BALL Multi-functional Peripherals 503

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
CY8C5288FNI-LP213T	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.6 mm	32768	5.192 mm		YES	0	33 MHz			5.94 mm	CMOS		3.3 V			I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB	.5 mm		R-PBGA-B99	1				e1	62
DW82801HBMSLJ4Y	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES			32		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40					BOTTOM	2.49 mm		31 mm	PITCH_MINI	NO	32	48 MHz			31 mm	CMOS		1.05 V		Other uPs/uCs/Peripheral ICs	USB; PCI; I2C	1 mm		S-PBGA-B676		Not Qualified
NH82801HBMSLB9A	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES			32		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40					BOTTOM	2.49 mm		31 mm	PITCH_MINI	NO	32	48 MHz			31 mm	CMOS		1.05 V		Other uPs/uCs/Peripheral ICs	USB; PCI; I2C	1 mm		S-PBGA-B676		Not Qualified
66AK2H06DAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		32			GRID ARRAY		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS		1 V			ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
LS1026ASN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
CY8C5888FNI-LP214	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.6 mm	32768	5.192 mm		YES		33 MHz		260	5.94 mm	CMOS		1.8 V			I2C; USB	.5 mm		R-PBGA-B99	1				e4	62
CYBL10563-68FNXIT	Cypress Semiconductor		INDUSTRIAL	BALL	68	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	8192	3.52 mm		YES		48 MHz			3.91 mm	CMOS		1.8 V			I2C	.4 mm		R-PBGA-B68						36
LS1026AXN8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1026ASN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046AXN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
TDA2EGBHQCBDRQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V	AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm	512K	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V			CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3				e1	186
LS1026ASE8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1026AXN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASE8P1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MCIMX7D5EVM10SC	NXP Semiconductors			BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.045 V				BOTTOM	1.4 mm		19 mm					40	260	19 mm	CMOS		1.1 V				.75 mm		S-PBGA-B541	3
CY8C5888FNI-LP210	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.6 mm	32768	5.192 mm		YES		33 MHz		260	5.94 mm	CMOS		1.8 V			I2C; USB	.5 mm		R-PBGA-B99	1				e4	62
LS1026ASE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1026AXE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V		14			GRID ARRAY, FINE PITCH		.87 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V			I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MCIMX6G2DVK05AB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V		26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	95 Cel	0 Cel		BOTTOM	1.23 mm		9 mm		YES	16		40	260	9 mm	CMOS						.5 mm	FIXED POINT	S-PBGA-B272	3		528 rpm	YES
TDA3MVRBFABFRQ1	Texas Instruments	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V	AEC-Q100	16			GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	524288	15 mm		YES	32	38.4 MHz	30	250	15 mm	CMOS		1.06 V	13		CAN(2), I2C(2), QSPI, SPI(4), UART(3)	.65 mm		S-PBGA-B367	3				e1	126
NH82801GBM	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY		YES					1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40					BOTTOM											CMOS				Other Microprocessor ICs		1 mm		S-PBGA-B652		Not Qualified
NH82801GBM/SL8YB	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY		YES					1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40					BOTTOM											CMOS				Other Microprocessor ICs		1 mm		S-PBGA-B652		Not Qualified
BD82QM67SLJ4M	Intel			BALL	989	FBGA	SQUARE	PLASTIC/EPOXY		YES			32		1.05,1.5,1.8,3.3,5	GRID ARRAY, FINE PITCH	BGA989(UNSPEC)					BOTTOM	2.205 mm		25 mm	SEATED HT-CALCULATED	YES	16	48 MHz			25 mm	CMOS		1.05 V		Bus Controllers	USB; PCI; I2C	.6 mm		S-PBGA-B989		Not Qualified
NH82801GBSL8FX	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY		YES					1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40					BOTTOM											CMOS				Other Microprocessor ICs		1 mm		S-PBGA-B652		Not Qualified
BD82QM57SLGZQ	Intel			BALL	1071	HBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.1 V		32			GRID ARRAY, HEAT SINK/SLUG		.998 V				BOTTOM	2.358 mm		25 mm		YES	32	14.318 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1.05 V			USB; PCI; I2C; LPC; PS/2	.6 mm		R-PBGA-B1071
MCIMX6G2DVM05AA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V				BOTTOM	1.32 mm		14 mm		YES	16		40	260	14 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B289	3		528 rpm	YES
CY8C4127FNI-BL483T	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	68	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA68,8X9,16	1.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.55 mm	8192	3.52 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	NO			30	260	3.91 mm	CMOS	25 mA	3.3 V			I2C, SPI, UART	.4 mm		R-PBGA-B68	1				e1	36
LS1027AXN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V		14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8		I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
AF82801IBM	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY						BOTTOM					NO			NOT SPECIFIED	NOT SPECIFIED		CMOS					PCI; USB; LPC			S-PBGA-B676
CY8C4124FNI-443T	Infineon Technologies		INDUSTRIAL	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.482 mm	2048	2.097 mm		NO	0	48 MHz			2.582 mm	CMOS		3.3 V			I2C; SPI; UART	.35 mm		R-PBGA-B35	1					31
DW82801HBM	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES			32			GRID ARRAY						BOTTOM	2.49 mm		31 mm	PITCH_MINI	NO	32	48 MHz			31 mm	CMOS		1.05 V			USB; PCI; I2C	1 mm		S-PBGA-B676
CY8C5488FNI-LP212	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.6 mm	32768	5.192 mm		YES		33 MHz			5.94 mm	CMOS		1.8 V			I2C; USB	.5 mm		R-PBGA-B99						62
CYBL10563-68FNXI	Infineon Technologies		INDUSTRIAL	BALL	68	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	8192	3.52 mm		YES		48 MHz	NOT SPECIFIED	NOT SPECIFIED	3.91 mm	CMOS		1.8 V			I2C; USB	.4 mm		R-PBGA-B68						36
FW82801DB	Intel			BALL	421	BGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		32			GRID ARRAY		1.425 V				BOTTOM	2.59 mm	256	31 mm	ALSO REQUIRES 3.3V SUPPLY	NO	32	66 MHz			31 mm	CMOS		1.5 V			PCI; USB; LPC	1.27 mm		S-PBGA-B421	1					29
LE3100MICH/SL9PU	Intel			BALL	1284	BGA	SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY						BOTTOM					NO						CMOS					PCI; SATA; SMBUS; UART; USB			S-PBGA-B1284						38
NH82801GB	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY		YES					1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40					BOTTOM											CMOS				Other Microprocessor ICs		1 mm		S-PBGA-B652		Not Qualified
NHE6300ESB	Intel			BALL	689	BGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		64			GRID ARRAY		1.425 V				BOTTOM		256			NO	64	48 MHz				CMOS		1.5 V			PCI			S-PBGA-B689						4
XPC107APX100LB	Motorola			BALL	503	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V		32			GRID ARRAY		2.375 V				BOTTOM	2.75 mm		33 mm		YES	64	100 MHz			33 mm	CMOS		2.5 V			PCI; I2C; 60X PROCESSOR	1.27 mm		S-PBGA-B503		Not Qualified				64
XPC107APX100LD	NXP Semiconductors			BALL	503	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V					GRID ARRAY		2.375 V			TIN LEAD SILVER	BOTTOM	2.75 mm	256	33 mm		YES		66 MHz			33 mm	CMOS		2.5 V			PCI	1.27 mm		S-PBGA-B503					e0
66AK2H06DAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		32			GRID ARRAY		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS		1 V			ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
CY8C4248BZI-L489	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	16384	9 mm		NO		48 MHz			9 mm	CMOS	14.5 mA				I2C; IRDA; LIN; SPI; UART; USB	.65 mm		S-PBGA-B124	3				e1	98
MCIMX27LVOP4AR2	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.52 V		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		17 mm	ALSO OPERATES 1.3V AT 266MHZ	YES	32	32 MHz	40	260	17 mm	CMOS		1.45 V				.65 mm	FIXED POINT	S-PBGA-B404	3		400 rpm	YES	e1
MCIMX6G3DVM05AA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V				BOTTOM	1.32 mm		14 mm		YES	16		40	260	14 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B289	3		528 rpm	YES
ST2100	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	373	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		15			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA373,23X23,20	1.08 V	85 Cel	-40 Cel		BOTTOM	1.2 mm	8192	12 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.2 V	4		CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB	.5 mm		S-PBGA-B373						40
66AK2H06DAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		32			GRID ARRAY		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS		1 V			ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.