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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TMS320DM8167CCYG |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1031; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 3.31 mm; |
| Datasheet | TMS320DM8167CCYG Datasheet |
| In Stock | 474 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .95 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 1 V |
| Maximum Supply Voltage: | 1.05 V |
| Maximum Seated Height: | 3.31 mm |
| Surface Mount: | YES |
| No. of Terminals: | 1031 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 25 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B1031 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | HBGA |
| Width: | 25 mm |
| Terminal Pitch: | .65 mm |









