HFBGA Other Function uPs,uCs & Peripheral ICs 234

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
LS1043ASN8PQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASE7KQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASE8PQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXE8MQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASN7KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
LS1043ASN8KNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043AXE7QQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASN7MQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASN8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043ASN8KQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASE8KQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXN8PQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXN8QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXE8PQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASN7PNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043AXE8PNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASN7MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3	e1
LS1043AXN8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASN7KQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043AXN7MNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASN8QQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXN7PNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASE8QQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXE8QQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASN7PNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASE8PNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXE8QQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXE7MNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASN8PNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASN7QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASE8KQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXN7MQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASE8QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXE7PQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASN8MNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780	3	e1
LS1043ASE8QNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043ASN8QNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780
LS1043AXN7KNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043AXN7PNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043ASN7KNLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621	3
LS1043ASN7KQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm			21 mm	CMOS	.9 V	.8 mm	S-PBGA-B621
LS1043AXN8MNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	.9 V	.8 mm	S-PBGA-B780

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.