Renesas Electronics - 80HSPS1616CHMG

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80HSPS1616CHMG by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 80HSPS1616CHMG
Description MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: HBGA; Package Shape: SQUARE;
Datasheet 80HSPS1616CHMG Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 2.83 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 400
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Technology: CMOS
JESD-30 Code: S-PBGA-B400
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: HBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.05 V
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Length: 21 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
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