784 Other Function uPs,uCs & Peripheral ICs 199

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	250		CMOS	.85 V		R-PBGA-B784	4	e1
XQZU3EG-1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm		20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V	.8 mm	S-PBGA-B784	4	e1
XCZU2EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	250		CMOS	.85 V		S-PBGA-B784	4	e1
XCZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V		R-PBGA-B784	4	e1
XCZU3EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	250		CMOS	.85 V		R-PBGA-B784	4	e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e1
XCVE2002-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1
XCVE2302-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVM1102-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCZU4EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	250		CMOS	.85 V		R-PBGA-B784	4	e1
XCVE2302-2HSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA784,28X28,31	.854 V	110 Cel	-40 Cel		BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.88 V	.8 mm	S-PBGA-B784
XCVE2002-2HSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel		BOTTOM							CMOS	.88 V		S-PBGA-B784
XCVE2202-2HSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA784,28X28,31	.854 V	110 Cel	-40 Cel		BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.88 V	.8 mm	S-PBGA-B784
XCVE2202-2LLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	-40 Cel		BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784
XQZU5EV-L1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm		20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XCVE2302-1MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE2202-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE2002-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2202-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE2002-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2102-1LLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1
XCVE2102-1LSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1
XCVE2302-1LSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784		e1
XCVE2002-2LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1
XCVE2102-1MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2002-2MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2202-1LSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784		e1
XCVE2302-2MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE2102-2MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2302-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784		e1
XCVE2202-1MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE2202-1LLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784		e1
XCVE2102-2LLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1
XCVE2302-2MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE2102-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2002-1MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2102-1MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2002-1LSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1
XCVE2002-1LLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1
XCVE2302-1LLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784		e1
XCVE2302-2LLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784		e1
XCVE2302-2LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784		e1
XCVE2102-2MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVE2202-2LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784		e1
XCVE2202-2MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE2002-2LLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.