SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
10AS048E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			29 mm			TSMC		.9 V			1 mm	S-PBGA-B780
88AP162-B0-BJD2C004	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V	85 Cel		-25 Cel			BOTTOM										CMOS
88AP168-B0-BJD2C010	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V						BOTTOM										CMOS
AS82527F8	Intel		AUTOMOTIVE	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES				5	FLATPACK	QFP44,.5SQ,32		125 Cel		-40 Cel			QUAD										CMOS	50 mA	5 V	Other uPs/uCs/Peripheral ICs		.8 mm	S-PQFP-G44		Not Qualified
AT43USB326-AU	Atmel	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES				5	FLATPACK	QFP48,.35SQ,20		85 Cel		-40 Cel			QUAD											40 mA	5 V	Other Microprocessor ICs		.5 mm	S-PQFP-G48		Not Qualified
CY8C20647S-24LQXI	Cypress Semiconductor	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	.6 mm	16384	6 mm		30	260	6 mm		2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.4 mm	S-XQCC-N48	3	Not Qualified	25.2 rpm	e4
CY8C3445AXI-104	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm		14 mm		40	260	14 mm	32768 Bits		CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.5 mm	S-PQFP-G100	3	Not Qualified		e4
CY8C6245AZI-S3D72	Infineon Technologies	SoC		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		14 mm				14 mm			CMOS		1.8 V			.5 mm	S-PQFP-G100	3
CYAT81688-100AA77	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V				FLATPACK		1.71 V	85 Cel		-40 Cel			QUAD				IT ALSO OPERATES IN 3V TO 5.5V ANALOG SUPPLY						CMOS						S-PQFP-G100
CYPD3123-40LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		6 mm				6 mm			CMOS		3.3 V			.5 mm	S-XQCC-N40	3			e4
CYTMA445-44LQI33ABA	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		NO LEAD	44	QCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER								QUAD										CMOS						S-XQCC-N44
E705204	Elo Touch Solutions	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES					FLATPACK			70 Cel		0 Cel			QUAD				IT ALSO OPERATES AT 5V SUPPLY VOLTAGE	NOT SPECIFIED	NOT SPECIFIED				CMOS		3.3 V				S-PQFP-G64
EFR32FG12P231F1024GM68-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		8 mm				8 mm			CMOS		1.8 V			.4 mm	S-XQCC-N68
EFR32FG12P433F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		1.8 V			.5 mm	S-XQCC-N48
EFR32FG1P131F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm		5 mm				5 mm			CMOS		3.3 V			.5 mm	S-XQCC-N32
EFR32FG23A010F512GM48-C	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel		-40 Cel			QUAD	.9 mm		6 mm				6 mm			CMOS		3.3 V			.4 mm	S-XQCC-N48
EFR32MG1B132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm		5 mm				5 mm			CMOS		3.3 V			.5 mm	S-XQCC-N32
EFR32MG1B132F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		3.3 V			.5 mm	S-XQCC-N48
EFR32MG24A010F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		6 mm				6 mm			CMOS		3 V			.4 mm	S-XQCC-N48
EFR32MG24A410F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		5 mm				5 mm			CMOS		3 V			.4 mm	S-XQCC-N40
EFR32MG24B010F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		6 mm				6 mm			CMOS		3 V			.4 mm	S-XQCC-N48
EFR32MG24B020F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		6 mm				6 mm			CMOS		3 V			.4 mm	S-XQCC-N48
EFR32MG24B020F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		6 mm				6 mm			CMOS		3 V			.4 mm	S-XQCC-N48
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm		40	260	21 mm			CMOS		1.4 V			.8 mm	S-PBGA-B624	3			e1
SC2200UCL-266	National Semiconductor			BALL	432	BGA	SQUARE	PLASTIC/EPOXY	YES				1.8,3.3	GRID ARRAY	BGA432,31X31,50					TIN LEAD		BOTTOM					30	220				CMOS			Other Microprocessor ICs		1.27 mm	S-PBGA-B432	3	Not Qualified		e0
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm		17 mm		30	260	17 mm			CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B400	3	Not Qualified		e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm		23 mm		30	250	23 mm			CMOS		.72 V			.8 mm	S-PBGA-B784	4			e1
XC7Z045-3FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel			BOTTOM	3.24 mm		27 mm				27 mm			CMOS		1 V			1 mm	S-PBGA-B900
XCVC1902-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm		45 mm				45 mm			CMOS		.8 V			.92 mm	S-PBGA-B2197				e1
XCVP1502-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel		0 Cel			BOTTOM	4.48 mm		50 mm				50 mm			CMOS		.88 V			.92 mm	S-PBGA-B2785
XCZU2EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	250				CMOS		.85 V				S-PBGA-B784	4			e1
XQ7Z020-1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel		-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm		19 mm		30	225	19 mm			CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B484	3	Not Qualified		e0
XQ7Z020-1CL484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel		-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm		19 mm		30	225	19 mm			CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B484	3	Not Qualified		e0
XQZU3EG-1SFRA484M	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.35 mm		19 mm		40	245	19 mm			CMOS		.85 V			.8 mm	S-PBGA-B484	4			e0
10AS016E4F27E3LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		27 mm				27 mm			TSMC		.9 V			1 mm	S-PBGA-B672
10AS027H2F34E2LG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			35 mm			TSMC		.9 V			1 mm	S-PBGA-B1152
10AS032E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		29 mm				29 mm			TSMC		.9 V			1 mm	S-PBGA-B780
10AS057K2F40E1HG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY	BGA1517,39X39,40		100 Cel		0 Cel			BOTTOM	3.5 mm		40 mm				40 mm			TSMC					1 mm	S-PBGA-B1517
10AS066H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		35 mm				35 mm			TSMC		.9 V			1 mm	S-PBGA-B1152
88AP270MA2-BGO2C624	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V			1.8/3.3			1.8 V	85 Cel		-25 Cel	TIN SILVER COPPER		BOTTOM										CMOS			Graphics Processors					Not Qualified		e8
88AP270MA2-BHE1E416	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V			1.8/3.3			1.8 V				TIN SILVER COPPER		BOTTOM										CMOS			Graphics Processors					Not Qualified		e1
88AP310-B1-BGK2C806-TN02	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V	85 Cel		-25 Cel			BOTTOM										CMOS
88AP320-C0-BGR2C624-TN20	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V	85 Cel		-25 Cel			BOTTOM										CMOS
88AP320-C0-BGR2C624-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V	85 Cel		-25 Cel	TIN SILVER COPPER		BOTTOM										CMOS										e1
88AP320-C0-BGR2C806-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V	85 Cel		-25 Cel	TIN SILVER COPPER		BOTTOM										CMOS										e1
88AP320-C0-BGR2C806-TN31	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V	85 Cel		-25 Cel			BOTTOM										CMOS
AC5520/SLH3P	Intel			BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES				1.1,1.5,1.8	GRID ARRAY	BGA1295,36X36,40							BOTTOM													Other Microprocessor ICs		1 mm	S-PBGA-B1295		Not Qualified
AF82801IEM/SLB8P	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES				1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40							BOTTOM											308 mA		Other Microprocessor ICs		1 mm	S-PBGA-B676		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.