HBGA Other Function uPs,uCs & Peripheral ICs 516

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVM1802-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760		e1
XCVM1302-1LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1402-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1802-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760		e1
XCVM1302-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1802-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVM1502-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVM1802-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760		e1
XCVM1302-1MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1302-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1802-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760		e1
XCVM1302-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1802-1MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760		e1
XCVM1802-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVM1302-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1502-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVM1402-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1402-1MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1502-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVM1402-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1502-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVM1402-1LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVM1302-2MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1802-2HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.854 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.88 V	.92 mm	S-PBGA-B2197		e1
XCVM1802-1LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760		e1
XCVM1302-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVM1802-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
80HSPS16RMI	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	-40 Cel		BOTTOM	2.83 mm	21 mm			21 mm	CMOS	1 V	1 mm	S-PBGA-B400
80HSPS1616CHMGI	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.83 mm	21 mm	NOT SPECIFIED	245	21 mm	CMOS	1 V	1 mm	S-PBGA-B400	4	e1
80HSPS1616RMI	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.83 mm	21 mm	NOT SPECIFIED	245	21 mm	CMOS	1 V	1 mm	S-PBGA-B400	4	e1
80HSPS16RM	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	70 Cel	0 Cel		BOTTOM	2.83 mm	21 mm			21 mm	CMOS	1 V	1 mm	S-PBGA-B400
80HSPS16CRMI	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	-40 Cel		BOTTOM	2.83 mm	21 mm			21 mm	CMOS	1 V	1 mm	S-PBGA-B400
80HSPS1616HMG	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	70 Cel	0 Cel		BOTTOM	2.83 mm	21 mm	NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS	1 V	1 mm	S-PBGA-B400
80HSPS16CRM	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	70 Cel	0 Cel		BOTTOM	2.83 mm	21 mm			21 mm	CMOS	1 V	1 mm	S-PBGA-B400
80HSPS1616CHMG	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.83 mm	21 mm	NOT SPECIFIED	245	21 mm	CMOS	1 V	1 mm	S-PBGA-B400	4	e1
80HSPS1616HMGI	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	-40 Cel		BOTTOM	2.83 mm	21 mm	NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS	1 V	1 mm	S-PBGA-B400

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.