NXP Semiconductors Multi-functional Peripherals 798

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
LS1027AXE7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
LS1027AXN7PQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
MIMX8MN3CVPIZAA	NXP Semiconductors	SYSTEM ON CHIP																										40	260										3
MIMX8UX5AVLFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	512K	21 mm		YES		24 MHz	40	260	21 mm	CMOS	5000 mA	1.1 V		CAN(3), SAI(4), SPI(4), UART(6)	.8 mm		S-PBGA-B609	3				e2	99
MCIMX6Y2DVK09AB	NXP Semiconductors																											40	260										3
MCIMX6Q7CZK08AE	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
LH75401N0Q100C0,55	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24		FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel	-40 Cel	Tin (Sn)	QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz	40	250	20 mm	CMOS	70 mA	1.8 V	5	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144	3	Not Qualified			e3	76
LS1026ASN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14		GRID ARRAY, FINE PITCH		.87 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14		GRID ARRAY, FINE PITCH		.87 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1026AXN8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1026ASN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046AXN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MCIMX6QP6AVT1AAR	NXP Semiconductors																		TIN SILVER COPPER									40	260										3
LS1026ASE8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1026AXN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14		GRID ARRAY, FINE PITCH		.87 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASE8P1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MCIMX6QP6AVT1ABR	NXP Semiconductors
MCIMX7D5EVM10SC	NXP Semiconductors			BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.045 V				BOTTOM	1.4 mm		19 mm					40	260	19 mm	CMOS		1.1 V			.75 mm		S-PBGA-B541	3
MIMX8DX5CVLFZAC	NXP Semiconductors																		TIN SILVER									40	260										3				e2
LS1026ASE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14		GRID ARRAY, FINE PITCH		.87 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1026AXE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14		GRID ARRAY, FINE PITCH		.87 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14		GRID ARRAY, FINE PITCH		.87 V			TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		.9 V		I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MCIMX6G2DVK05AB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	26		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	95 Cel	0 Cel		BOTTOM	1.23 mm		9 mm		YES	16		40	260	9 mm	CMOS					.5 mm	FIXED POINT	S-PBGA-B272	3		528 rpm	YES
MCIMX6D5EYM10AE	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
MCIMX6G2DVM05AA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V				BOTTOM	1.32 mm		14 mm		YES	16		40	260	14 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B289	3		528 rpm	YES
LS1027AXN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14		GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	262144	17 mm		YES	32		40	260	17 mm	CMOS		1 V	8	I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
MIMX8QX6CVLFZAC	NXP Semiconductors																											40	260										3
XPC107APX100LD	NXP Semiconductors			BALL	503	BGA	SQUARE	PLASTIC/EPOXY		YES	2.625 V			GRID ARRAY		2.375 V			TIN LEAD SILVER	BOTTOM	2.75 mm	256	33 mm		YES		66 MHz			33 mm	CMOS		2.5 V		PCI	1.27 mm		S-PBGA-B503					e0
LH75411N0Q100C0	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24		FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel	-40 Cel	Tin (Sn)	QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz	30	260	20 mm	CMOS	70 mA	1.8 V	5	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144	3	Not Qualified			e3	76
LH75411N0Q100C0,55	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24		FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel	-40 Cel	TIN	QUAD	1.6 mm	32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz			20 mm	CMOS	70 mA	1.8 V	5	CAN, SSP, UART(3)	.5 mm		S-PQFP-G144		Not Qualified			e3	76
MCIMX27LVOP4AR2	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.52 V	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		17 mm	ALSO OPERATES 1.3V AT 266MHZ	YES	32	32 MHz	40	260	17 mm	CMOS		1.45 V			.65 mm	FIXED POINT	S-PBGA-B404	3		400 rpm	YES	e1
MCIMX6G3DVM05AA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V				BOTTOM	1.32 mm		14 mm		YES	16		40	260	14 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B289	3		528 rpm	YES
MCIMX6QP5EVT2AA	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
MCIMX6X3CVO08AC	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
935377775557	NXP Semiconductors																		TIN SILVER									40	260										3				e2
935357872557	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
935311564557	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
935315863557	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
935357856557	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
SCIMX6S5DVM10CC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	26		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel		BOTTOM	1.6 mm	147456	21 mm		YES	32	24 MHz			21 mm	CMOS	1320 mA		4	CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES		14
935323313557	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
935323054557	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
935313356557	NXP Semiconductors																		TIN SILVER COPPER									30	250										3				e1
935332959518	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
935319544557	NXP Semiconductors																		TIN SILVER COPPER									40	260										3				e1
PIMX8MQ6CVAHZAB	NXP Semiconductors																											40	260										3
935378337557	NXP Semiconductors																		TIN SILVER									40	260										3				e2

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.