SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MCIMX513DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm			40	260	19 mm		CMOS		1.1 V	Graphics Processors			.8 mm	S-PBGA-B529	3	Not Qualified		e1
NT3H1101W0FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.5 mm		1.6 mm					1.6 mm		CMOS						.5 mm	S-PQCC-N8	1			e4
10AS016E4F29I3LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		-40 Cel			BOTTOM	3.35 mm		29 mm					29 mm		TSMC		.9 V				1 mm	S-PBGA-B780
88AP270MA2-BHE1C520	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V			1.8/3.3			1.8 V	85 Cel		-25 Cel	TIN SILVER COPPER		BOTTOM										CMOS			Graphics Processors						Not Qualified		e1
EFR32MG24B010F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		6 mm					6 mm		CMOS		3 V				.4 mm	S-XQCC-N48
88AP270MA2-BHE1C416	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V			1.8/3.3			1.8 V	85 Cel		-25 Cel	TIN SILVER COPPER		BOTTOM										CMOS			Graphics Processors						Not Qualified		e1
EFR32FG12P433F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		8 mm					8 mm		CMOS		1.8 V				.4 mm	S-XQCC-N68
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel			BOTTOM	1.85 mm		19 mm					19 mm		CMOS		1.1 V				.8 mm	S-PBGA-B529
MCIMX27LVOP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ		40	260	17 mm		CMOS		1.45 V				.65 mm	S-PBGA-B404	3	Not Qualified		e1
LS1023ASN7KQB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	2.07 mm		21 mm			30	250	21 mm		CMOS		.9 V				.8 mm	S-PBGA-B621	3			e1
MCIMX515CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm			40	260	19 mm		CMOS		1 V	Graphics Processors			.8 mm	S-PBGA-B529	3	Not Qualified		e1
MCIMX6U7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE		40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
XCVM1402-1MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY	BGA1596,40X40,36	.775 V	100 Cel		0 Cel			BOTTOM	3.75 mm		37.5 mm					37.5 mm		CMOS		.8 V				.92 mm	S-PBGA-B1596
XQZU11EG-1FFRC1156M	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V				GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm		35 mm			40	245	35 mm		CMOS		.85 V				1 mm	S-PBGA-B1156	4			e0
CYB0644ABZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm		9 mm					9 mm		CMOS		1.8 V				.65 mm	S-PBGA-B124	3			e1
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm			40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
SA8155P	Qualcomm	SoC		BALL	989	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY			105 Cel		-40 Cel			BOTTOM										CMOS							S-PBGA-B989
10AS016E4F27E3SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		27 mm					27 mm		TSMC		.9 V				1 mm	S-PBGA-B672
CY8C20667S-24LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	M8C	-40 Cel	PURE TIN		QUAD	.6 mm	32768	6 mm			30	260	6 mm	2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH		.4 mm	S-XQCC-N48	3	Not Qualified	25.2 rpm
D2-71583-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V				FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-10 Cel	MATTE TIN		QUAD	1.6 mm		14 mm			30	260	14 mm		CMOS		1.8 V				.4 mm	S-PQFP-G128	3			e3
DH82QM87SR17C	Intel	MICROPROCESSOR CIRCUIT		UNSPECIFIED			SQUARE	UNSPECIFIED														UNSPECIFIED										CMOS
DS28E50Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	.8 mm		3 mm			30	260	3 mm		CMOS		3.3 V				.95 mm	S-PDSO-N6	1			e3
EFR32FG12P232F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm					7 mm		CMOS		1.8 V				.5 mm	S-XQCC-N48
EFR32FG12P431F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		8 mm					8 mm		CMOS		1.8 V				.4 mm	S-XQCC-N68
XCZU3CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)		30	250			CMOS		.72 V					S-PBGA-B784	4			e1
10AS016E3F27E2SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				27 mm		TSMC		.9 V				1 mm	S-PBGA-B672
ADSP-SC589KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel		0 Cel			BOTTOM	1.5 mm		19 mm		500 MHz	30	260	19 mm		CMOS		1.1 V			SPI; UART	.8 mm	S-PBGA-B349	3
CYPM1211-40LQXI	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2.7 V	105 Cel		-40 Cel			QUAD	.6 mm		6 mm					6 mm		CMOS		3.3 V				.5 mm	S-XQCC-N40	3
EM341-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel	MATTE TIN		QUAD	.9 mm		7 mm			40	260	7 mm		CMOS		1.25 V				.5 mm	S-PQCC-N48	2			e3
XCVP1202-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel		0 Cel			BOTTOM	4.48 mm		50 mm					50 mm		CMOS		.8 V				.92 mm	S-PBGA-B2785
XQZU28DR-1FFRE1156M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535			GRID ARRAY		.808 V	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM						40	245			CMOS		.85 V					S-PBGA-B1156	4			e0
10AS027E2F27E2LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				27 mm		TSMC		.9 V				1 mm	S-PBGA-B672
10AS027E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				29 mm		TSMC		.9 V				1 mm	S-PBGA-B780
88AP270MA2-BHE1E312	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V			1.8/3.3			1.8 V				TIN SILVER COPPER		BOTTOM										CMOS			Graphics Processors						Not Qualified		e1
EFR32FG12P231F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm					7 mm		CMOS		1.8 V				.5 mm	S-XQCC-N48
EFR32MG21B020F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		4 mm					4 mm		CMOS		3 V				.4 mm	S-XQCC-N32
EM3587-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.32 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm					7 mm		CMOS		1.25 V				.5 mm	S-PQCC-N48
MCIMX253DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY		40	260	17 mm		CMOS		1.45 V	Microprocessors			.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX287CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm		CMOS		1.45 V				.8 mm	S-PBGA-B289	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm			40	260	14 mm		CMOS						.8 mm	S-PBGA-B289	3
XA7Z020-1CLG400I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm		17 mm			30	260	17 mm		CMOS			Other uPs/uCs/Peripheral ICs			.8 mm	S-PBGA-B400	3	Not Qualified		e1
XCVC1902-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel		0 Cel			BOTTOM	4 mm		40 mm					40 mm		CMOS		.8 V				.92 mm	S-PBGA-B1760
XCVM1802-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	4 mm		45 mm					45 mm		CMOS		.8 V				.92 mm	S-PBGA-B2197				e1
XQ7Z030-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel		-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm		27 mm			30	225	27 mm		CMOS			Other uPs/uCs/Peripheral ICs			1 mm	S-PBGA-B676	4	Not Qualified		e0
XQ7Z045-1RF676I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY	BGA676,26X26,40					TIN LEAD	N	BOTTOM	3.37 mm		27 mm					27 mm		CMOS			Other uPs/uCs/Peripheral ICs			1 mm	S-PBGA-B676		Not Qualified		e0
XQZU3EG-1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel		-40 Cel	TIN LEAD		BOTTOM	3.52 mm		23 mm			20	220	23 mm		CMOS		.85 V				.8 mm	S-PBGA-B784	4			e0
10AS016C3U19E2LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel		0 Cel			BOTTOM	3.25 mm		19 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				19 mm		TSMC		.9 V				.8 mm	S-PBGA-B484
10AS016E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		29 mm					29 mm		TSMC		.9 V				1 mm	S-PBGA-B780

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.