Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
9 mm |
CMOS |
275 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQCC-N64 |
Not Qualified |
e3 |
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|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
AEC-Q100 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
1.71 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
3.3 |
CHIP CARRIER |
LCC64,.30SQ,16 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
7.5 mm |
7.5 mm |
275 mA |
3.3 V |
Bus Controllers |
.4 mm |
S-PQCC-N64 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N64 |
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|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
64 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY, FINE PITCH |
BGA64,8X8,32 |
85 Cel |
-25 Cel |
BOTTOM |
260 |
260 mA |
3.3 V |
Other Microprocessor ICs |
.8 mm |
S-PBGA-B64 |
2 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SoC |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
YES |
QUAD |
1 mm |
9 mm |
0 |
2 MHz |
30 |
260 |
9 mm |
CMOS |
3.3 V |
I2C; UART |
.5 mm |
S-PQCC-N64 |
2 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Integrated Device Technology |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP64,.32,20 |
70 Cel |
0 Cel |
TIN |
DUAL |
260 |
CMOS |
3.3 V |
Clock Generators |
.5 mm |
R-PDSO-G64 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
YES |
QUAD |
1 mm |
32768 |
4 |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
0 |
20 MHz |
30 |
260 |
9 mm |
4096 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART; USB |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
20 rpm |
e4 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
1.8 V |
125 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G64 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
YES |
QUAD |
1 mm |
32768 |
4 |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
0 |
20 MHz |
30 |
260 |
9 mm |
4096 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART; USB |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
20 rpm |
e4 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SoC |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SoC |
GULL WING |
64 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G64 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Elo Touch Solutions |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
70 Cel |
0 Cel |
QUAD |
IT ALSO OPERATES AT 5V SUPPLY VOLTAGE |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
3.3 V |
S-PQFP-G64 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
CAPACITIVE TOUCH SCREEN CONTROLLERS |
BALL |
64 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,8X8,20 |
3 V |
85 Cel |
-40 Cel |
BOTTOM |
.6 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-PBGA-B64 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
2 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
32768 |
9 mm |
0 |
30 |
260 |
9 mm |
4096 |
CMOS |
5.1 mA |
3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
20 rpm |
e4 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5,3.3 |
FLATPACK |
QFP64,.47SQ,20 |
125 Cel |
-40 Cel |
TIN |
QUAD |
40 |
260 |
CMOS |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CLOCK GENERATOR, OTHER |
NO LEAD |
64 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
BGA64,8X8,32 |
1.71 V |
85 Cel |
-40 Cel |
BOTTOM |
1 mm |
5 mm |
10 mm |
CMOS |
1.8 V |
.4 mm |
R-XQCC-N64 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
3 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
10 mm |
30 |
260 |
10 mm |
CMOS |
45 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
2.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
8 mm |
0 |
30 |
260 |
8 mm |
BICMOS |
3 V |
Other Microprocessor ICs |
.8 mm |
S-PBGA-B64 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
10 mm |
0 |
30 |
260 |
10 mm |
BICMOS |
3 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
6.1 mm |
30 |
260 |
17 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-G64 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
3 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
10 mm |
30 |
260 |
10 mm |
CMOS |
45 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
DUAL |
1.2 mm |
6.1 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
LVT |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
6.1 mm |
0 |
30 |
260 |
17 mm |
CMOS |
24 mA |
3.3 V |
.5 mm |
R-PDSO-G64 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
6.1 mm |
30 |
260 |
17 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-G64 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
DUAL |
1.2 mm |
6.1 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
64 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
FLATPACK |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
CMOS |
3.3 V |
R-CDFP-F64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
64 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
FLATPACK |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
CMOS |
3.3 V |
R-CDFP-F64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
2.7 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
8 mm |
20 |
220 |
8 mm |
BICMOS |
3 V |
Other Microprocessor ICs |
.8 mm |
S-PBGA-B64 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
YES |
QUAD |
1 mm |
9 mm |
0 |
2 MHz |
30 |
260 |
9 mm |
CMOS |
3.3 V |
I2C; UART |
.5 mm |
S-PQCC-N64 |
2 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
30 |
260 |
9 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
20 rpm |
e4 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.4 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
9 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N64 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.4 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
9 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N64 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
9 mm |
9 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N64 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.4 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
9 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N64 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
30 |
260 |
9 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
20 rpm |
e4 |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
30 |
260 |
9 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
20 rpm |
e4 |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
9 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
30 |
260 |
9 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
20 rpm |
e4 |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK |
4.75 V |
70 Cel |
0 Cel |
QUAD |
2.35 mm |
14 mm |
14 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
2.35 mm |
14 mm |
14 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G64 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK |
4.75 V |
70 Cel |
0 Cel |
QUAD |
2.35 mm |
14 mm |
14 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK |
4.75 V |
70 Cel |
0 Cel |
QUAD |
2.35 mm |
14 mm |
14 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G64 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G64 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G64 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G64 |
Not Qualified |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.