HFBGA Other Function uPs,uCs & Peripheral ICs 234

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XTDA4VHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm		31 mm				31 mm	CMOS	.8 V		.8 mm		S-PBGA-B1414
XTDA4AHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm		31 mm				31 mm	CMOS	.8 V		.8 mm		S-PBGA-B1414
XTDA4APXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm		31 mm				31 mm	CMOS	.8 V		.8 mm		S-PBGA-B1414
XTDA4VPXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm		31 mm				31 mm	CMOS	.8 V		.8 mm		S-PBGA-B1414
T1024NXN7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
LS1023ASN7KQB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		21 mm		30	250	21 mm	CMOS	.9 V		.8 mm		S-PBGA-B621	3		e1
T1014ME3PQA	Teledyne E2v (Uk)	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	125 Cel	-55 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NXE7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
TMX320DM6467ZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel		BOTTOM	3.1 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	NOT SPECIFIED	NOT SPECIFIED	19 mm	CMOS	1.2 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B529		Not Qualified
T1024NSEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NXEC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NXNC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NXEC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NXE7MQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1014NXE7PNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSE7PQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1024NXNC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSNC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NSN7MNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSNC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSEC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NSE7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1014NSN7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSN7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NXN7PNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSNC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NXE7KQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1014NXN7KQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1024NSNC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSEC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NXN7KNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NSEC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSN7KQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1014NSN7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NXE7PNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSNC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NXNC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NXN7KQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1014NSNC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NXE7KNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NSN7PQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		30	250	23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1014NXEC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NXNC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NSEC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1024NSE7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NXN7KNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780	3		e1
T1014NSNC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780
T1014NSNC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm		23 mm				23 mm	CMOS	1 V		.8 mm		S-PBGA-B780

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.