NXP Semiconductors - T1024NXEC4KQA

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T1024NXEC4KQA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number T1024NXEC4KQA
Description SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;
In Stock2,496
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Nominal Supply Voltage: 1 V
Maximum Supply Voltage: 1.03 V
Maximum Seated Height: 2.07 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 780
Package Equivalence Code: BGA780,28X28,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Length: 23 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B780
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: HFBGA
Width: 23 mm
Terminal Pitch: .8 mm
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