64 Other Function uPs,uCs & Peripheral ICs 477

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C4147AZS-S265	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZE-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64
CY8C4146AZA-S275T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZS-S475T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZE-S465	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64
CY8C4127AZS-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S265T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZA-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZS-S275	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4126AZS-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZE-S275T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64
CY8C4147AZS-S285T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S245	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S255T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZE-S265	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64
CY8C4147AZA-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S255	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S275	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZS-S245T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4127AZA-S445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4245AZA-M445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3 V		.5 mm	S-PQFP-G64	3
CY8C4146AZA-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4127AZE-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64
CY8C4127AZS-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4127AZS-M485	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZS-S285	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZA-S475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64	3
CY8C4247AZA-M475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS		1.8 V		.5 mm	S-PQFP-G64	3
CY8C4147AZE-S285T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64
CY8C4126AZE-S455T	Infineon Technologies	PSoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS		3.3 V		.5 mm	S-PQFP-G64
TC358765XBG	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.1 V	85 Cel	-30 Cel		BOTTOM	1.2 mm	6 mm			6 mm	CMOS		1.2 V		.65 mm	S-PBGA-B64
9LPRS501YGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm			17 mm	CMOS		3.3 V		.5 mm	R-PDSO-G64		Not Qualified	e3
9LPRS355BKLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.135 V	70 Cel	0 Cel	TIN	QUAD	1 mm	9 mm		260	9 mm	CMOS		3.3 V		.5 mm	S-PQCC-N64	3		e3
9LPR501YGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm			17 mm	CMOS		3.3 V		.5 mm	R-PDSO-G64		Not Qualified	e3
9LPRS501YKLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.135 V	70 Cel	0 Cel	MATTE TIN	QUAD	1 mm	9 mm			9 mm	CMOS		3.3 V		.5 mm	S-PQCC-N64		Not Qualified	e3
9LPRS355YGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSOP2	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE		3.135 V	70 Cel	0 Cel		DUAL	1.2 mm	6.1 mm			17 mm	CMOS		3.3 V		.5 mm	R-PDSO-G64
9LPR501SGLF	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP64,.32,20	3.135 V	70 Cel	0 Cel	TIN	DUAL	1.2 mm	6.1 mm		260	17 mm	CMOS	250 mA	3.3 V	Clock Generators	.5 mm	R-PDSO-G64	1	Not Qualified	e3
9LPR501SGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP64,.32,20	3.135 V	70 Cel	0 Cel	TIN	DUAL	1.2 mm	6.1 mm		260	17 mm	CMOS	250 mA	3.3 V	Clock Generators	.5 mm	R-PDSO-G64	1	Not Qualified	e3
9LPR501YGT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.135 V	70 Cel	0 Cel	TIN LEAD	DUAL	1.2 mm	6.1 mm			17 mm	CMOS		3.3 V		.5 mm	R-PDSO-G64		Not Qualified	e0
9LPRS355YKLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.135 V	70 Cel	0 Cel		QUAD	1 mm	9 mm			9 mm	CMOS		3.3 V		.5 mm	S-PQCC-N64
ZAMC4100GA2V	Renesas Electronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	18 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 V	125 Cel	-40 Cel	TIN	QUAD	.9 mm	9 mm		260	9 mm	CMOS		13 V		.5 mm	S-PQCC-N64	1		e3
ZAMC4100GA2R	Renesas Electronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	18 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 V	125 Cel	-40 Cel	TIN	QUAD	.9 mm	9 mm		260	9 mm	CMOS		13 V		.5 mm	S-PQCC-N64	1		e3
S3F49DAXXX-KT	Samsung	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	CHIP CARRIER	LCC64,.35SQ,20		85 Cel	-25 Cel		QUAD						CMOS			Other Microprocessor ICs	.5 mm	S-PQCC-N64		Not Qualified
S3CI9E0X01	Samsung		COMMERCIAL	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8/2.5	GRID ARRAY, FINE PITCH	BGA64,10X10,20		70 Cel	0 Cel		BOTTOM									Other Microprocessor ICs	.5 mm	S-PBGA-B64		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.