484 Other Function uPs,uCs & Peripheral ICs 149

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XQ7Z020-L1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, LOW PROFILE, FINE PITCH			100 Cel	-40 Cel	TIN LEAD		BOTTOM	1.6 mm	19 mm			30	225	19 mm	CMOS				.8 mm	S-PBGA-B484	3		e0
XQ7Z030-1RB484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA484,22X22,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.35 mm	23 mm			30	225	23 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified	e0
XQZU3EG-2SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.35 mm	19 mm			40	245	19 mm	CMOS	.85 V			.8 mm	S-PBGA-B484	4		e0
XQ7Z030-1RB484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA484,22X22,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.35 mm	23 mm			30	225	23 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified	e0
XQZU3EG-1SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.35 mm	19 mm			40	245	19 mm	CMOS	.85 V			.8 mm	S-PBGA-B484	4		e0
XQZU3EG-L1SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.35 mm	19 mm			40	245	19 mm	CMOS	.85 V			.8 mm	S-PBGA-B484	4		e0
XCZU9CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU2CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	250		CMOS	.85 V				R-PBGA-B484	4		e1
XAZU3EG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V			.8 mm	S-PBGA-B484	3		e1
XCZU2CG-L2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V				R-PBGA-B484	4		e1
XCZU2CG-1LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4		e1
XCZU2CG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4		e1
XCZU3CG-L2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V				R-PBGA-B484	4		e1
XCZU6CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.698 V	100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				19 mm	CMOS	.72 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU3EG-1LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4		e1
XCZU9CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	0 Cel			BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU6CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU2CG-2LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm		0			19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484
XC7Z030-1FB484I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm					23 mm	CMOS	1 V			1 mm	S-PBGA-B484
XA7Z030-1FBG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY	BGA484,22X22,40		125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	N	BOTTOM	2.54 mm	23 mm			30	250	23 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified	e1
XCZU9CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	0 Cel			BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XC7Z030-2FBG484C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	85 Cel	0 Cel			BOTTOM	2.54 mm	23 mm					23 mm	CMOS	1 V			1 mm	S-PBGA-B484
XCZU9CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.698 V	100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				19 mm	CMOS	.72 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XA7Z020-1CLG484I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32				TIN SILVER COPPER	N	BOTTOM	1.6 mm	19 mm			30	260	19 mm	CMOS		Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B484	3	Not Qualified	e1
XCZU3CG-1LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4		e1
XCZU3EG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4		e1
XAZU2EG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.72 V			.8 mm	S-PBGA-B484	3		e1
XCZU3EG-2LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm		0			19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484
XCZU3CG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4		e1
XCZU3EG-2SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.85 V				R-PBGA-B484	4		e1
XAZU2EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V			.8 mm	S-PBGA-B484	3		e1
XCZU3EG-L1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					CMOS	.72 V				R-PBGA-B484	4		e1
XAZU3EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V			.8 mm	S-PBGA-B484	3		e1
XCZU3CG-2LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm		0			19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484
XCZU2EG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4		e1
XCZU6CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU6CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	0 Cel			BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XAZU2EG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V			.8 mm	S-PBGA-B484	3		e1
XCZU2EG-L2SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					CMOS	.72 V				R-PBGA-B484	4		e1
XCZU2EG-1LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4		e1
XA7Z030-1FBG484I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY	BGA484,22X22,40				Tin/Silver/Copper (Sn/Ag/Cu)	N	BOTTOM	2.54 mm	23 mm			30	250	23 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B484	4	Not Qualified	e1
XAZU3EG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.72 V			.8 mm	S-PBGA-B484	3		e1
XCZU9CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU2EG-2SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V			.8 mm	R-PBGA-B484	4		e1
XCZU3EG-3SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	250		CMOS	.9 V				S-PBGA-B484	4		e1
XCZU3CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V			.8 mm	R-PBGA-B484	4		e1
XCZU2EG-2LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel			BOTTOM	2.61 mm	19 mm		0			19 mm	CMOS	.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484
XC7Z030-2FB484I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm					23 mm	CMOS	1 V			1 mm	S-PBGA-B484

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.