HBGA Other Function uPs,uCs & Peripheral ICs 516

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
LS1021AXE7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT	BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm	40	260	19 mm	CMOS	1 V	.8 mm	S-PBGA-B525	3	e1
XCVP1802-2MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2802-1LSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1802-3HSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.854 V	100 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.88 V	.92 mm	S-PBGA-B5601
XCVP2802-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1802-1MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2802-2MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVE1752-1LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE1752-1MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-2LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE1752-1MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVP1802-2MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2802-1MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1802-1MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVE1752-2MLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVP2802-2MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVE1752-1LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE1752-2MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVP2802-2LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1802-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	100 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1802-2LLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVE1752-2HSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVP1802-1LLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1802-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	100 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2802-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	100 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1202-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1402-1LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.7 V	.92 mm	S-PBGA-B3340
XCVC1902-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1902-2MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1802-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVC1902-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVC1902-2LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVC1802-2LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVP1102-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1802-2HSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVP1402-1MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVC1802-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1202-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-2LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1902-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVC1902-1LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVC1502-2MLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1502-2LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-2MSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1802-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVP1502-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1802-2HSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.88 V	.92 mm	S-PBGA-B1760
XCVC1702-1MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.