Intel Multi-functional Peripherals 16

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

DW82801HBMSLJ4Y

Intel

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.05,1.5,3.3,5

GRID ARRAY

BGA676,29X29,40

BOTTOM

2.49 mm

31 mm

PITCH_MINI

NO

32

48 MHz

31 mm

CMOS

1.05 V

Other uPs/uCs/Peripheral ICs

USB; PCI; I2C

1 mm

S-PBGA-B676

Not Qualified

NH82801HBMSLB9A

Intel

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.05,1.5,3.3,5

GRID ARRAY

BGA676,29X29,40

BOTTOM

2.49 mm

31 mm

PITCH_MINI

NO

32

48 MHz

31 mm

CMOS

1.05 V

Other uPs/uCs/Peripheral ICs

USB; PCI; I2C

1 mm

S-PBGA-B676

Not Qualified

NH82801GBM

Intel

BALL

652

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05,1.5,3.3,5

GRID ARRAY

BGA652,28X28,40

BOTTOM

CMOS

Other Microprocessor ICs

1 mm

S-PBGA-B652

Not Qualified

NH82801GBM/SL8YB

Intel

BALL

652

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05,1.5,3.3,5

GRID ARRAY

BGA652,28X28,40

BOTTOM

CMOS

Other Microprocessor ICs

1 mm

S-PBGA-B652

Not Qualified

BD82QM67SLJ4M

Intel

BALL

989

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.05,1.5,1.8,3.3,5

GRID ARRAY, FINE PITCH

BGA989(UNSPEC)

BOTTOM

2.205 mm

25 mm

SEATED HT-CALCULATED

YES

16

48 MHz

25 mm

CMOS

1.05 V

Bus Controllers

USB; PCI; I2C

.6 mm

S-PBGA-B989

Not Qualified

NH82801GBSL8FX

Intel

BALL

652

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05,1.5,3.3,5

GRID ARRAY

BGA652,28X28,40

BOTTOM

CMOS

Other Microprocessor ICs

1 mm

S-PBGA-B652

Not Qualified

BD82QM57SLGZQ

Intel

BALL

1071

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.1 V

32

GRID ARRAY, HEAT SINK/SLUG

.998 V

BOTTOM

2.358 mm

25 mm

YES

32

14.318 MHz

NOT SPECIFIED

NOT SPECIFIED

27 mm

CMOS

1.05 V

USB; PCI; I2C; LPC; PS/2

.6 mm

R-PBGA-B1071

AF82801IBM

Intel

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

NO

NOT SPECIFIED

NOT SPECIFIED

CMOS

PCI; USB; LPC

S-PBGA-B676

DW82801HBM

Intel

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

32

GRID ARRAY

BOTTOM

2.49 mm

31 mm

PITCH_MINI

NO

32

48 MHz

31 mm

CMOS

1.05 V

USB; PCI; I2C

1 mm

S-PBGA-B676

FW82801DB

Intel

BALL

421

BGA

SQUARE

PLASTIC/EPOXY

YES

1.575 V

32

GRID ARRAY

1.425 V

BOTTOM

2.59 mm

256

31 mm

ALSO REQUIRES 3.3V SUPPLY

NO

32

66 MHz

31 mm

CMOS

1.5 V

PCI; USB; LPC

1.27 mm

S-PBGA-B421

1

29

FW82801EB

Intel

CMOS

FW82801EBSL73Z

Intel

CMOS

LE3100MICH/SL9PU

Intel

BALL

1284

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

NO

CMOS

PCI; SATA; SMBUS; UART; USB

S-PBGA-B1284

38

NH82801DB

Intel

CMOS

NH82801GB

Intel

BALL

652

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05,1.5,3.3,5

GRID ARRAY

BGA652,28X28,40

BOTTOM

CMOS

Other Microprocessor ICs

1 mm

S-PBGA-B652

Not Qualified

NHE6300ESB

Intel

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

1.575 V

64

GRID ARRAY

1.425 V

BOTTOM

256

NO

64

48 MHz

CMOS

1.5 V

PCI

S-PBGA-B689

4

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.