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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MSP430F6767IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	262144	32	14 mm				0	25 MHz	30	260	14 mm	32768	CMOS	11.75 mA	3.3 V		Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
OMAPL138BZWTRB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	16 mm		CMOS		1.3 V					.8 mm		S-PBGA-B361	3			e1
OMAPL138CZWTA3RW	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm						30	260	16 mm		CMOS		1.2 V					.8 mm		S-PBGA-B361	3			e1
SE051A2HQ1/Z01XEZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel			QUAD		.33 mm			3 mm							260	3 mm		CMOS		1.8 V					.4 mm		S-XQCC-N20	1
TDA8035HN/C1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V				3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel		-25 Cel			QUAD		1 mm			5 mm							260	5 mm		CMOS	220 mA	3.3 V		Other Microprocessor ICs			.5 mm		S-PQCC-N32	1	Not Qualified
TMS320DM355DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm		IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O		32		30	260	13 mm		CMOS		1.3 V		Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM369ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		32768	13 mm				32		30	260	13 mm		CMOS				Digital Signal Processors		ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM6446AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		16384	16 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm		CMOS		1.2 V		Digital Signal Processors		I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMSDM6446AZWT-COM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm						30	260	16 mm		CMOS		1.2 V					.8 mm		S-PBGA-B361	3			e1
TNETV6446AINZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm						30	260	16 mm		CMOS		1.2 V					.8 mm		S-PBGA-B361	3			e1
UCD3138A64PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		NO			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO	1.2 mm	65536		12 mm	2K		COMPARATOR(7)	0	2 MHz	30	260	12 mm		CMOS		3.3 V	NO			I2C; SPI; UART	.5 mm		S-PQFP-G80	3			e4	8	43
XC7Z030-1FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM		2.54 mm			27 mm								27 mm		CMOS		1 V					1 mm		S-PBGA-B676
XC7Z045-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM		2.54 mm			27 mm								27 mm		CMOS		1 V					1 mm		S-PBGA-B676
XCZU4CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS		.85 V					.8 mm		S-PBGA-B784	4			e1
XTDA4VPXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V					GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel		0 Cel			BOTTOM		3.341 mm			31 mm								31 mm		CMOS		.8 V					.8 mm		S-PBGA-B1414
Z16C3010VEC	IXYS Corporation		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES					5	CHIP CARRIER	LDCC68,1.0SQ		85 Cel		-40 Cel			QUAD															CMOS	50 mA	5 V		Other uPs/uCs/Peripheral ICs			1.27 mm		S-PQCC-J68		Not Qualified
ZL30250LDF1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel		-40 Cel			QUAD		1 mm			5 mm		IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY						5 mm		CMOS		1.8 V					.5 mm		S-XQCC-N32
10AS057K4F40E3SG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V					GRID ARRAY	BGA1517,39X39,40	.87 V	100 Cel		0 Cel			BOTTOM		3.5 mm			40 mm								40 mm		TSMC		.9 V					1 mm		S-PBGA-B1517
AD6620ASZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel		-40 Cel	MATTE TIN		QUAD		3.4 mm			14 mm							260	14 mm		CMOS		3.3 V		DSP Peripherals			.65 mm		S-PQFP-G80	3	Not Qualified		e3
ATMXT1189TD-ABI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel		-40 Cel			QUAD		1.6 mm			20 mm								20 mm		CMOS		3.3 V					.5 mm		S-PQFP-G144
ATMXT1189TD-ABSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel		-40 Cel			QUAD		1.6 mm			20 mm								20 mm		CMOS		3.3 V					.5 mm		S-PQFP-G144
ATMXT1189TD-ATI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel		-40 Cel			QUAD		1.6 mm			20 mm								20 mm		CMOS		3.3 V					.5 mm		S-PQFP-G144
ATMXT1189TD-ATRSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel		-40 Cel			QUAD		1.6 mm			20 mm								20 mm		CMOS		3.3 V					.5 mm		S-PQFP-G144
ATMXT1189TD-ATSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel		-40 Cel			QUAD		1.6 mm			20 mm								20 mm		CMOS		3.3 V					.5 mm		S-PQFP-G144
ATSAM4C16CB-AUT	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V					FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel		-40 Cel			QUAD		1.2 mm			14 mm								14 mm		CMOS		1.2 V					.5 mm		S-PQFP-G100
CC2540TF256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm						30	260	6 mm	8192	CMOS		3 V				SPI; USART; USB	.5 mm		S-PQCC-N40	3			e4		21
CY8C20237-24LKXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			8	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC16,.12SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm	8192		3 mm						30	260	3 mm	1024	CMOS	4 mA	3.3 V		Microcontrollers	FLASH		.5 mm		S-XQCC-N16	3	Not Qualified	25.2 rpm	e4
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V					GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel		0 Cel			BOTTOM		2.42 mm			27 mm				16	20 MHz			27 mm		CMOS		1.15 V				I2C; SPI; UART; USB	1 mm		S-PBGA-B516						9
DS3655B+	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	16	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY		3 V	85 Cel		-40 Cel			BOTTOM															CMOS		3.3 V							S-PBGA-B16	3
DS3655B+TRL	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	16	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY		3 V	85 Cel		-40 Cel			BOTTOM															CMOS		3.3 V							S-PBGA-B16	3
EFR32BG12P432F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD		.9 mm			7 mm								7 mm		CMOS		1.8 V					.5 mm		S-XQCC-N48
HPA01216RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			6 mm			TIMER(4)			30	260	6 mm	8192	CMOS		3 V					.5 mm		S-PQCC-N40	3			e4		23
MC13211	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm						30	250	9 mm		CMOS		2.7 V					.5 mm		S-PBGA-B71	3	Not Qualified		e4
MC68302EH16CB1	NXP Semiconductors		COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	YES						FLATPACK	SPQFP132,1.1SQ		70 Cel		0 Cel	TIN		QUAD											40	260			CMOS				Other uPs/uCs/Peripheral ICs			.635 mm		S-PQFP-G132	3	Not Qualified		e3
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel			BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V					.8 mm		S-PBGA-B289	3
MCIMX512CJM6CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V				1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			19 mm						40	260	19 mm		CMOS		1 V		Graphics Processors			.8 mm		S-PBGA-B529	3	Not Qualified		e1
MPC8247CVRTIEA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		2.55 mm			27 mm						30	245	27 mm		CMOS		1.5 V		Other uPs/uCs/Peripheral ICs			1 mm		S-PBGA-B516	3	Not Qualified		e2
MPFS250T-FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		0 Cel			BOTTOM		1.4 mm			16 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm		CMOS		1 V					.5 mm		S-PBGA-B536
NT3H1101W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER		1.7 V	95 Cel		-40 Cel			QUAD		.5 mm			1.6 mm							260	1.6 mm		CMOS									S-PQCC-N8	1
NT3H2211W0FTT	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.67 V	105 Cel		-40 Cel			DUAL		1.1 mm			3 mm								3 mm		CMOS		1.8 V					.65 mm		S-PDSO-G8
SLB9665VQ20FW563XUMA3	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel		-20 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD		.9 mm			5 mm								5 mm		CMOS		3.3 V					.5 mm		S-PQCC-N32	3
T1024NXN7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm			23 mm						30	250	23 mm		CMOS		1 V					.8 mm		S-PBGA-B780	3			e1
TMS320DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm				32		30	260	13 mm		CMOS		1.35 V				I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
WP32C2W6NFEI-400B2	Microchip Technology	MICROPROCESSOR CIRCUIT		BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY	BGA896(UNSPEC)					TIN SILVER COPPER		BOTTOM															CMOS									S-PBGA-B896				e1
XC7Z030-1SB485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM		2.44 mm			19 mm								19 mm		CMOS		1 V					.8 mm		S-PBGA-B485
XC7Z030-L2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM		2.44 mm			19 mm								19 mm		CMOS		1 V					.8 mm		S-PBGA-B485
XCVC1902-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V					GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		4 mm			45 mm								45 mm		CMOS		.8 V					.92 mm		S-PBGA-B2197				e1
LS1043AXE7MQB	NXP Semiconductors	SoC		BALL	621		SQUARE	PLASTIC/EPOXY	YES									105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.92 mm			21 mm						30	250	21 mm		CMOS							.8 mm		S-PBGA-B621	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.