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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

TUSB2136PM

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

3 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

10 mm

30

260

10 mm

CMOS

45 mA

3.3 V

Bus Controllers

.5 mm

S-PQFP-G64

3

Not Qualified

e4

SN54ACT8997FK

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

5

CHIP CARRIER

LCC28,.45SQ

4.5 V

125 Cel

-55 Cel

QUAD

2.03 mm

11.43 mm

NOT SPECIFIED

NOT SPECIFIED

11.43 mm

CMOS

100 mA

5 V

Other Microprocessor ICs

1.27 mm

S-CQCC-N28

Not Qualified

TFB2002BM

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

FLAT

256

QFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

FLATPACK

125 Cel

-55 Cel

QUAD

CMOS

5 V

S-CQFP-F256

Not Qualified

DM505LRBABF

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY, HEAT SINK/SLUG

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

32

32 MHz

30

250

15 mm

CMOS

1.06 V

I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

TFB2022AIMFP

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

240

FQFP

SQUARE

METAL

YES

5.25 V

FLATPACK, FINE PITCH

4.75 V

85 Cel

-20 Cel

QUAD

4.2 mm

31.64 mm

31.64 mm

CMOS

5 V

.5 mm

S-MQFP-G240

Not Qualified

SN74AS8839GB

Texas Instruments

COMMERCIAL

PIN/PEG

84

PGA

SQUARE

CERAMIC

NO

GRID ARRAY

PGA84M,11X11

70 Cel

0 Cel

PERPENDICULAR

TTL

150 mA

Other uPs/uCs/Peripheral ICs

2.54 mm

S-XPGA-P84

Not Qualified

TSS400CFN-S1

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

CHIP CARRIER

2.6 V

70 Cel

0 Cel

QUAD

4.57 mm

16.5862 mm

NOT SPECIFIED

NOT SPECIFIED

16.5862 mm

CMOS

1.1 mA

3 V

1.27 mm

S-PQCC-J44

Not Qualified

DM8147BCIS0

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

684

HBGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

GRID ARRAY, HEAT SINK/SLUG

3.14 V

TIN SILVER COPPER

BOTTOM

3.06 mm

23 mm

IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY

30

250

23 mm

CMOS

3.3 V

.8 mm

S-PBGA-B684

4

e1

XAM1806BZWTA4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

SN74LVT8986ZGV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA64,8X8,32

2.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

8 mm

0

30

260

8 mm

BICMOS

3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

3

Not Qualified

e1

CC3000YFVT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

126

BGA

SQUARE

PLASTIC/EPOXY

YES

4.8 V

GRID ARRAY

2.7 V

70 Cel

-20 Cel

BOTTOM

CMOS

S-PBGA-B126

SN54AS856FH

Texas Instruments

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC

YES

CHIP CARRIER

LCC28,.45SQ

125 Cel

-55 Cel

QUAD

TTL

Other Microprocessor ICs

1.27 mm

S-XQCC-N28

Not Qualified

SN54LVT8980AFK

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

J BEND

28

QCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

3.6 V

CHIP CARRIER

2.7 V

125 Cel

-55 Cel

QUAD

CMOS

3.3 V

S-CQCC-J28

Not Qualified

V62/09643-01XE

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

125 Cel

-55 Cel

TIN LEAD

BOTTOM

1.3 mm

8192

13 mm

32

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

e0

TUSB2040APT

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

3 V

70 Cel

0 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

100 mA

3.3 V

Bus Controllers

.5 mm

S-PQFP-G48

Not Qualified

SN74LS608FN

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

J BEND

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.25 V

CHIP CARRIER

4.75 V

70 Cel

0 Cel

QUAD

4.57 mm

8.9662 mm

NOT SPECIFIED

NOT SPECIFIED

8.9662 mm

CMOS

5 V

1.27 mm

S-PQCC-J20

Not Qualified

DRA785BSGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY, FINE PITCH

BGA167,22X22,26

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

32

32 MHz

30

250

15 mm

CMOS

1.06 V

I2C(2), SPI(4), UART(3),

.65 mm

S-PBGA-B367

3

e1

X1642BIGABL

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

161

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

1.14 V

125 Cel

-40 Cel

BOTTOM

1.17 mm

10.4 mm

10.4 mm

CMOS

1.2 V

.65 mm

S-PBGA-B161

SN74LVT8986PM

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

2.7 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

10 mm

0

30

260

10 mm

BICMOS

3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G64

3

Not Qualified

e4

DRA752BPGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

30

250

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

3

e1

DRA787BRGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

VVLOG365ZCE

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.28 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

30

260

13 mm

CMOS

1.2 V

.65 mm

S-PBGA-B338

3

e1

SNJ54AS856FH

Texas Instruments

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC

YES

38535Q/M;38534H;883B

CHIP CARRIER

LCC28,.45SQ

125 Cel

-55 Cel

QUAD

TTL

Other Microprocessor ICs

1.27 mm

S-XQCC-N28

Not Qualified

SNJ54AS852FH

Texas Instruments

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC

YES

38535Q/M;38534H;883B

CHIP CARRIER

LCC28,.45SQ

125 Cel

-55 Cel

QUAD

TTL

Other Microprocessor ICs

1.27 mm

S-XQCC-N28

Not Qualified

TMX320DM6467ZUT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

BOTTOM

3.1 mm

32768

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

NOT SPECIFIED

NOT SPECIFIED

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

Not Qualified

CC2545RGZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

7 mm

0

30

260

7 mm

CMOS

3 V

Other uPs/uCs/Peripheral ICs

I2C; SPI; UART; USART

.5 mm

S-PQCC-N48

3

Not Qualified

e4

DRA750BJGABCRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

48

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1000 rpm

e1

SMJ34061GBS

Texas Instruments

MICROPROCESSOR CIRCUIT

PIN/PEG

68

PGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

5.5 V

38535Q/M;38534H;883B

GRID ARRAY

PGA68,11X11

4.5 V

-55 Cel

PERPENDICULAR

NOT SPECIFIED

NOT SPECIFIED

NMOS

5 V

Display Controllers

2.54 mm

S-CPGA-P68

Not Qualified

CP3SP33SMRX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

16

1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

1.62 V

85 Cel

CR16C

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

10 mm

30

260

10 mm

32768

CMOS

200 mA

1.8 V

Microcontrollers

.8 mm

S-PBGA-B144

3

Not Qualified

96 rpm

e1

DM505MRBABFR

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY, HEAT SINK/SLUG

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

32

32 MHz

30

250

15 mm

CMOS

1.06 V

I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

5962-9674701Q3X

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

CMOS

5 V

S-CQCC-N28

Not Qualified

DRA786BDGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

PAM1806BZCEA3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

Not Qualified

TMX320DM6443BZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL EXTENDED

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

NOT SPECIFIED

NOT SPECIFIED

16 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B361

Not Qualified

DRA751BLGABCQ

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

BOTTOM

2.96 mm

23 mm

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

DRA786BDGABFRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

CC2543RHBT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

5 mm

0

30

260

5 mm

CMOS

3 V

Other uPs/uCs/Peripheral ICs

I2C; SPI; UART; USART

.5 mm

S-PQCC-N32

3

Not Qualified

e4

POMAPL132BZWTA2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

Not Qualified

TUSB2040PT

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

3 V

70 Cel

0 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

100 mA

3.3 V

Bus Controllers

.5 mm

S-PQFP-G48

Not Qualified

TUSB2136PMG4

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

3 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

10 mm

30

260

10 mm

CMOS

45 mA

3.3 V

Bus Controllers

.5 mm

S-PQFP-G64

3

Not Qualified

e4

5962-9681201Q3A

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-PRF-38535 Class Q

5

CHIP CARRIER

LCC28,.45SQ

4.5 V

125 Cel

-55 Cel

QUAD

2.03 mm

11.43 mm

NOT SPECIFIED

NOT SPECIFIED

11.43 mm

BICMOS

5 V

Other Microprocessor ICs

1.27 mm

S-CQCC-N28

Not Qualified

TMX320DM365AZCE300

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

0 Cel

BOTTOM

1.3 mm

13 mm

13 mm

CMOS

1.35 V

.65 mm

S-PBGA-B338

Not Qualified

SN75LVDS88PFD

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

100

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

Not Qualified

TMX320DM6446DZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

316

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

BOTTOM

1.4 mm

16 mm

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B316

SNJ54LS608FK

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

NO LEAD

20

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

2.03 mm

8.89 mm

NOT SPECIFIED

NOT SPECIFIED

8.89 mm

CMOS

5 V

1.27 mm

S-CQCC-N20

Not Qualified

X430FRL152HCRGER

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.65 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.45 V

70 Cel

0 Cel

QUAD

1 mm

4 mm

4 mm

CMOS

1.5 V

.5 mm

S-PQCC-N24

DRA783BRJABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY, FINE PITCH

BGA367,22X22,25

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

32

32 MHz

15 mm

CMOS

1.06 V

CAN(2), I2C(2), SPI(4), QSPI, UART(3)

.65 mm

S-PBGA-B367

e1

TI380FPAAFNLR

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

J BEND

52

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.25 V

CHIP CARRIER

4.75 V

70 Cel

0 Cel

QUAD

4.57 mm

19.13 mm

19.13 mm

CMOS

5 V

1.27 mm

S-PQCC-J52

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.