MC9S12XEP100 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MC9S12XEP100
Description	MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HLFQFP; Package Shape: SQUARE;
In Stock	1,967

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Peripheral IC Type:	MICROPROCESSOR CIRCUIT
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.6 mm
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	100
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Length:	14 mm
Technology:	CMOS
JESD-30 Code:	S-PQFP-G100
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Peak Reflow Temperature (C):	NOT SPECIFIED
Package Code:	HLFQFP
Width:	14 mm
Terminal Pitch:	.5 mm
Temperature Grade:	AUTOMOTIVE

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,967	-	-

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