484 Other Function uPs,uCs & Peripheral ICs 149

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XC7Z020-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z020-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z020-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z020-L1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z030-3FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	23 mm				23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XA7Z020-1CLG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN SILVER COPPER	N	BOTTOM	1.6 mm	19 mm		30	260	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e1
XC7Z030-2FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	23 mm				23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z030-2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm				23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XCZU2CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B484	4		e1
XC7Z020-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z020-3CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS250TFCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z030-1FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm				23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z014S-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XCZU2CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B484	4		e1
XCZU3CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B484	4		e1
XC7Z014S-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XCZU3EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM							CMOS	.85 V			R-PBGA-B484	4		e1
XCZU2EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							CMOS	.85 V			R-PBGA-B484	4		e1
MPFS250T-1FCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS250TS-1FCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z030-1FBG484C	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	23 mm				23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XCZU3EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							CMOS	.85 V			R-PBGA-B484	4		e1
XC7Z014S-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z014S-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel			BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS025T-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XCZU3CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B484	4		e1
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY			125 Cel	-40 Cel			BOTTOM							CMOS				S-PBGA-B484
MPFS250TFCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS095TLS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
A2F200M3F-FG484	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V			GRID ARRAY		1.425 V	85 Cel	0 Cel	TIN LEAD		BOTTOM							CMOS	1.5 V			S-PBGA-B484	3
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm				23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XCZU2CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B484	4		e1
XCZU2EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM							CMOS	.85 V			R-PBGA-B484	4		e1
A2F200M3F-1FG484I	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V			GRID ARRAY		1.425 V	100 Cel	-40 Cel	TIN LEAD		BOTTOM							CMOS	1.5 V			S-PBGA-B484	3
MPFS025T-1FCVG484E	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS025T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS095T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS160T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS160TS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XCZU3CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B484	4		e1
XCZU3CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B484	4		e1
10AS016C4U19I3LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	-40 Cel			BOTTOM	3.25 mm	19 mm				19 mm	TSMC	.9 V		.8 mm	S-PBGA-B484
XCZU2EG-L1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				CMOS	.72 V			R-PBGA-B484	4		e1
XCZU3EG-2SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm	19 mm				19 mm	CMOS	.85 V		.8 mm	R-PBGA-B484	4		e1
10AS016C3U19E2LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	0 Cel			BOTTOM	3.25 mm	19 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			19 mm	TSMC	.9 V		.8 mm	S-PBGA-B484
XQ7Z020-1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XQ7Z020-1CL484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.