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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
SNJ54ACT8999FK	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	NO LEAD	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.5 V	38535Q/M;38534H;883B				5	CHIP CARRIER	LCC28,.45SQ	4.5 V	125 Cel		-55 Cel			QUAD		2.03 mm			11.43 mm						NOT SPECIFIED	NOT SPECIFIED	11.43 mm		CMOS			5 V		Other Microprocessor ICs				1.27 mm		S-CQCC-N28		Not Qualified
TVP9900PFPR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.65 V						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH		1.35 V	70 Cel		0 Cel			QUAD		1.2 mm			12 mm						NOT SPECIFIED	NOT SPECIFIED	12 mm		CMOS			1.5 V						.5 mm		S-PQFP-G80		Not Qualified
SNC54AS856FH	Texas Instruments		MILITARY	NO LEAD	28	QCCN	SQUARE	CERAMIC	YES		MIL-STD-883 Class B (Modified)					CHIP CARRIER	LCC28,.45SQ		125 Cel		-55 Cel			QUAD															TTL					Other uPs/uCs/Peripheral ICs				1.27 mm		S-XQCC-N28		Not Qualified
TMX320DM355ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel			BOTTOM		1.3 mm		32768	13 mm						NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS			1.3 V		Digital Signal Processors				.65 mm	FIXED POINT	S-PBGA-B337		Not Qualified
PAM1806BZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY						16 mm		CMOS			1.3 V						.8 mm		S-PBGA-B361		Not Qualified
TNETX15VEPGE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3.3,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3 V	95 Cel		0 Cel			QUAD		1.6 mm			20 mm		ALSO REQUIRES 5V SUPPLY				NOT SPECIFIED	NOT SPECIFIED	20 mm		CMOS			3.3 V		Other Microprocessor ICs				.5 mm		S-PQFP-G144		Not Qualified
TFB2051PPM	Texas Instruments			GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES							FLATPACK	QFP208,1.2SQ,20							QUAD															BICMOS					Other Microprocessor ICs				.5 mm		S-PQFP-G208		Not Qualified
CC2571RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			6 mm				0		30	260	6 mm		CMOS			3 V		Other uPs/uCs/Peripheral ICs			SPI; UART	.5 mm		S-PQCC-N40	3	Not Qualified		e4
DRA781BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100					GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS			1.06 V					CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
XAM1806BZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V						BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY						13 mm		CMOS			1.3 V						.65 mm		S-PBGA-B361		Not Qualified
DRA783BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100					GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm			15 mm				48	32 MHz	30	250	15 mm		CMOS			1.06 V					CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
CC2545RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm				0		30	260	7 mm		CMOS			3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; UART; USART	.5 mm		S-PQCC-N48	3	Not Qualified		e4
SNJ54AS877FH	Texas Instruments		MILITARY	NO LEAD	28	QCCN	SQUARE	CERAMIC	YES		38535Q/M;38534H;883B					CHIP CARRIER	LCC28,.45SQ		125 Cel		-55 Cel			QUAD															TTL					Other Microprocessor ICs				1.27 mm		S-XQCC-N28		Not Qualified
TCI6630K2LSCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V						BOTTOM															CMOS			.95 V								S-PBGA-B900
TMS320DM355DZCEA13	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V				TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm		IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O				30	260	13 mm		CMOS			1.3 V		Digital Signal Processors				.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
MSP430F67781IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	16	14 mm				0		30	260	14 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F6769IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0	25 MHz	30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
TMS320DM355CZCEA21	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm		IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O		32		30	260	13 mm		CMOS			1.3 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TCI6630K2LCMS24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V						BOTTOM															CMOS			.95 V								S-PBGA-B900
MSP430F67621PN	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel		-40 Cel			QUAD		1.6 mm			12 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY						12 mm		CMOS			3.3 V						.5 mm		S-PQFP-G80
MSP430F67661IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	262144	16	14 mm				0		30	260	14 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
TMS320DM6433ZDU4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.48 mm		20480	23 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY				30	260	23 mm		CMOS			1.2 V		Digital Signal Processors			I2C; SPI; UART	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		e1
TCI6636K2HBSAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
TCI6638K2KXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
LM8333GGR8X/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V					2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel		-40 Cel			BOTTOM		1.1 mm			4 mm						30	260	4 mm		CMOS		6 mA	2.75 V		Other Microprocessor ICs				.5 mm		S-PBGA-B49	1	Not Qualified
OMAP3503DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V					1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.71 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.9 mm			12 mm								12 mm		CMOS			1.8 V		Graphics Processors				.4 mm		S-PBGA-B515	3	Not Qualified		e1
LM8333GGR8X	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V						GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel		-40 Cel			BOTTOM		1.1 mm			4 mm								4 mm		CMOS									.5 mm		S-PBGA-B49		Not Qualified
OMAP3515DCUSA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V					1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA423,24X24,25	1.71 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm						30	260	16 mm		CMOS			1.8 V		Graphics Processors				.65 mm		S-PBGA-B423	4	Not Qualified		e1
DLPC6401ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY		1.116 V	55 Cel		0 Cel			BOTTOM		2.36 mm			23 mm								23 mm		CMOS			1.2 V						1 mm		S-PBGA-B419
TCI6636K2HAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
TCI6636K2HAAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
TCI6636K2HCAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
SCANSTA101SMX	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel		-40 Cel	TIN LEAD		BOTTOM		1.5 mm			7 mm						20	235	7 mm		CMOS			3.3 V		Other Microprocessor ICs				.8 mm		S-PBGA-B49	3	Not Qualified		e0
TCI6636K2HASAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
CC1310F64RSM	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V						QUAD		1 mm			4 mm								4 mm		CMOS									.4 mm		S-PQCC-N32
MSP430F67681IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	16	14 mm				0		30	260	14 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F6746AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	262144	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
DM355SDZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm		IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O				30	260	13 mm		CMOS			1.3 V		Digital Signal Processors				.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
MSP430F67621AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm		4	14 mm				0		30	260	14 mm	4096	CMOS			3.3 V					I2C; SPI; UART	.5 mm		S-PQFP-G100	3			e4
TCI6638K2KASAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
TMS320DM6467CZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		3.3 mm		8192	19 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY				30	245	19 mm		CMOS			1.2 V		Digital Signal Processors				.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TCI6638K2KXAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm				32		30	260	13 mm		CMOS			1.35 V					I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
TCI6636K2HBDAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
MSP430F6777IPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	262144	32	14 mm				0	25 MHz	30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
LM8333FLQ8Y	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	2.75 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.25 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.8 mm			6 mm						40	260	6 mm		CMOS									.5 mm		S-XQCC-N32	3	Not Qualified		e3
MSP430F6749IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm		32	14 mm				0	25 MHz	30	260	14 mm	32768	CMOS			3.3 V					I2C; SPI; UART	.5 mm		S-PQFP-G100	3			e4
TCI6638K2KAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.