HBGA Other Function uPs,uCs & Peripheral ICs 516

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVE1752-2LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE1752-1LSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVP2802-1MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVE1752-2MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVP2802-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	100 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVE1752-2LLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVP1802-1LSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVE1752-2HSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVE1752-1MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	35 mm			35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVP2802-2LLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVE1752-2LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVP1802-2MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel		BOTTOM	4.55 mm	70 mm			70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1402-2LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.7 V	.92 mm	S-PBGA-B3340
XCVC1802-1LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVC1502-1LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVP1102-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1902-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVP1402-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1702-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVC1502-2HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.854 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.88 V	.92 mm	S-PBGA-B2197	e1
XCVP1502-1MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1502-1MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1802-1LLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-2HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.854 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.88 V	.92 mm	S-PBGA-B2197	e1
XCVC1902-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1702-1MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVC1802-2MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1552-2LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1902-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1802-2HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.854 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.88 V	.92 mm	S-PBGA-B2197	e1
XCVP1552-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	100 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1502-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVP1202-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1902-1MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1802-2LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVP1502-3HSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.854 V	100 Cel	0 Cel		BOTTOM	4.4 mm	55 mm			55 mm	CMOS	.88 V	.92 mm	S-PBGA-B3340
XCVP1502-2MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.4 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVC1702-1LSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-1LSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1802-2MSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1902-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVC1802-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1102-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1802-2LLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVP1502-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1502-2MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1702-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.