Xilinx - XCVP1802-1MSEVSVA5601

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XCVP1802-1MSEVSVA5601 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVP1802-1MSEVSVA5601
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 5601; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B5601;
Datasheet XCVP1802-1MSEVSVA5601 Datasheet
In Stock465
NAME DESCRIPTION
Minimum Supply Voltage: .775 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .8 V
Maximum Supply Voltage: .825 V
Maximum Seated Height: 4.55 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 5601
Package Equivalence Code: BGA5601,75X75,36
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 70 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B5601
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: HBGA
Width: 70 mm
Terminal Pitch: .92 mm
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