484 Other Function uPs,uCs & Peripheral ICs 149

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XQZU3EG-1SFRA484M	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.35 mm	19 mm	40	245	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	4		e0
XCZU2CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm	30	250	19 mm	CMOS	.85 V		.8 mm	R-PBGA-B484	4		e1
M82710-14	Mindspeed Technologies	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES				GRID ARRAY			110 Cel	-25 Cel			BOTTOM						CMOS				R-PBGA-B484
XAM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
XAM62A74AUMHIAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
XAM62A34ASMHIAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
XAM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AVMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A32AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AUMSIAMBRQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AUMHAAMBR	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A32AMLSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AUMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A34ASMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A31AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel			BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
XCVE2002-2HSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY		.854 V	110 Cel	-40 Cel			BOTTOM						CMOS	.88 V			S-PBGA-B484
XCVE2102-2HSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY		.854 V	110 Cel	-40 Cel			BOTTOM						CMOS	.88 V			S-PBGA-B484
XCVE2102-2LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2102-2MSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2102-1MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel	0 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2102-2LLESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2002-1LLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2002-1MLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2102-1LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	100 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2002-1MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel	0 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2002-2MLESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2102-2MLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2002-1MSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2002-2LLESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2002-2MLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2002-1LSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2002-2MSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2002-1LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	100 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2002-2MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2102-1LSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2102-1MSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2102-1MLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2102-1LLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2102-2MLESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2102-2MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B484
XCVE2002-2LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2102-2LLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVE2002-2LLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XQ7Z030-2RB484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA484,22X22,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.35 mm	23 mm	30	225	23 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B484	4	Not Qualified	e0
XQ7Z030-L2RB484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	TIN LEAD		BOTTOM	3.35 mm	23 mm	30	225	23 mm	CMOS			1 mm	S-PBGA-B484	4		e0
XQ7Z020-2CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm	30	225	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.