HLFQFP Other Function uPs,uCs & Peripheral ICs 46

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
CY8C6244AZI-S4D92	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
S6J32GEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
CY8C6144AZI-S4F92	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D62	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D82	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
S6J32HELTNSC2D000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
ADSP-SC571-SWZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel		QUAD	1.6 mm	24 mm	NOT SPECIFIED	NOT SPECIFIED	24 mm	CMOS	3.3 V	.5 mm	S-PQFP-G176
ADSP-21571-SWZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel		QUAD	1.6 mm	24 mm	NOT SPECIFIED	NOT SPECIFIED	24 mm	CMOS	3.3 V	.5 mm	S-PQFP-G176
PV912NE812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm			14 mm	CMOS	3.3 V	.5 mm	S-PQFP-G100
PM912KS812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm			14 mm	CMOS		.5 mm	S-PQFP-G100
PM912KS812AMAFR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm			14 mm	CMOS		.5 mm	S-PQFP-G100
PM912JS812AMAFR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm			14 mm	CMOS		.5 mm	S-PQFP-G100
PM912JS812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm			14 mm	CMOS		.5 mm	S-PQFP-G100
MM912JP812AMAFR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	36 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		4.7 V	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS		.5 mm	S-PQFP-G100	3	e3
MM912F634DV2AE	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	18 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		5.5 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	7 mm	40	260	7 mm	CMOS	7 V	.5 mm	S-PQFP-G48	3	e3
MM912KS812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel	Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS	3.3 V	.5 mm	S-PQFP-G100	3	e3
MM912F634DV2AER2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	18 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		5.5 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	7 mm	40	260	7 mm	CMOS	7 V	.5 mm	S-PQFP-G48	3	e3
MM912F634DV1AER2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	18 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		5.5 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	7 mm	40	260	7 mm	CMOS	7 V	.5 mm	S-PQFP-G48	3	e3
MM912JS812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS	3.3 V	.5 mm	S-PQFP-G100	3	e3
MC9S12XEP100	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS	3.3 V	.5 mm	S-PQFP-G100
MM912JS812AMAFR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS	3.3 V	.5 mm	S-PQFP-G100	3	e3
MM912IP812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	36 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		4.7 V	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS		.5 mm	S-PQFP-G100	3	e3
MM912IP812AMAFR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	36 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		4.7 V	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS		.5 mm	S-PQFP-G100	3	e3
MM912JP812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	36 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		4.7 V	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS		.5 mm	S-PQFP-G100	3	e3
MM912F634DV1AE	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	18 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		5.5 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	7 mm	40	260	7 mm	CMOS	7 V	.5 mm	S-PQFP-G48	3	e3
MM912KS812AMAFR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel	Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS	3.3 V	.5 mm	S-PQFP-G100	3	e3
CY8C6144AZI-S4F82	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D12	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144AZI-S4F62	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144AZQ-S4F92	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZQ-S4D92	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144AZI-S4F12	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
S6J32EELTMSC2000A	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32FELSNSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32FELTNSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32EELSNSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32EEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
S6J32GEKSMSE2000A	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
S6J32FEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
S6J32GELSNSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32JEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	125 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
S6J32EELTPSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32GELTPSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32GELTNSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32HELTNSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32JELSNSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	125 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.