Multi-functional Peripherals

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Manufacturers
    • Analog Devices
    • Broadcom
    • Cypress Semiconductor
    • Digi International
    • Freescale Semiconductor
    • IXYS Corporation
    • Infineon Technologies
    • Intel
    • M/a-com Technology Solutions
    • Maxim Integrated
    • Microchip Technology
    • Motorola
    • NXP Semiconductors
    • National Semiconductor
    • Nuvoton Technology
    • Onsemi
    • Renesas Electronics
    • Rochester Electronics
    • STMicroelectronics
    • Silicon Labs
    • Teledyne E2v (Uk)
    • Texas Instruments
    • Toshiba
    • Xilinx
    • Xmos
Peripheral IC Type
    • MICROPROCESSOR, RISC
    • MULTIFUNCTION PERIPHERAL
    • SYSTEM ON CHIP
    • SoC
Temperature Grade
    • AUTOMOTIVE
    • COMMERCIAL
    • COMMERCIAL EXTENDED
    • INDUSTRIAL
    • MILITARY
    • OTHER
Terminal Form
    • BALL
    • FLAT
    • GULL WING
    • J BEND
    • NO LEAD
    • PIN/PEG
    • THROUGH-HOLE
    • UNSPECIFIED
No. of Terminals
    • 100
    • 1020
    • 1071
    • 124
    • 128
    • 1284
    • 1313
    • 132
    • 144
    • 1517
    • 16
    • 20
    • 208
    • 21
    • 24
    • 256
    • 272
    • 28
    • 286
    • 289
    • 30
    • 316
    • 32
    • 338
    • 35
    • 36
    • 367
    • 372
    • 373
    • 387
    • 388
    • 40
    • 400
    • 404
    • 416
    • 417
    • 42
    • 421
    • 423
    • 44
    • 448
    • 45
    • 473
    • 48
    • 486
    • 503
    • 515
    • 516
    • 52
    • 529
    • 538
    • 541
    • 548
    • 552
    • 56
    • 569
    • 609
    • 621
    • 624
    • 625
    • 64
    • 652
    • 676
    • 68
    • 689
    • 72
    • 76
    • 760
    • 780
    • 784
    • 8
    • 80
    • 84
    • 989
    • 99
Package Code
    • BGA
    • DIP
    • FBGA
    • FQFP
    • HBGA
    • HQCCN
    • HTFQFP
    • HVQCCN
    • LBGA
    • LFBGA
    • LFQFP
    • LQFP
    • LSOP
    • LSSOP
    • PGA
    • QCCJ
    • QCCN
    • QFF
    • QFP
    • SOP
    • SSOP
    • TFBGA
    • TFQFP
    • TQFP
    • VFBGA
    • VQCCN
    • WQCCJ
Package Shape
    • RECTANGULAR
    • SQUARE
    • UNSPECIFIED
Package Body Material
    • CERAMIC
    • CERAMIC, METAL-SEALED COFIRED
    • PLASTIC/EPOXY
    • UNSPECIFIED
Integrated Cache
    • NO
    • YES
Surface Mount
    • NO
    • YES
Maximum Supply Voltage
    • .9 V
    • .93 V
    • .945 V
    • 1 V
    • 1.03 V
    • 1.05 V
    • 1.08 V
    • 1.1 V
    • 1.11 V
    • 1.15 V
    • 1.155 V
    • 1.164 V
    • 1.2 V
    • 1.26 V
    • 1.3 V
    • 1.32 V
    • 1.365 V
    • 1.4 V
    • 1.4175 V
    • 1.5 V
    • 1.52 V
    • 1.55 V
    • 1.575 V
    • 1.89 V
    • 1.98 V
    • 2.625 V
    • 2.7 V
    • 2.75 V
    • 3.465 V
    • 3.6 V
    • 3.63 V
    • 3.75 V
    • 3.8 V
    • 5.25 V
    • 5.5 V
On Chip Data RAM Width
    • 32
    • 8
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • TS 16949
Address Bus Width
    • 0
    • 13
    • 14
    • 15
    • 16
    • 24
    • 26
    • 27
    • 32
    • 36
    • 4
    • 5
    • 64
DAC Channels
    • NO
    • YES
Bit Size
    • 16
    • 32
    • 64
    • 8
Power Supplies (V)
    • 1.05,1.5,1.8,3.3,5
    • 1.05,1.5,3.3,5
    • 1.3,1.8/3.3
    • 1.8,3.3
    • 1.8/3.3
    • 1.8/5
    • 1.8/5.5
    • 2.4/3.6
    • 2.5,3.3
    • 2.5/5
    • 2.7/5
    • 2/5
    • 3.3
    • 3.3,3.3/5,5
    • 3.3,5
    • 3.3/5
    • 3/3.3,5
    • 3/5
    • 3/5,5
    • 5
Package Style (Meter)
    • CHIP CARRIER
    • CHIP CARRIER, HEAT SINK/SLUG
    • CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
    • CHIP CARRIER, VERY THIN PROFILE
    • CHIP CARRIER, WINDOW
    • FLATPACK
    • FLATPACK, FINE PITCH
    • FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
    • FLATPACK, LOW PROFILE
    • FLATPACK, LOW PROFILE, FINE PITCH
    • FLATPACK, THIN PROFILE
    • FLATPACK, THIN PROFILE, FINE PITCH
    • GRID ARRAY
    • GRID ARRAY, FINE PITCH
    • GRID ARRAY, HEAT SINK/SLUG
    • GRID ARRAY, LOW PROFILE
    • GRID ARRAY, LOW PROFILE, FINE PITCH
    • GRID ARRAY, THIN PROFILE, FINE PITCH
    • GRID ARRAY, VERY THIN PROFILE, FINE PITCH
    • IN-LINE
    • MICROELECTRONIC ASSEMBLY
    • SMALL OUTLINE
    • SMALL OUTLINE, LOW PROFILE
    • SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
    • SMALL OUTLINE, SHRINK PITCH
Package Equivalence Code
    • BGA(UNSPEC)
    • BGA124,13X13,25
    • BGA16,4X4,14
    • BGA16,4X4,16
    • BGA30,5X6,14
    • BGA35,5X7,16
    • BGA367,22X22,25
    • BGA372,24X24,25
    • BGA373,23X23,20
    • BGA388,26X26,40
    • BGA388,26X26,50
    • BGA417,29X29,32
    • BGA448,30X30,30
    • BGA45,9X5,15
    • BGA486,27X27,20
    • BGA516,26X26,50
    • BGA529,23X23,32
    • BGA548,29X29,20
    • BGA609,35X35,32
    • BGA624,25X25,32
    • BGA625,25X25,32
    • BGA652,28X28,40
    • BGA676,29X29,40
    • BGA68,8X9,16
    • BGA72,8X9,20
    • BGA989(UNSPEC)
    • BGA99,9X11,20
    • DIP20,.3
    • DIP28,.3
    • DIP48,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC24,.16SQ,20
    • LCC32,.16SQ,16
    • LCC32,.2SQ,20
    • LCC40,.24SQ,20
    • LCC40,.2X.28,20
    • LCC44,.28SQ,20
    • LCC48,.24SQ,16
    • LCC48,.27SQ,20
    • LCC48,.28SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.32SQ,16
    • LCC68,.3SQ,40
    • LDCC52,.8SQ
    • LDCC68,1.0SQ
    • PGA144,15X15
    • QFL144,1.1SQ,25
    • QFP100,.55X0.79
    • QFP100,.63SQ,20
    • QFP128,.67X.93,20
    • QFP144,.87SQ,20
    • QFP208,1.2SQ,20
    • QFP44,.47SQ,32
    • QFP48,.28SQ,20
    • QFP48,.35SQ,20
    • QFP64(UNSPEC)
    • QFP64,.47SQ,20
    • QFP64,.63SQ,32
    • QFP80,.64SQ
    • SOP16,.25
    • SOP20,.4
    • SOP28,.4
    • SOP8,.25
    • SSOP20,.3
    • SSOP28,.3
    • SSOP48,.4
    • SSOP56,.4
    • TQFP100,.63SQ
    • TQFP128,.63SQ,16
    • TQFP44,.47SQ,32
Minimum Supply Voltage
    • .805 V
    • .855 V
    • .87 V
    • .9 V
    • .95 V
    • .97 V
    • .998 V
    • 1 V
    • 1.02 V
    • 1.045 V
    • 1.05 V
    • 1.08 V
    • 1.096 V
    • 1.11 V
    • 1.14 V
    • 1.15 V
    • 1.2 V
    • 1.235 V
    • 1.25 V
    • 1.275 V
    • 1.2825 V
    • 1.3 V
    • 1.35 V
    • 1.38 V
    • 1.425 V
    • 1.7 V
    • 1.71 V
    • 1.8 V
    • 2.1 V
    • 2.25 V
    • 2.375 V
    • 2.4 V
    • 2.45 V
    • 2.7 V
    • 2.97 V
    • 3 V
    • 3.135 V
    • 3.15 V
    • 4.5 V
    • 4.75 V
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 115 Cel
    • 125 Cel
    • 45 Cel
    • 70 Cel
    • 85 Cel
    • 90 Cel
    • 95 Cel
CPU Family
    • 8051
    • CORTEX-M0
    • M8C
No. of External Interrupts
    • 8
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -30 Cel
    • -40 Cel
    • -55 Cel
    • 0 Cel
    • 5 Cel
Terminal Finish
    • MATTE TIN
    • Matte Tin (Sn)
    • NICKEL PALLADIUM GOLD
    • NICKEL PALLADIUM GOLD SILVER
    • Nickel/Palladium/Gold (Ni/Pd/Au)
    • PURE TIN
    • TIN
    • TIN LEAD
    • TIN LEAD SILVER
    • TIN SILVER
    • TIN SILVER BISMUTH
    • TIN SILVER COPPER
    • TIN SILVER COPPER NICKEL
    • Tin (Sn)
    • Tin/Bismuth (Sn/Bi)
    • Tin/Lead (Sn/Pb)
    • Tin/Silver (Sn/Ag)
    • Tin/Silver/Copper (Sn/Ag/Cu)
ADC Channels
    • NO
    • YES
Ultraviolet Erasable
    • N
    • Y
Terminal Position
    • BOTTOM
    • DUAL
    • PERPENDICULAR
    • QUAD
    • UNSPECIFIED
DMA Channels
    • NO
Maximum Seated Height
    • .33 mm
    • .4 mm
    • .41 mm
    • .42 mm
    • .482 mm
    • .55 mm
    • .6 mm
    • .8 mm
    • .9 mm
    • 1 mm
    • 1.2 mm
    • 1.23 mm
    • 1.25 mm
    • 1.298 mm
    • 1.32 mm
    • 1.4 mm
    • 1.45 mm
    • 1.481 mm
    • 1.52 mm
    • 1.54 mm
    • 1.56 mm
    • 1.6 mm
    • 1.63 mm
    • 1.7 mm
    • 1.72 mm
    • 1.721 mm
    • 1.727 mm
    • 1.85 mm
    • 2 mm
    • 2.16 mm
    • 2.18 mm
    • 2.205 mm
    • 2.358 mm
    • 2.38 mm
    • 2.46 mm
    • 2.48 mm
    • 2.49 mm
    • 2.52 mm
    • 2.59 mm
    • 2.61 mm
    • 2.65 mm
    • 2.667 mm
    • 2.67 mm
    • 2.73 mm
    • 2.75 mm
    • 2.794 mm
    • 2.82 mm
    • 2.93 mm
    • 2.96 mm
    • 3.15 mm
    • 3.21 mm
    • 3.3 mm
    • 3.4 mm
    • 3.62 mm
    • 4.064 mm
    • 4.1 mm
    • 4.45 mm
    • 4.57 mm
    • 4.572 mm
    • 4.8 mm
    • 4.82 mm
    • 4.826 mm
    • 5.08 mm
    • 5.588 mm
ROM Words
    • 16384
    • 2048
    • 32768
    • 4096
    • 65536
    • 8192
    • 81920
RAM Words
    • 1024
    • 128
    • 128M
    • 139264
    • 147456
    • 16384
    • 16K
    • 1K
    • 1M
    • 2.5M
    • 2048
    • 229376
    • 256
    • 256K
    • 262144
    • 288K
    • 2K
    • 32768
    • 32K
    • 4096
    • 4K
    • 512
    • 512K
    • 524288
    • 64K
    • 65536
    • 6M
    • 73728
    • 8192
    • 81920
    • 888832
    • 8K
    • 98304
Width
    • 1.452 mm
    • 1.472 mm
    • 1.849 mm
    • 1.975 mm
    • 1.986 mm
    • 10 mm
    • 12 mm
    • 13 mm
    • 14 mm
    • 15 mm
    • 15.24 mm
    • 16 mm
    • 17 mm
    • 19 mm
    • 19.1262 mm
    • 2.097 mm
    • 2.1 mm
    • 2.2 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24.105 mm
    • 24.18 mm
    • 24.1808 mm
    • 25 mm
    • 27 mm
    • 28 mm
    • 29 mm
    • 29.3116 mm
    • 3 mm
    • 3.52 mm
    • 3.87 mm
    • 3.89 mm
    • 3.898 mm
    • 3.8985 mm
    • 31 mm
    • 33 mm
    • 35 mm
    • 36 mm
    • 36.802 mm
    • 4 mm
    • 4.25 mm
    • 4.87 mm
    • 4.907 mm
    • 40 mm
    • 5 mm
    • 5.192 mm
    • 5.3 mm
    • 6 mm
    • 7 mm
    • 7.5 mm
    • 7.505 mm
    • 7.5057 mm
    • 7.6 mm
    • 7.62 mm
    • 7.8 mm
    • 8 mm
    • 8.3 mm
    • 9 mm
Data EEPROM Size
    • 0
Additional Features
    • -40 TO 100 OPERATING CASE TEMPERATURE
    • -40 TO 115 C OPERATING CASE TEMPERATURE
    • -40 TO 115 OPERATING CASE TEMPERATURE
    • 0 TO 100 OPERATING CASE TEMPERATURE
    • 0.9 V NOMINAL ALSO AVAILABLE @800MHZ
    • 0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE
    • 128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
    • 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O
    • 24MHZ NOM CRYSTAL FREQ AVAILABLE
    • 24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE
    • 32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 37.4 MHZ CRYSTAL FREQUENCY AVAILABLE
    • 64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • ALSO OPERATES 1.3V AT 266MHZ
    • ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US
    • ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE
    • ALSO OPERATES AT 2.7V AND 3.3V SUPPLY
    • ALSO OPERATES AT 2.7V AND 3V SUPPLY
    • ALSO OPERATES AT 3V MINIMUM SUPPLY
    • ALSO OPERATES AT 3V SUPPLY
    • ALSO OPERATES AT 3V WITH 93KHZ
    • ALSO OPERATES AT 750 KHZ WITH 2.4 V
    • ALSO REQUIRES 3.3 V I/O SUPPLY
    • ALSO REQUIRES 3.3 V SUPPLY
    • ALSO REQUIRES 3.3V SUPPLY
    • IT ALSO OPERATES 93KHZ AT 3 V
    • IT ALSO OPERATES AT 2.4V AT 93KHZ
    • IT ALSO OPERATES AT 3 V MINIMUM SUPPLY
    • IT ALSO OPERATES AT 3V AT 93KHZ
    • IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ
    • IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY
    • ITS ALSO HAVING 576KB SRAM FOR THE WIRELESS LAN SUBSYSTEM
    • MULTIPROTOCOL PARALLEL PORT TYPE
    • OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED
    • PITCH_MINI
    • SEATED HGT-CALCULATED
    • SEATED HGT-NOM
    • SEATED HT-CALCULATED
    • lsio contains 8 GPIO lines
Boundary Scan
    • NO
    • YES
Peripherals
    • BROWN-OUT DETECT, COMPARATOR(2), POR, TIMER(5), WDT
    • TIMER, WDT
External Data Bus Width
    • 0
    • 128
    • 16
    • 32
    • 4
    • 64
    • 8
Maximum Clock Frequency
    • .032768 MHz
    • 10 MHz
    • 100 MHz
    • 12 MHz
    • 12.06 MHz
    • 12.6 MHz
    • 1200 MHz
    • 133.333 MHz
    • 14.318 MHz
    • 14.31818 MHz
    • 1400 MHz
    • 16 MHz
    • 20 MHz
    • 22 MHz
    • 24 MHz
    • 24.24 MHz
    • 24.6 MHz
    • 25 MHz
    • 25.2 MHz
    • 26 MHz
    • 27 MHz
    • 30 MHz
    • 32 MHz
    • 33 MHz
    • 33.33 MHz
    • 34.48 MHz
    • 35 MHz
    • 36 MHz
    • 38.4 MHz
    • 4 MHz
    • 40 MHz
    • 48 MHz
    • 5 MHz
    • 50 MHz
    • 52 MHz
    • 650 MHz
    • 66 MHz
    • 67 MHz
    • 75 MHz
    • 8 MHz
    • 80 MHz
    • 83.33 MHz
    • 900 MHz
Maximum Time At Peak Reflow Temperature (s)
    • 20
    • 30
    • 40
    • NOT SPECIFIED
Peak Reflow Temperature (C)
    • 220
    • 245
    • 250
    • 260
    • NOT SPECIFIED
Length
    • 1.559 mm
    • 1.579 mm
    • 10 mm
    • 10.2 mm
    • 12 mm
    • 12.8 mm
    • 12.8265 mm
    • 13 mm
    • 14 mm
    • 15 mm
    • 15.875 mm
    • 16 mm
    • 17 mm
    • 17.905 mm
    • 18.415 mm
    • 19 mm
    • 19.1262 mm
    • 2.309 mm
    • 2.32 mm
    • 2.582 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24.105 mm
    • 24.18 mm
    • 24.1808 mm
    • 25 mm
    • 25.527 mm
    • 27 mm
    • 28 mm
    • 29 mm
    • 29.3116 mm
    • 3 mm
    • 3.23 mm
    • 3.68 mm
    • 3.691 mm
    • 3.91 mm
    • 31 mm
    • 33 mm
    • 34.67 mm
    • 35 mm
    • 36 mm
    • 36.802 mm
    • 4 mm
    • 4.04 mm
    • 4.889 mm
    • 4.978 mm
    • 4.98 mm
    • 40 mm
    • 5 mm
    • 5.413 mm
    • 5.848 mm
    • 5.94 mm
    • 6 mm
    • 60.96 mm
    • 61.04 mm
    • 62.1 mm
    • 62.103 mm
    • 7 mm
    • 7.2 mm
    • 8 mm
    • 8.3 mm
    • 9 mm
    • 9.779 mm
    • 9.891 mm
    • 9.893 mm
ROM Bits Size
    • 1024 Bits
    • 1048576 Bits
    • 131072 Bits
    • 2097152 Bits
    • 256 Bits
    • 262144 Bits
    • 32768 Bits
    • 4096 Bits
    • 512 Bits
    • 524288 Bits
    • 65536 Bits
    • 8192 Bits
No. of Timers
    • 5
RAM Bytes
    • 1024
    • 2048
    • 256
    • 262144
    • 4096
    • 512
    • 8192
Technology
    • CHMOS
    • CMOS
    • HCMOS
    • MOS
    • NMOS
Analog To Digital Convertors
    • 1-Ch 12-Bit
Maximum Supply Current
    • .008 mA
    • .01 mA
    • .0255 mA
    • 1 mA
    • 12 mA
    • 1200 mA
    • 13.8 mA
    • 1320 mA
    • 14 mA
    • 14.5 mA
    • 1400 mA
    • 15 mA
    • 1500 mA
    • 18.5 mA
    • 180 mA
    • 2 mA
    • 2.5 mA
    • 200 mA
    • 2200 mA
    • 25 mA
    • 27 mA
    • 3.5 mA
    • 35 mA
    • 4 mA
    • 4.5 mA
    • 50 mA
    • 5000 mA
    • 6 mA
    • 6.85 mA
    • 7.2 mA
    • 70 mA
    • 78 mA
    • 8 mA
Nominal Supply Voltage
    • .85 V
    • .9 V
    • .95 V
    • 1 V
    • 1.05 V
    • 1.06 V
    • 1.1 V
    • 1.13 V
    • 1.15 V
    • 1.2 V
    • 1.25 V
    • 1.3 V
    • 1.35 V
    • 1.4 V
    • 1.45 V
    • 1.5 V
    • 1.8 V
    • 2.5 V
    • 2.7 V
    • 3 V
    • 3.3 V
    • 3.45 V
    • 4.75 V
    • 5 V
No. of DMA Channels
    • 1
PWM Channels
    • YES
No. of Serial I/Os
    • 0
    • 1
    • 11
    • 13
    • 16
    • 2
    • 3
    • 4
    • 5
    • 7
    • 8
Sub-Category
    • Bus Controllers
    • Digital Signal Processors
    • Microcontrollers
    • Microprocessors
    • Multifunction Peripherals
    • Other Microprocessor ICs
    • Other uPs/uCs/Peripheral ICs
Connectivity
    • I2C(2), SPI(2), UART(2)
ROM Programmability
    • FLASH
Bus Compatibility
    • 68000
    • 680X0; 88XXX; 80X86; SPARC; R4000; AXP
    • 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340
    • 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8
    • 80386
    • 8042; IBM PC-XT; IBM PC-AT; IRDA; PCI; SMBUS
    • 8051; CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • CAN(2), I2C(2), QSPI, SPI(4), UART(3)
    • CAN(3), SAI(4), SPI(4), UART(6)
    • CAN, I2C, I2S, SPI, SSP, UART USB
    • CAN, SSP, UART(3)
    • CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB
    • CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; I2S; IRDA; RS-485; RS-232; SPI; UART; USB
    • CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; SPI; UART; USB
    • CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • CAN; I2C; IRDA; PCI; SPI; UART; USB
    • ETHERNET, I2C, I2S, PCI, SPI, UART, USB
    • ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB
    • ETHERNET; I2C; PCI; SPI; UART; USB
    • I2C
    • I2C, I2S, IDE, SPI, UART
    • I2C, I2S, IRDA, SPI, UART, USART
    • I2C, I2S, SPI, UART
    • I2C, IDE, ISA, PCI, USB, VGA
    • I2C, IRDA, SPI, UART, USB
    • I2C, PCI, SPI, UART, USB
    • I2C, SAI, SPI, UART
    • I2C, SPI, UART
    • I2C, USB
    • I2C; I2S, LIN; PS/2; SPI, USB
    • I2C; I2S; IDE; IRDA; LIN; SPI; UART
    • I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS
    • I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS
    • I2C; I2S; SPI; UART
    • I2C; I2S; SPI; UART; IRDA; LIN; IDE
    • I2C; I2S; UART; SPI; USB; ETHERNET
    • I2C; IDE; IRDA; LIN; SPI; UART
    • I2C; IRDA; LIN; SPI; UART
    • I2C; IRDA; LIN; SPI; UART; USB
    • I2C; IRDA; PCI; PS/2; SMBUS; SPI; UART
    • I2C; SPI; UART
    • I2C; SPI; UART; IRDA; IDE; CAN; LIN
    • I2C; SPI; UART; IRDA; IDE; LIN
    • I2C; SPI; UART; LPC; LIN; IRDA; IDE
    • I2C; SPI; UART; USB
    • I2C; USB
    • I2C; USB; LPC
    • I2C; USB; PS/2
    • I2C; USB; PS/2; 8051
    • IRDA, PC-AT, PC-XT, PS/2, PCI
    • LPC
    • MC68000
    • PC-AT; ISA; PS/2
    • PCI
    • PCI; I2C; 60X PROCESSOR
    • PCI; ISA
    • PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2
    • PCI; RC32364; RC32134
    • PCI; SATA; SMBUS; UART; USB
    • PCI; USB; LPC
    • SPI, UART
    • SPI, USB
    • TX3922; ISA; PCMCIA; USB
    • USB
    • USB; PCI; I2C
    • USB; PCI; I2C; LPC; PS/2
    • USB; PCI; ISA
    • USB; PCI; ISA; PCMCIA
    • VR4100
    • Z84C00
Terminal Pitch
    • .35 mm
    • .37 mm
    • .38 mm
    • .4 mm
    • .5 mm
    • .6 mm
    • .635 mm
    • .65 mm
    • .75 mm
    • .76 mm
    • .8 mm
    • 1 mm
    • 1.27 mm
    • 2.54 mm
Format
    • FIXED POINT
    • FLOATING POINT
JESD-30 Code
    • R-CDIP-T48
    • R-PBGA-B1071
    • R-PBGA-B16
    • R-PBGA-B286
    • R-PBGA-B30
    • R-PBGA-B316
    • R-PBGA-B35
    • R-PBGA-B45
    • R-PBGA-B68
    • R-PBGA-B72
    • R-PBGA-B76
    • R-PBGA-B99
    • R-PDIP-T20
    • R-PDIP-T28
    • R-PDIP-T48
    • R-PDIP-T8
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G48
    • R-PDSO-G56
    • R-PDSO-G8
    • R-PQFP-G100
    • R-PQFP-G128
    • R-XQCC-N40
    • S-CPGA-P132
    • S-CQCC-J68
    • S-CQFP-F256
    • S-PBGA-B1020
    • S-PBGA-B124
    • S-PBGA-B1284
    • S-PBGA-B1313
    • S-PBGA-B1517
    • S-PBGA-B16
    • S-PBGA-B272
    • S-PBGA-B289
    • S-PBGA-B338
    • S-PBGA-B367
    • S-PBGA-B372
    • S-PBGA-B373
    • S-PBGA-B387
    • S-PBGA-B388
    • S-PBGA-B400
    • S-PBGA-B404
    • S-PBGA-B416
    • S-PBGA-B417
    • S-PBGA-B421
    • S-PBGA-B423
    • S-PBGA-B448
    • S-PBGA-B473
    • S-PBGA-B486
    • S-PBGA-B503
    • S-PBGA-B515
    • S-PBGA-B516
    • S-PBGA-B529
    • S-PBGA-B538
    • S-PBGA-B541
    • S-PBGA-B548
    • S-PBGA-B552
    • S-PBGA-B569
    • S-PBGA-B609
    • S-PBGA-B621
    • S-PBGA-B624
    • S-PBGA-B625
    • S-PBGA-B652
    • S-PBGA-B676
    • S-PBGA-B689
    • S-PBGA-B760
    • S-PBGA-B780
    • S-PBGA-B784
    • S-PBGA-B989
    • S-PDSO-G48
    • S-PQCC-J52
    • S-PQCC-J68
    • S-PQCC-J84
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N42
    • S-PQCC-N64
    • S-PQFP-G100
    • S-PQFP-G128
    • S-PQFP-G144
    • S-PQFP-G208
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XPGA-P144
    • S-XQCC-N16
    • S-XQCC-N24
    • S-XQCC-N32
    • S-XQCC-N36
    • S-XQCC-N40
    • S-XQCC-N44
    • S-XQCC-N48
    • S-XQCC-N56
    • S-XQCC-N68
    • S-XQFP-F144
    • S-XXMA-N21
Moisture Sensitivity Level (MSL)
    • 1
    • 2A
    • 3
    • 4
Qualification
    • Not Qualified
Speed
    • 100 rpm
    • 1000 rpm
    • 1176 rpm
    • 12 rpm
    • 12.6 rpm
    • 1200 rpm
    • 133 rpm
    • 1500 rpm
    • 1800 rpm
    • 24 rpm
    • 24.6 rpm
    • 24.96 rpm
    • 25.2 rpm
    • 300 rpm
    • 400 rpm
    • 454 rpm
    • 48 rpm
    • 500 rpm
    • 528 rpm
    • 60 rpm
    • 600 rpm
    • 650 rpm
    • 66 rpm
    • 67 rpm
    • 696 rpm
    • 720 rpm
    • 75 rpm
    • 750 rpm
    • 80 rpm
    • 800 rpm
    • 90 rpm
Low Power Mode
    • YES
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Standby Current
    • .000005 Amp
    • .00002 Amp
On Chip Program ROM Width
    • 8
No. of I/O Lines
    • 0
    • 1
    • 12
    • 126
    • 13
    • 136
    • 14
    • 16
    • 160
    • 17
    • 18
    • 186
    • 188
    • 19
    • 20
    • 21
    • 212
    • 215
    • 24
    • 247
    • 25
    • 27
    • 28
    • 29
    • 30
    • 31
    • 32
    • 33
    • 34
    • 36
    • 37
    • 38
    • 4
    • 40
    • 44
    • 45
    • 46
    • 48
    • 49
    • 5
    • 50
    • 51
    • 53
    • 54
    • 55
    • 57
    • 6
    • 62
    • 64
    • 68
    • 70
    • 72
    • 75
    • 76
    • 8
    • 98
    • 99
Maximum Access Time
    • .00000007 ns
    • .00000009 ns
    • .00000015 ns
Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C5467LTI-LP003

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

BGA99,9X11,20

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

16384

8 mm

YES

33 MHz

30

260

8 mm

1048576 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CC1111F32RSP

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

85 Cel

8051

0 Cel

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

4096

CMOS

.5 mm

S-PQCC-N36

3

Not Qualified

e4

21

CC3235SF12RGKR

Texas Instruments

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.1 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

256K

9 mm

YES

TIMER, WDT

0

30

260

9 mm

262144

CMOS

3.3 V

I2C, I2S, SPI, UART

.5 mm

S-PQCC-N64

3

e4

27

CY8C5866AXI-LP021

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

QUAD

1.6 mm

8192

14 mm

YES

33 MHz

30

260

14 mm

524288 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e3

72

MIMX8MD6CVAHZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, FINE PITCH

.9 V

105 Cel

-40 Cel

BOTTOM

2.18 mm

81920

17 mm

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

40 MHz

40

260

17 mm

CMOS

1 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.65 mm

S-PBGA-B621

3

16

MIMX8MQ5CVAHZAA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, FINE PITCH

.9 V

105 Cel

-40 Cel

BOTTOM

2.18 mm

81920

17 mm

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

40 MHz

260

17 mm

CMOS

1 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.65 mm

S-PBGA-B621

3

16

CY8C4124PVI-432T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.71 V

85 Cel

-40 Cel

DUAL

2 mm

2048

5.3 mm

NO

0

24 MHz

NOT SPECIFIED

NOT SPECIFIED

10.2 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.65 mm

R-PDSO-G28

Not Qualified

24

MIMX8ML6DVNLZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.95 V

95 Cel

0 Cel

BOTTOM

1.481 mm

888832

15 mm

YES

0

24 MHz

40

260

15 mm

CMOS

2200 mA

1 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

136

CY8C4247AZS-M485T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C27443-24SXIT

Infineon Technologies

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE

SOP28,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.67 mm

16384

256

7.505 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

20

260

17.905 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

1.27 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

24

MIMX8MN6CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP

TIN SILVER

40

260

3

e2

MIMX8ML3DVNLZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.95 V

95 Cel

0 Cel

BOTTOM

1.481 mm

888832

15 mm

YES

0

24 MHz

40

260

15 mm

CMOS

2200 mA

1 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

136

MIMX8MN5CVPIZAA

NXP Semiconductors

SYSTEM ON CHIP

40

260

3

MIMX8MN1CVPIZAA

NXP Semiconductors

SYSTEM ON CHIP

Tin/Bismuth (Sn/Bi)

40

260

3

e6

LS1046AXN8T1A

NXP Semiconductors

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

14

GRID ARRAY, FINE PITCH

.97 V

BOTTOM

2.61 mm

23 mm

YES

64

30

250

23 mm

CMOS

1 V

I2C, PCI, SPI, UART, USB

.8 mm

S-PBGA-B780

3

76

CY8C5867LTI-LP025

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

32K

8 mm

YES

33 MHz

30

260

8 mm

1048576 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

46

MIMX8QM5AVUFFAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

AUTOMOTIVE

BALL

1313

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

0

GRID ARRAY, FINE PITCH

1.05 V

125 Cel

-40 Cel

BOTTOM

2.52 mm

524288

29 mm

lsio contains 8 GPIO lines

YES

0

24 MHz

40

260

29 mm

CMOS

5000 mA

1.1 V

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.75 mm

S-PBGA-B1313

3

1

CY8C27243-24PVXIT

Infineon Technologies

MULTIFUNCTION PERIPHERAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

4.75 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

256

5.3 mm

NO

24.6 MHz

30

260

7.2 mm

CMOS

.008 mA

5 V

I2C, USB

.65 mm

R-PDSO-G20

3

e4

16

CY8C5888FNI-LP210T

Infineon Technologies

INDUSTRIAL

BALL

99

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.6 mm

32768

5.192 mm

YES

0

33 MHz

5.94 mm

CMOS

3.3 V

I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS

.5 mm

R-PBGA-B99

1

e4

62

MIMX8MM2CVTKZAA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

486

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA486,27X27,20

.9 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

1.25 mm

288K

14 mm

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

40

260

14 mm

CMOS

.95 V

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

.5 mm

S-PBGA-B486

3

e2

16

CY8C27443-24SXI

Infineon Technologies

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE

SOP28,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.67 mm

16384

256

7.505 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

20

260

17.905 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

1.27 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

24

CY8C4024AZI-S413T

Infineon Technologies

PURE TIN

3

CY8C4247AZI-L485

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

8192

10 mm

NO

48 MHz

10 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.5 mm

S-PQFP-G64

3

53

MCIMX6Q5EYM10ACR

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

BALL

624

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

16

GRID ARRAY, HEAT SINK/SLUG

1.35 V

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

YES

64

40

260

21 mm

CMOS

1.4 V

.8 mm

FIXED POINT

S-PBGA-B624

3

1000 rpm

YES

e1

CY8C4124LQI-443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

40

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC40,.24SQ,20

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

2048

6 mm

NO

0

24 MHz

6 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.5 mm

S-XQCC-N40

3

Not Qualified

e4

34

LS1046AXE8T1A

NXP Semiconductors

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

14

GRID ARRAY, FINE PITCH

.97 V

TIN SILVER COPPER

BOTTOM

2.61 mm

23 mm

YES

64

30

250

23 mm

CMOS

1 V

I2C, PCI, SPI, UART, USB

.8 mm

S-PBGA-B780

3

e1

76

CY8C29866-24AXI

Infineon Technologies

INDUSTRIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.2 mm

32768

1024

14 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

40

260

14 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

.5 mm

S-PQFP-G100

3

Not Qualified

24 rpm

e4

64

CY8C4014SXI-421

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

16

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, LOW PROFILE

SOP16,.25

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

1.721 mm

1024

3.898 mm

NO

16 MHz

30

260

9.893 mm

CMOS

4.5 mA

3.3 V

I2C

1.27 mm

R-PDSO-G16

3

e4

13

MCIMX257CJM4AR2

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.52 V

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.38 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

17 mm

ALSO REQUIRES 3.3 V I/O SUPPLY

YES

16

24 MHz

40

260

17 mm

CMOS

1.45 V

.8 mm

FIXED POINT

S-PBGA-B400

3

400 rpm

YES

e1

CY8C4248LQI-BL583T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C24223A-24PXI

Cypress Semiconductor

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

0

8

2.7/5

IN-LINE

DIP20,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

4.826 mm

4096

256

7.62 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

40

260

25.527 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

2.54 mm

R-PDIP-T20

1

Not Qualified

24 rpm

e4

16

CY8C3866LTI-068

Infineon Technologies

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

4096

7 mm

YES

0

67 MHz

20

260

7 mm

65536 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

.5 mm

S-XQCC-N48

3

Not Qualified

e4

31

CY8C4014LQI-421

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

16

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC16,.12SQ,20

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

.6 mm

1024

3 mm

NO

16 MHz

30

260

3 mm

CMOS

4.5 mA

3.3 V

I2C

.5 mm

S-XQCC-N16

3

e4

12

CY8C5668AXI-LP034

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

33 MHz

30

260

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e3

72

MCIMX6Q5EYM12AC

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

26

64

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

YES

64

24 MHz

40

260

21 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B624

3

1200 rpm

YES

e1

CY8C4014LQI-422T

Infineon Technologies

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

1024

4 mm

NO

0

16 MHz

30

260

4 mm

CMOS

3.3 V

I2C

.5 mm

S-XQCC-N24

3

e4

20

CY8C4013SXI-410

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

8

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, LOW PROFILE

SOP8,.25

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.727 mm

1024

3.89 mm

NO

16 MHz

30

260

4.889 mm

CMOS

4.5 mA

3.3 V

I2C

1.27 mm

R-PDSO-G8

3

e4

5

CY8C28452-24PVXI

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

16384

1024

5.3 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY

NO

0

24 MHz

20

260

10.2 mm

1024

CMOS

14 mA

5 V

Microcontrollers

FLASH

I2C, IRDA, SPI, UART, USB

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

24

CY8C5667AXI-LP040

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

QUAD

1.6 mm

16384

14 mm

YES

33 MHz

40

260

14 mm

1048576 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e3

72

CY8C4247LTI-M475

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

8 mm

NO

48 MHz

8 mm

CMOS

13.8 mA

11

I2C; SPI; UART; IRDA; IDE; LIN

.4 mm

S-XQCC-N68

3

Not Qualified

e4

55

CY8C6347FMI-BLD53T

Infineon Technologies

TIN SILVER COPPER

1

e1

Z84C9008VSG

IXYS Corporation

COMMERCIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

4

CHIP CARRIER

4.5 V

70 Cel

0 Cel

Matte Tin (Sn)

QUAD

4.57 mm

29.3116 mm

NO

8

8 MHz

40

260

29.3116 mm

CMOS

5 V

Z84C00

1.27 mm

S-PQCC-J84

Not Qualified

e3

24

CY8C6247BZI-D54T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C4014LQI-421T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C4125LQI-483T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

EFR32FG23A010F512GM48-B

Silicon Labs

SYSTEM ON CHIP

EFR32FG23A020F512GM40-B

Silicon Labs

SYSTEM ON CHIP

EFR32FG23A020F512GM48-B

Silicon Labs

SYSTEM ON CHIP

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.