SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
ECE1200-I/LD	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	85 Cel		-40 Cel			QUAD	.9 mm			5 mm						5 mm		CMOS		1.8 V				.4 mm	S-PQCC-N40
EFR32BG24A010F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm			6 mm						6 mm		CMOS		3 V				.4 mm	S-XQCC-N48
EFR32BG24A020F1024IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm			5 mm						5 mm		CMOS		3 V				.4 mm	S-XQCC-N40
EFR32BG24A020F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm			5 mm						5 mm		CMOS		3 V				.4 mm	S-XQCC-N40
EFR32BG24B110F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm			6 mm						6 mm		CMOS		3 V				.4 mm	S-XQCC-N48
FCM8531RQY	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V				FLATPACK, LOW PROFILE	QFP32,.35SQ,32	4.5 V	85 Cel		-40 Cel			QUAD	1.6 mm			7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS		5 V			I2C; SPI; UART	.8 mm	S-PQFP-G32
LS1021ASE7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER		BOTTOM	2.07 mm			19 mm				40	260	19 mm		CMOS		1 V				.8 mm	S-PBGA-B525	3			e1
MCIMX27VOP4AR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25	1.38 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm			17 mm	ALSO OPERATES 1.3V AT 266MHZ			40	260	17 mm		CMOS		1.45 V				.65 mm	S-PBGA-B404	3			e1
MCIMX280CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS		1.45 V				.8 mm	S-PBGA-B289	3	Not Qualified		e1
MCIMX286CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel			BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS		1.45 V				.8 mm	S-PBGA-B289	3
MCIMX353CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm		CMOS		1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX353DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm		CMOS		1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX357CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm		CMOS		1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX357DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm		CMOS		1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX534AVV8CR2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM	1.85 mm			19 mm				40	260	19 mm		CMOS		1.1 V				.8 mm	S-PBGA-B529	3			e2
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel			BOTTOM	2.16 mm			21 mm				40	260	21 mm		CMOS		1.4 V				.8 mm	S-PBGA-B624	3
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm			21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm		CMOS		1.4 V				.8 mm	S-PBGA-B624	3			e1
MCIMX6X1CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm			17 mm				40	260	17 mm		CMOS						.8 mm	S-PBGA-B400	3			e1
MCIMX6X1EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.53 mm			17 mm				40	260	17 mm		CMOS						.8 mm	S-PBGA-B400	3			e1
MCIMX6X3EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			14 mm				40	260	14 mm		CMOS						.65 mm	S-PBGA-B400	3			e1
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel		0 Cel			BOTTOM	1.32 mm			14 mm				40	260	14 mm		CMOS						.8 mm	S-PBGA-B289	3
MEC1521H-B0-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel		-40 Cel			BOTTOM	.8 mm			9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm		CMOS		1.8 V			I2C, ESPI, UART	.65 mm	S-PBGA-B144
MEC1521H-B0-I/SZ-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel		-40 Cel			BOTTOM	.8 mm			9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm		CMOS		1.8 V			I2C, ESPI, UART	.65 mm	S-PBGA-B144
MKW41Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD								40	260			CMOS		3.3 V					S-XQCC-N48	3			e4
MPC8548ECHXAQG	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V			1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)		BOTTOM	3.38 mm			29 mm				40	260	29 mm		CMOS		1.1 V	Microprocessors			1 mm	S-CBGA-B783	1	Not Qualified		e0
MPC8548ECHXAUJ	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V			1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)		BOTTOM	3.38 mm			29 mm				40	260	29 mm		CMOS		1.1 V	Microprocessors			1 mm	S-CBGA-B783	1	Not Qualified		e0
MPFS025T-1FCVG484E	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		0 Cel			BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V				.8 mm	S-PBGA-B484
MPFS025T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V				.8 mm	S-PBGA-B484
MPFS095T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		0 Cel			BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm		CMOS		1 V				.5 mm	S-PBGA-B536
MPFS095T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V				.8 mm	S-PBGA-B484
MPFS160T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V				.8 mm	S-PBGA-B484
MPFS160T-1FCVG784E	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel		0 Cel			BOTTOM	2.92 mm			23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm		CMOS		1 V				.8 mm	S-PBGA-B784
MPFS160TS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V				.8 mm	S-PBGA-B484
MSP430F67471IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	262144	32	14 mm		0		30	260	14 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67641AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm		8	14 mm		0		30	260	14 mm	8192	CMOS		3.3 V			I2C; SPI; UART	.5 mm	S-PQFP-G100	3			e4
MSP430F6778IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	16	14 mm		0	25 MHz	30	260	14 mm	16384	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
NT3H1201W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER		1.7 V	95 Cel		-40 Cel			QUAD	.5 mm			1.6 mm					260	1.6 mm		CMOS							S-PQCC-N8	1
OMAPL138EZWTA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
SLB9645VQ12FW13333XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.62 V	85 Cel		-20 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD	.9 mm			5 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE					5 mm		CMOS		1.8 V				.5 mm	S-PQCC-N32	3
ST33HTPH2X32AHC5	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel			QUAD	1 mm			5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY					5 mm		CMOS		1.8 V				.5 mm	S-XQCC-N32
STM32W108HBU61TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			32	1.25,1.8,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	CORTEX-M3	-40 Cel	MATTE TIN		QUAD		131072						30	260		8192	CMOS	150 mA		Microcontrollers	FLASH		.5 mm	S-PQCC-N40	3	Not Qualified	24 rpm	e3
STWBCTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel		-40 Cel			QUAD	1 mm			5 mm						5 mm		CMOS		5 V				.5 mm	S-XQCC-N32
TDA4AL88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262			GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel		-40 Cel			BOTTOM	2.57 mm			23 mm						23 mm		CMOS		.8 V				.8 mm	S-PBGA-B770	3		2000 rpm
VCBU65WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm		32		30	260	13 mm		CMOS		1.35 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
VS3673UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm		32		30	260	13 mm		CMOS		1.35 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
XC7Z012S-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm			19 mm						19 mm		CMOS		1 V				.8 mm	S-PBGA-B485
XCZU5CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM								30	250			CMOS		.85 V					S-PBGA-B784	4			e1
XCZU5CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	3.32 mm			23 mm				30	250	23 mm		CMOS		.85 V				.8 mm	S-PBGA-B784	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.