784 Other Function uPs,uCs & Peripheral ICs 199

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU4EV-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU4CG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU4EV-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU3CG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU4EV-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU3CG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU5CG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

XCZU4EV-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU2CG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU4EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU4CG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU5EG-1SFVC784I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

BGA784,28X28,32

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU3EG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU5EV-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU5CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU3EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU2CG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU4EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU5CG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU5EV-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XAZU5EV-1SFVC784Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

S-PBGA-B784

4

e1

XCZU4CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU4CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

MPFS250T-1FCVG784I

Microchip Technology

PROGRAMMABLE SoC

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, FINE PITCH

BGA784,28X28,32

.97 V

100 Cel

-40 Cel

BOTTOM

2.92 mm

23 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

23 mm

CMOS

1 V

.8 mm

S-PBGA-B784

XCZU4CG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

XAZU4EV-1SFVC784Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

S-PBGA-B784

4

e1

XCZU5EV-3SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.9 V

S-PBGA-B784

4

e1

XCZU5EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU5EG-2SFVC784E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

BGA784,28X28,32

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU4EG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

MPFS095T-1FCVG784I

Microchip Technology

PROGRAMMABLE SoC

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, FINE PITCH

BGA784,28X28,32

.97 V

100 Cel

-40 Cel

BOTTOM

2.92 mm

23 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

23 mm

CMOS

1 V

.8 mm

S-PBGA-B784

XCZU5EG-1SFVC784E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

BGA784,28X28,32

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

MPFS160T-1FCVG784E

Microchip Technology

PROGRAMMABLE SoC

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, FINE PITCH

BGA784,28X28,32

.97 V

100 Cel

0 Cel

BOTTOM

2.92 mm

23 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

23 mm

CMOS

1 V

.8 mm

S-PBGA-B784

XCZU4EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU5CG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU5CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

S-PBGA-B784

4

e1

XCZU5CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

XCZU5EG-3SFVC784E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

BGA784,28X28,32

.873 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.9 V

.8 mm

S-PBGA-B784

4

e1

XCZU5EG-L1SFVC784I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

BGA784,28X28,32

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

23 mm

CMOS

.72 V

.8 mm

R-PBGA-B784

4

e1

XCZU5EG-L2SFVC784E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

BGA784,28X28,32

.698 V

110 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

23 mm

CMOS

.72 V

.8 mm

R-PBGA-B784

4

e1

XCZU5EV-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU4CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

S-PBGA-B784

4

e1

XCZU4EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU5EG-2SFVC784I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

BGA784,28X28,32

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU5EV-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU4EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU3CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

XCZU3EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.