
LS1017AYE7NNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	125 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1017ACE7PNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	AEC-Q100	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1026ASN8M1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14		GRID ARRAY, FINE PITCH		.87 V				BOTTOM	2.61 mm		23 mm		YES	64				23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780					76
MCIMX27MJP4AR2	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.52 V		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.54 mm		19 mm	ALSO OPERATES 1.3V AT 266MHZ	YES	32	32 MHz	40	260	19 mm	CMOS		1.45 V			.8 mm	FIXED POINT	S-PBGA-B473	3	400 rpm	YES	e1
LS1024ASE7MLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.164 V		26		GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.096 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm		YES	0	1200 MHz	30	250	21 mm	CMOS	1500 mA	1.13 V			.8 mm		S-PBGA-B625	3
MCIMX356AJQ	NXP Semiconductors		INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY, LOW PROFILE, FINE PITCH					TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm							17 mm						.8 mm		S-PBGA-B400	3			e1
MIMX8MQ7CVAHZAA	NXP Semiconductors		INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, FINE PITCH		.9 V	105 Cel	-40 Cel		BOTTOM	2.18 mm	81920	17 mm	0.9 V NOMINAL ALSO AVAILABLE @800MHZ	YES		40 MHz		260	17 mm	CMOS		1 V		ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB	.65 mm		S-PBGA-B621	3				16
LS1027ASN7KNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1027ACE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	AEC-Q100	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1017ACE7KNA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	AEC-Q100	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	85 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32				17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448					68
LS1027ASE7KQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68
LS1017ASN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68
LS1027ASN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	0 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3				68

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.