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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
DM355SDZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O		32		30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
MPFS250TFCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		0 Cel			BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS		1 V				.8 mm		S-PBGA-B484
MSP430F67641AIPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm		8	12 mm			0		30	260	12 mm	8192	CMOS		3.3 V			I2C; SPI; UART	.5 mm		S-PQFP-G80	3			e4
TCI6630K2LXCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM									30	245			CMOS		.95 V						S-PBGA-B900	4			e1
TDA8029HL/C207	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	6 V				FLATPACK, LOW PROFILE		2.7 V	90 Cel		-40 Cel			QUAD	1.6 mm			7 mm							7 mm		CMOS		3.3 V				.8 mm		S-PQFP-G32
XCVM1802-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	4 mm			40 mm							40 mm		CMOS		.8 V				.92 mm		S-PBGA-B1760				e1
ADSP-SC589-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V						BOTTOM	1.5 mm			19 mm							19 mm		CMOS		1.1 V				.8 mm		S-PBGA-B529
AM68A72AHGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel		-40 Cel			BOTTOM	2.57 mm			23 mm							23 mm		CMOS		.8 V				.8 mm		S-PBGA-B770
AM68A72ATGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel		-40 Cel			BOTTOM	2.57 mm			23 mm					30	260	23 mm		CMOS		.8 V				.8 mm		S-PBGA-B770	3
OMAPL138EZCED4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
TCI6630K2LXCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM									30	245			CMOS		.95 V						S-PBGA-B900	4			e1
TMS320DM365ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		8192	13 mm			32		30	260	13 mm		CMOS		1.2 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
AM6421BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM	2.652 mm			17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS		.75 V				.8 mm		S-PBGA-B441
ATSAM4C8CB-AUT	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel		-40 Cel			QUAD	1.2 mm			14 mm							14 mm		CMOS		1.2 V				.5 mm		S-PQFP-G100
ATSAM4C8CB-AUTR	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel		-40 Cel			QUAD	1.2 mm			14 mm							14 mm		CMOS		1.2 V				.5 mm		S-PQFP-G100
MCIMX283DVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V				.8 mm		S-PBGA-B289	3			e1
MCIMX6S5DVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			21 mm					40	260	21 mm		CMOS						.8 mm		S-PBGA-B624	3			e1
ADSP-21583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm			19 mm				500 MHz	30	260	19 mm		CMOS		1.1 V			SPI; UART	.8 mm		S-PBGA-B349	3			e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			17 mm					30	260	17 mm		CMOS		.95 V				.65 mm		S-PBGA-B491	3			e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3			e1
ATMXT640U-CCU023	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V	TS 16949			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	2.7 V	85 Cel		-40 Cel			BOTTOM	.6 mm			6 mm					30	260	6 mm		CMOS		3.3 V				.5 mm		S-PBGA-B88
CC430F5145IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F6147IRGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD SILVER	YES	QUAD	1 mm	32768	4	9 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		0	20 MHz	30	260	9 mm	4096	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N64	3	Not Qualified	20 rpm	e4
D2-71083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V				FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-10 Cel	MATTE TIN		QUAD	1.6 mm			14 mm					30	260	14 mm		CMOS		1.8 V				.4 mm		S-PQFP-G128	3			e3
DLPC3439CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM	1 mm			13 mm					30	260	13 mm		CMOS		1.1 V				.8 mm		S-PBGA-B201	3			e1
DRA821U4TCBALMRQ1	Texas Instruments	SoC		BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel		-40 Cel			BOTTOM	2.57 mm			17.2 mm						250	17.2 mm		CMOS		.8 V				.8 mm		S-PBGA-B433	3		2000 rpm
IS2083BM-232	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel		-40 Cel			BOTTOM	.9 mm			5.5 mm							5.5 mm		CMOS		1.2 V				.5 mm		S-PBGA-B82
IS2083BM-232-TRAY	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel		-40 Cel			BOTTOM	.9 mm			5.5 mm							5.5 mm		CMOS		1.2 V				.5 mm		S-PBGA-B82
MCIMX233DAG4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	70 Cel		-10 Cel	TIN		QUAD	1.6 mm			14 mm					40	260	14 mm		CMOS		1.35 V				.4 mm		S-PQFP-G128	3			e3
MCIMX357CJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V				40	260	17 mm		CMOS		1.8 V				.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX6U8DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			21 mm					40	260	21 mm		CMOS						.8 mm		S-PBGA-B624	3			e1
MCIMX6X1EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			14 mm					40	260	14 mm		CMOS						.65 mm		S-PBGA-B400	3			e1
MSP430F67761IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	262144	16	14 mm			0		30	260	14 mm	16384	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
RF430FRL153HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY	YES					CHIP CARRIER, VERY THIN PROFILE			70 Cel		0 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm			4 mm	IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE		0		30	260	4 mm		CMOS					I2C; SPI	.5 mm		S-PQCC-N24	2			e4
XC7Z100-1FFG1156C	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA1156,34X34,40	.95 V	85 Cel		0 Cel			BOTTOM	3.1 mm			35 mm							35 mm		CMOS		1 V				1 mm		S-PBGA-B1156
AM6254ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM	.89 mm			13 mm							13 mm		CMOS		.75 V				.5 mm		S-PBGA-B425
AM6441BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM	2.652 mm			17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS		.75 V				.8 mm		S-PBGA-B441
AM6441BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM	2.652 mm			17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS		.75 V				.8 mm		S-PBGA-B441
ATMXT1189TD-ABRI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel		-40 Cel			QUAD	1.6 mm			20 mm							20 mm		CMOS		3.3 V				.5 mm		S-PQFP-G144
ATWINC1500B-MU-T042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1 mm			5 mm				48 MHz			5 mm		CMOS		3.3 V				.4 mm		S-PQCC-N40				e3
ATWINC1500B-MU-Y042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1 mm			5 mm				48 MHz			5 mm		CMOS		3.3 V				.4 mm		S-PQCC-N40				e3
CC430F5123IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F5125IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F5143IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CY8C6137BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm			9 mm							9 mm		CMOS		1.8 V				.65 mm		S-PBGA-B124	3			e1
EFR32BG24B210F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm			6 mm							6 mm		CMOS		3 V				.4 mm		S-XQCC-N48
MCIMX27LMOP4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel		-40 Cel			BOTTOM	1.54 mm			19 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ				40	260	19 mm		CMOS		1.45 V				.8 mm		S-PBGA-B473	3	Not Qualified
MCIMX6D6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm			21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS						.8 mm		S-PBGA-B624	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.