SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	PWM Channels	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
XCVM1802-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V					GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		4 mm	45 mm						45 mm	CMOS	.7 V				.92 mm	S-PBGA-B2197			e1
XCVM1802-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V					GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		4 mm	45 mm						45 mm	CMOS	.8 V				.92 mm	S-PBGA-B2197			e1
XCVP1202-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V					GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel			BOTTOM		4.48 mm	50 mm						50 mm	CMOS	.8 V				.92 mm	S-PBGA-B2785
XCVP1202-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V					GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel			BOTTOM		4.48 mm	50 mm						50 mm	CMOS	.8 V				.92 mm	S-PBGA-B2785
XCVP1402-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V					GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel			BOTTOM		4.48 mm	50 mm						50 mm	CMOS	.8 V				.92 mm	S-PBGA-B2785
XCVP1502-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V					GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel			BOTTOM		4.48 mm	50 mm						50 mm	CMOS	.8 V				.92 mm	S-PBGA-B2785
XCVP1702-1MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V					GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel			BOTTOM		4.48 mm	55 mm						55 mm	CMOS	.8 V				.92 mm	S-PBGA-B3340
XCVP1802-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT		BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V					GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel			BOTTOM		4.55 mm	70 mm						70 mm	CMOS	.8 V				.92 mm	S-PBGA-B5601
XQ7Z045-1RFG676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY			125 Cel	-40 Cel			BOTTOM		3.37 mm	27 mm				NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS					1 mm	S-PBGA-B676
XQZU7EV-1FFRB900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V					GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM		3.71 mm	31 mm					225	31 mm	CMOS	.85 V				1 mm	S-PBGA-B900	4		e0
XQZU7EV-L1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V					GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM		3.71 mm	31 mm					225	31 mm	CMOS	.85 V				1 mm	S-PBGA-B900	4		e0
CY8C4146LQE-S423	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm	6 mm						6 mm	CMOS	1.8 V				.5 mm	S-XQCC-N40	3		e4
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V					GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.55 mm	25 mm				30	245	25 mm	CMOS	1.05 V				.8 mm	S-PBGA-B900	4		e1
A2F200M3F-1CSG288	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.425 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM										CMOS	1.5 V					S-PBGA-B288	3
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel			BOTTOM		1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V			SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel			BOTTOM		1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V			SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V			SPI; UART	.8 mm	S-PBGA-B349	3
AGB75LC04-QU-E	Amulet Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V					FLATPACK, FINE PITCH	QFP208,1.2SQ,20	1.08 V	85 Cel	-40 Cel			QUAD		4.1 mm	28 mm						28 mm	CMOS	1.2 V				.5 mm	S-PQFP-G208	3
AR9331-AL1A	Qualcomm	MICROPROCESSOR CIRCUIT		NO LEAD	148	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V					BOTTOM		.9 mm	12 mm						12 mm	CMOS	1.2 V				.5 mm	S-PBCC-N148
AT97SC3204-X2MA-20	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES			0	NO	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		70 Cel	0 Cel	MATTE TIN	NO	QUAD	NO	.9 mm	6 mm		0				6 mm	CMOS	3.3 V	NO	EEPROM		.5 mm	S-XQCC-N40			e3	0
ATMXT1067TD-ABRI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	3.14 V	105 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	3.3 V				.4 mm	S-PQFP-G128	3
ATMXT224E-MAHR030	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.47 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	-40 Cel			QUAD		.6 mm	7 mm						7 mm	CMOS	1.8 V				.4 mm	S-PQCC-N48
ATMXT224T-CCU027	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,8X8,20	3 V	85 Cel	-40 Cel			BOTTOM		.6 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-PBGA-B64
ATMXT540E-ATR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V					FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	2.57 V	85 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	2.7 V				.5 mm	S-PQFP-G100
ATMXT640T-CCU035	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,20	3 V	85 Cel	-40 Cel			BOTTOM		.6 mm	6 mm						6 mm	CMOS	3.3 V				.5 mm	S-PBGA-B84
ATMXT641TD-ABR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	105 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	3.3 V				.5 mm	S-PQFP-G100
ATSAM4C32CA-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN		QUAD		1.6 mm	14 mm				40	260	14 mm	CMOS	1.2 V				.5 mm	S-PQFP-G100	3		e3
ATWILC1000B-MU-Y	Microchip Technology	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		85 Cel	-40 Cel	MATTE TIN		QUAD		1 mm	5 mm						5 mm	CMOS	1.1 V				.4 mm	S-XQCC-N40
ATWINC1510B-MU-Y042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN		QUAD		1 mm	5 mm			48 MHz			5 mm	CMOS	3.3 V				.4 mm	S-PQCC-N40			e3
BT252KPJ20	Conexant Systems	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V					CHIP CARRIER		4.75 V	70 Cel	0 Cel			QUAD		4.57 mm	16.5862 mm						16.5862 mm	CMOS	5 V				1.27 mm	S-PQCC-J44	1	Not Qualified
CC-WMX-L87C-TE	Digi International	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES						GRID ARRAY			85 Cel	-40 Cel			BOTTOM			50 mm						50 mm	CMOS					2 mm	S-XBGA-N400
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel			BOTTOM		.8 mm	7 mm	3.3V NOM SUPPLY ALSO AVAILABLE					7 mm	CMOS	1.8 V			I2C, QSPI, UART	.65 mm	S-PBGA-B84
CN5020-500BG564-SCP-G	Marvell Technology	MICROPROCESSOR CIRCUIT		BALL	564	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY							BOTTOM										CMOS						S-PBGA-B564
CY8C4024LQI-S413	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN		QUAD		.6 mm	6 mm						6 mm	CMOS	1.8 V				.5 mm	S-XQCC-N40	3
CY8C4125LQS-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.9 mm	7 mm						7 mm	CMOS	1.8 V				.5 mm	S-XQCC-N40	3		e4
CY8C4146LQE-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm	6 mm						6 mm	CMOS	1.8 V				.5 mm	S-XQCC-N40	3		e4
CY8C4147LQS-S473	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN		QUAD		.6 mm	6 mm						6 mm	CMOS	3.3 V				.5 mm	S-XQCC-N40	3
D2-92683-QR	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN		QUAD		.9 mm	10 mm				30	260	10 mm	CMOS	1.8 V				.5 mm	S-PQCC-N72	3		e3
DLPC350ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	3.465 V					GRID ARRAY		3.135 V	85 Cel	0 Cel			BOTTOM		2.36 mm	23 mm				NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS	3.3 V				1 mm	S-PBGA-B419				14
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100				GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V			I2C; SPI; UART	.65 mm	S-PBGA-B367	3		e1
EFR32BG13P532F512GM48-DR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32BG13P632F512GM32-DR	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	-40 Cel			QUAD		.9 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-XQCC-N32
EFR32FG12P231F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel			QUAD		.9 mm	8 mm						8 mm	CMOS	1.8 V				.4 mm	S-XQCC-N68
EFR32FG1P131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32FG1P131F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32FG1P133F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32FG1V131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32MG13P732F512GM32-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	-40 Cel			QUAD		.9 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-XQCC-N32

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.