Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.05,1.5,3.3,5 |
GRID ARRAY |
BGA676,29X29,40 |
BOTTOM |
2.49 mm |
31 mm |
PITCH_MINI |
NO |
32 |
48 MHz |
31 mm |
CMOS |
1.05 V |
Other uPs/uCs/Peripheral ICs |
USB; PCI; I2C |
1 mm |
S-PBGA-B676 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.05,1.5,3.3,5 |
GRID ARRAY |
BGA676,29X29,40 |
BOTTOM |
2.49 mm |
31 mm |
PITCH_MINI |
NO |
32 |
48 MHz |
31 mm |
CMOS |
1.05 V |
Other uPs/uCs/Peripheral ICs |
USB; PCI; I2C |
1 mm |
S-PBGA-B676 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
652 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05,1.5,3.3,5 |
GRID ARRAY |
BGA652,28X28,40 |
BOTTOM |
CMOS |
Other Microprocessor ICs |
1 mm |
S-PBGA-B652 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
652 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05,1.5,3.3,5 |
GRID ARRAY |
BGA652,28X28,40 |
BOTTOM |
CMOS |
Other Microprocessor ICs |
1 mm |
S-PBGA-B652 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
989 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.05,1.5,1.8,3.3,5 |
GRID ARRAY, FINE PITCH |
BGA989(UNSPEC) |
BOTTOM |
2.205 mm |
25 mm |
SEATED HT-CALCULATED |
YES |
16 |
48 MHz |
25 mm |
CMOS |
1.05 V |
Bus Controllers |
USB; PCI; I2C |
.6 mm |
S-PBGA-B989 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
652 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05,1.5,3.3,5 |
GRID ARRAY |
BGA652,28X28,40 |
BOTTOM |
CMOS |
Other Microprocessor ICs |
1 mm |
S-PBGA-B652 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
1071 |
HBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.1 V |
32 |
GRID ARRAY, HEAT SINK/SLUG |
.998 V |
BOTTOM |
2.358 mm |
25 mm |
YES |
32 |
14.318 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
1.05 V |
USB; PCI; I2C; LPC; PS/2 |
.6 mm |
R-PBGA-B1071 |
||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NO |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
PCI; USB; LPC |
S-PBGA-B676 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
GRID ARRAY |
BOTTOM |
2.49 mm |
31 mm |
PITCH_MINI |
NO |
32 |
48 MHz |
31 mm |
CMOS |
1.05 V |
USB; PCI; I2C |
1 mm |
S-PBGA-B676 |
||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
BALL |
421 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
32 |
GRID ARRAY |
1.425 V |
BOTTOM |
2.59 mm |
256 |
31 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
32 |
66 MHz |
31 mm |
CMOS |
1.5 V |
PCI; USB; LPC |
1.27 mm |
S-PBGA-B421 |
1 |
29 |
|||||||||||||||||||||||||||||||||||||||||||
Intel |
CMOS |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
CMOS |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
BALL |
1284 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
PCI; SATA; SMBUS; UART; USB |
S-PBGA-B1284 |
38 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
CMOS |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
652 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05,1.5,3.3,5 |
GRID ARRAY |
BGA652,28X28,40 |
BOTTOM |
CMOS |
Other Microprocessor ICs |
1 mm |
S-PBGA-B652 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
BALL |
689 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
64 |
GRID ARRAY |
1.425 V |
BOTTOM |
256 |
NO |
64 |
48 MHz |
CMOS |
1.5 V |
PCI |
S-PBGA-B689 |
4 |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.