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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
MCIMX6U5EVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			21 mm				40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
MCIMX6Y7DVK05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel		0 Cel			BOTTOM	1.23 mm			9 mm				40	260	9 mm		CMOS						.5 mm	S-PBGA-B272	3
MPFS095TLS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V				.8 mm	S-PBGA-B484
MSP430F67491IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	32	14 mm		0		30	260	14 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
OMAPL138EZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B361	3		456 rpm	e1
XQ7Z100-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel			BOTTOM	3.44 mm			31 mm				NOT SPECIFIED	NOT SPECIFIED	31 mm		CMOS						1 mm	S-PBGA-B900
80312	Intel	MICROPROCESSOR CIRCUIT		BALL	540	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY		3 V						BOTTOM	4.1 mm			42.5 mm						42.5 mm		CMOS		3.3 V				1.27 mm	S-PBGA-B540		Not Qualified
A2F200M3F-FG484	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY		1.425 V	85 Cel		0 Cel	TIN LEAD		BOTTOM												CMOS		1.5 V					S-PBGA-B484	3
CY8C4147AZE-S475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm			10 mm						10 mm		CMOS		3.3 V				.5 mm	S-PQFP-G64	3
EFR32FG12P431F1024GM68-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm			8 mm				30	260	8 mm		CMOS		1.8 V				.4 mm	S-XQCC-N68	3
MCIMX233DJM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	169	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA169,13X13,32	1 V	70 Cel		-10 Cel	TIN SILVER COPPER		BOTTOM	1.43 mm			11 mm				40	260	11 mm		CMOS		1.35 V				.8 mm	S-PBGA-B169	3			e1
MCIMX286DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS		1.45 V				.8 mm	S-PBGA-B289	3			e1
MCIMX6S5DVM10ABR	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			21 mm				40	260	21 mm		CMOS			Graphics Processors			.8 mm	S-PBGA-B624	3	Not Qualified		e1
MCIMX6X4EVM10AB	NXP Semiconductors	SoC	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.52 mm			19 mm				40	260	19 mm		CMOS						.8 mm	S-PBGA-B529	3			e1
MCIMX6Y2CVK08AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.325 V	105 Cel		-40 Cel			BOTTOM	1.23 mm			9 mm				40	260	9 mm		CMOS						.5 mm	S-PBGA-B272	3
MKW21Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD								40	260			CMOS		3.3 V					S-XQCC-N48	3			e4
MPFS095T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel		-40 Cel			BOTTOM	2.92 mm			23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm		CMOS		1 V				.8 mm	S-PBGA-B784
RF430FRL154HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY	YES					CHIP CARRIER, VERY THIN PROFILE			70 Cel		0 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm			4 mm	IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE	0		30	260	4 mm		CMOS					I2C; SPI	.5 mm	S-PQCC-N24	2			e4
SLS32AIA010MKUSON10XTMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel		-25 Cel			DUAL	.6 mm			3 mm						3 mm		CMOS		3.3 V				.5 mm	S-PDSO-N10
TCI6630K2LSCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4			e1
TCI6630K2LSCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4			e1
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm			23 mm						23 mm		CMOS		1 V				1 mm	S-PBGA-B484
XCVC1902-2HSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.854 V	110 Cel		-40 Cel			BOTTOM	4 mm			40 mm						40 mm		CMOS		.88 V				.92 mm	S-PBGA-B1760
XCVC1902-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm			45 mm						45 mm		CMOS		.7 V				.92 mm	S-PBGA-B2197				e1
XUF216-512-TQ128-I20A	Xmos	MICROPROCESSOR CIRCUIT		GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.95 V	85 Cel		-40 Cel			QUAD	1.2 mm			14 mm						14 mm		CMOS		1 V				.4 mm	S-PQFP-G128
10AS048H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm			35 mm						35 mm		TSMC		.9 V				1 mm	S-PBGA-B1152
10AS066H2F34I1HG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY	BGA1152,34X34,40		100 Cel		-40 Cel			BOTTOM	3.35 mm			35 mm						35 mm		TSMC						1 mm	S-PBGA-B1152
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.56 mm			21 mm				30	260	21 mm		CMOS		.9 V				.8 mm	S-PBGA-B625	3			e1
A2F200M3F-1FG484I	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY		1.425 V	100 Cel		-40 Cel	TIN LEAD		BOTTOM												CMOS		1.5 V					S-PBGA-B484	3
A7101CHTK2/T0BC2BJ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel		-25 Cel			DUAL	1 mm			4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY				260	4 mm		CMOS		1.8 V				.8 mm	S-PDSO-N8	1
ADSP-SC583CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm			19 mm			500 MHz	30	260	19 mm		CMOS		1.1 V			SPI; UART	.8 mm	S-PBGA-B349	3			e1
AM4378BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			17 mm				30	260	17 mm		CMOS		1.26 V				.65 mm	S-PBGA-B491	3			e1
AM6232ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM	.89 mm			13 mm						13 mm		CMOS		.75 V				.5 mm	S-PBGA-B425
AM6234ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM	.89 mm			13 mm						13 mm		CMOS		.75 V				.5 mm	S-PBGA-B425
AM6251ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM	.89 mm			13 mm						13 mm		CMOS		.75 V				.5 mm	S-PBGA-B425
ATMXT641TD-ATR081	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949			FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	85 Cel		-40 Cel			QUAD	1.2 mm			14 mm						14 mm		CMOS		3.3 V				.5 mm	S-PQFP-G100
ATMXT641TD-ATRVA1	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100; TS 16949			FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ		85 Cel		-40 Cel			QUAD	1.2 mm			14 mm						14 mm		CMOS		3.3 V				.5 mm	S-PQFP-G100
ATWILC1000B-UU-T	Microchip Technology	SoC		BALL	55	VFBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA55,8X8,14		85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	.589 mm			3.24 mm						3.24 mm		CMOS		1.1 V				.35 mm	S-PBGA-B55
CC1310F64RGZ	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V						QUAD	1 mm			7 mm						7 mm		CMOS						.5 mm	S-PQCC-N48
CC430F6147IRGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD SILVER	YES	QUAD	1 mm	32768	4	9 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	0	20 MHz	30	260	9 mm	4096	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N64	3	Not Qualified	20 rpm	e4
CY8C21323-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	4.75 V	85 Cel		-40 Cel	Matte Tin (Sn)		QUAD	1 mm			4 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			20	260	4 mm		CMOS		5 V	Microcontrollers			.5 mm	S-XQCC-N24	3	Not Qualified		e3
CY8C4045LQI-S411T	Infineon Technologies	PSoC		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm			4 mm				30	260	4 mm		CMOS		1.8 V				.5 mm	S-XQCC-N24	3			e4
CY8C4045LQI-S412	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	.6 mm			5 mm						5 mm		CMOS		1.8 V				.5 mm	S-XQCC-N32	3
CY8C4045LQI-S413	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	.6 mm			6 mm						6 mm		CMOS		1.8 V				.5 mm	S-XQCC-N40	3
CY8C6144AZI-S4F92	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel		-40 Cel			QUAD	1.6 mm			10 mm						10 mm		CMOS		1.8 V				.5 mm	S-PQFP-G64	3
CY8C6244LQI-S4D92	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel		-40 Cel			QUAD	1 mm			8 mm						8 mm		CMOS		1.8 V				.4 mm	S-XQCC-N68	3
CYPD3125-40LQXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	21.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm			6 mm						6 mm		CMOS		3.3 V				.5 mm	S-XQCC-N40	3			e4
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V				GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel		0 Cel			BOTTOM	2.42 mm			27 mm		16	20 MHz			27 mm		CMOS		1.15 V			I2C; SPI; UART; USB	1 mm	S-PBGA-B516					9

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.