Xilinx - XCVE2202-2MLISFVA784

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XCVE2202-2MLISFVA784 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVE2202-2MLISFVA784
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Length: 23 mm;
Datasheet XCVE2202-2MLISFVA784 Datasheet
In Stock240
NAME DESCRIPTION
Minimum Supply Voltage: .775 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .8 V
Maximum Supply Voltage: .825 V
Maximum Seated Height: 3.66 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Terminals: 784
Package Equivalence Code: BGA784,28X28,31
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 23 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B784
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: BGA
Width: 23 mm
Terminal Pitch: .8 mm
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