HFBGA Other Function uPs,uCs & Peripheral ICs 234

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
T1014NSE7PQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NXE7MQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NXN7MNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXNC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSN7MNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXE7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1014NXEC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSE7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSNC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXEC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXEC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSN7KQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1014NSE7KQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1014NSEC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXEC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSE7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NXNC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXE7MNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSN7MQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NXN7PNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXNC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXNC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXN7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NXEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSEC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSEC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXEC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSEC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSE7MQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1014NSN7MQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1014NXEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXEC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSE7MNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSE7KQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1014NXNC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXN7MQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NXNC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXE7KNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXNC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXEC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXNC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXE7MNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSE7MQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NSNC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSE7MNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXN7MQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NXE7KQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.