HBGA Other Function uPs,uCs & Peripheral ICs 516

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MCIMX535DVV1CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V			0.9/1.25,1.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.25 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e2
LS1021AXN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm	CMOS	1 V			.8 mm		S-PBGA-B525	3			e1
LS1021ASN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm	CMOS	1 V			.8 mm		S-PBGA-B525	3			e1
LS1021AXE7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm	CMOS	1 V			.8 mm		S-PBGA-B525	3			e1
XCVM1802-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm		40 mm						40 mm	CMOS	.8 V			.92 mm		S-PBGA-B1760				e1
XCVC1902-2HSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm		40 mm						40 mm	CMOS	.88 V			.92 mm		S-PBGA-B1760
XCVC1902-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.7 V			.92 mm		S-PBGA-B2197				e1
LS1021ASE7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm	CMOS	1 V			.8 mm		S-PBGA-B525	3			e1
XCVC1902-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.8 V			.92 mm		S-PBGA-B2197				e1
XCVP1202-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm		50 mm						50 mm	CMOS	.8 V			.92 mm		S-PBGA-B2785
XCVC1902-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm		40 mm						40 mm	CMOS	.8 V			.92 mm		S-PBGA-B1760
XCVM1802-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.8 V			.92 mm		S-PBGA-B2197				e1
XCVC1902-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.8 V			.92 mm		S-PBGA-B2197				e1
XCVP1502-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel		BOTTOM	4.48 mm		50 mm						50 mm	CMOS	.88 V			.92 mm		S-PBGA-B2785
XCVC1902-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.7 V			.92 mm		S-PBGA-B2197				e1
XCVC1902-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.8 V			.92 mm		S-PBGA-B2197				e1
XCVE1752-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.8 V			.92 mm		S-PBGA-B2197				e1
XCVM1802-1LSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm		40 mm						40 mm	CMOS	.7 V			.92 mm		S-PBGA-B1760				e1
XCVM1802-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.7 V			.92 mm		S-PBGA-B2197				e1
XCVM1802-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm		45 mm						45 mm	CMOS	.8 V			.92 mm		S-PBGA-B2197				e1
XCVP1202-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel		BOTTOM	4.48 mm		50 mm						50 mm	CMOS	.8 V			.92 mm		S-PBGA-B2785
XCVP1202-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm		50 mm						50 mm	CMOS	.8 V			.92 mm		S-PBGA-B2785
XCVP1402-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel		BOTTOM	4.48 mm		50 mm						50 mm	CMOS	.8 V			.92 mm		S-PBGA-B2785
XCVP1502-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm		50 mm						50 mm	CMOS	.8 V			.92 mm		S-PBGA-B2785
XCVP1702-1MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm		55 mm						55 mm	CMOS	.8 V			.92 mm		S-PBGA-B3340
XCVP1802-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT		BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel		BOTTOM	4.55 mm		70 mm						70 mm	CMOS	.8 V			.92 mm		S-PBGA-B5601
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
VCBUP7CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4			e1
DM505LRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DM8147BCIS0	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, HEAT SINK/SLUG		3.14 V			TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY			30	250	23 mm	CMOS	3.3 V			.8 mm		S-PBGA-B684	4			e1
DM505MRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
VCBUP7TC6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		19 mm				NOT SPECIFIED	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4			e1
DM8147SCIS0	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, HEAT SINK/SLUG		3.14 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY	48		NOT SPECIFIED	250	23 mm	CMOS	3.3 V		ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B684	4		1000 rpm	e1
VCBUP7CT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4			e1
TMSDM6467CCUT6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4			e1
TMSDM6467CCUT7TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		19 mm				NOT SPECIFIED	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4			e1
ZDM8147L3MOBCYE1	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, HEAT SINK/SLUG		3.14 V			TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY			30	250	23 mm	CMOS	3.3 V			.8 mm		S-PBGA-B684	4			e1
DM505LRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
TMSDM6467CCUTV6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4			e1
TMS320DM6433ZDU4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	260	23 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		e1
TMS320DM8167CCYG	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	3.31 mm		25 mm						25 mm	CMOS	1 V			.65 mm		S-PBGA-B1031
TMS320DM8167CCYG4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	3.31 mm		25 mm						25 mm	CMOS	1 V			.65 mm		S-PBGA-B1031
DLPC200	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	780	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, HEAT SINK/SLUG		1.15 V	70 Cel	0 Cel		BOTTOM	2.44 mm		29 mm						29 mm	CMOS	1.2 V			1 mm		S-PBGA-B780		Not Qualified
DLPC910ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	0 Cel		BOTTOM	3 mm		27 mm						27 mm	CMOS	1 V		I2C; USB	1 mm		S-PBGA-B676
TMS320DM8167CCYG2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	3.31 mm		25 mm						25 mm	CMOS	1 V			.65 mm		S-PBGA-B1031
LS1021ASE7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm	CMOS	1 V			.8 mm		S-PBGA-B525	3			e1
LS1021ASN7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm	CMOS	1 V			.8 mm		S-PBGA-B525	3			e1
LS1021AXN7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm	CMOS	1 V			.8 mm		S-PBGA-B525	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.