SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
AF82801JD/SLG8T	Intel			BALL	676	BGA	SQUARE	PLASTIC	YES				1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40							BOTTOM										CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676		Not Qualified
CY8C20347-24LQXI	Cypress Semiconductor	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	.6 mm	16384	4 mm		30	260	4 mm		2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.5 mm	S-XQCC-N24	3	Not Qualified	25.2 rpm	e4
CY8C4024LQI-S401	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		4 mm		30	260	4 mm			CMOS		1.8 V			.5 mm	S-XQCC-N24	3			e4
CY8C4247LWA-M484	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.9 mm		8 mm		30	260	8 mm			CMOS		1.8 V			.5 mm	S-XQCC-N56	3			e4
CY8C5466LTI-063T	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/5	CHIP CARRIER	LCC68,.32SQ,16		85 Cel		-40 Cel		N	QUAD								524288 Bits		CMOS			Other Microprocessor ICs		.4 mm	S-PQCC-N68		Not Qualified
CY8C6144LQI-S4F92	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel		-40 Cel			QUAD	1 mm		8 mm				8 mm			CMOS		1.8 V			.4 mm	S-XQCC-N68	3
CY8CTMA461-48LQI	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		NO LEAD	48		SQUARE		YES	5.5 V						1.71 V						QUAD				IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY						CMOS						S-XQCC-N48
CYTMA445-44LQI33ABAT	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		NO LEAD	44	QCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER								QUAD										CMOS						S-XQCC-N44
EFR32BG12P232F1024GM68-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		8 mm				8 mm			CMOS		1.8 V			.4 mm	S-XQCC-N68
EFR32FG12P231F512GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		8 mm				8 mm			CMOS		1.8 V			.4 mm	S-XQCC-N68
EFR32FG12P431F1024GL125-C	Silicon Labs	SYSTEM ON CHIP		BALL	125	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.8 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA125,13X13,20	1.62 V	85 Cel		-40 Cel			BOTTOM	.94 mm		7 mm				7 mm			CMOS		1.8 V			.5 mm	S-PBGA-B125
EFR32FG12P431F1024GM48-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		1.8 V			.5 mm	S-XQCC-N48
EFR32FG12P431F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		1.8 V			.5 mm	S-XQCC-N48
EFR32FG12P431F1024IM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	125 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		1.8 V			.5 mm	S-XQCC-N48
EFR32FG1P133F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		3.3 V			.5 mm	S-XQCC-N48
EFR32MG13P732F512GM48-D	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel		-40 Cel	MATTE TIN		QUAD	.9 mm		7 mm		40	260	7 mm			CMOS		3.3 V			.5 mm	S-XQCC-N48	2			e3
EFR32MG13P732F512IM48-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.62 V	125 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		3.3 V			.5 mm	S-XQCC-N48
EFR32MG21B010F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		4 mm				4 mm			CMOS		3 V			.4 mm	S-XQCC-N32
EFR32MG24A010F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		6 mm				6 mm			CMOS		3 V			.4 mm	S-XQCC-N48
EFR32MG24A420F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		5 mm				5 mm			CMOS		3 V			.4 mm	S-XQCC-N40
EFR32MG24A420F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		6 mm				6 mm			CMOS		3 V			.4 mm	S-XQCC-N48
EFR32ZG23A010F512GM40-C	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	85 Cel		-40 Cel			QUAD	.9 mm		5 mm				5 mm			CMOS		3.3 V			.4 mm	S-XQCC-N40
EM3581-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.32 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		1.25 V			.5 mm	S-PQCC-N48
GL82CM238SR30U	Intel	MICROPROCESSOR CIRCUIT					SQUARE	UNSPECIFIED																								CMOS
LH7A400N0E000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES				1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel		0 Cel			BOTTOM													Other uPs/uCs/Peripheral ICs		.8 mm	S-XBGA-B256		Not Qualified
MPC8548VUAUJ	Freescale Semiconductor	SoC		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V			1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM	3.38 mm		29 mm		40	260	29 mm			CMOS		1.1 V	Microprocessors		1 mm	S-CBGA-B783	1	Not Qualified		e2
NQ6702PXHV/SL7X4	Intel			BALL	567	BGA	SQUARE	PLASTIC/EPOXY	YES				1.5,3.3	GRID ARRAY	BGA567,24X24,50							BOTTOM											2160 mA		Other uPs/uCs/Peripheral ICs		1.27 mm	S-PBGA-B567		Not Qualified
S6J32HELTNSC2D000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel		-40 Cel			QUAD	1.7 mm		24 mm				24 mm			CMOS		1.2 V			.4 mm	S-PQFP-G216
SI3459-B02-IM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD	.9 mm		8 mm		NOT SPECIFIED	NOT SPECIFIED	8 mm			CMOS		3.3 V			.5 mm	S-XQCC-N56
SI8250-IQ	Silicon Labs	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	2.75 V				FLATPACK, LOW PROFILE		2.25 V	125 Cel		-40 Cel			QUAD	1.6 mm		7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS		2.5 V			.8 mm	S-PQFP-G32		Not Qualified
SI8251-IQ	Silicon Labs	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	2.75 V				FLATPACK, LOW PROFILE		2.25 V	125 Cel		-40 Cel			QUAD	1.6 mm		7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS		2.5 V			.8 mm	S-PQFP-G32		Not Qualified
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.43 mm		21 mm		30	250	21 mm			CMOS		.85 V			.8 mm	S-PBGA-B625	3			e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm		23 mm		30	250	23 mm			CMOS		.85 V			.8 mm	S-PBGA-B784	4			e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm		23 mm		30	250	23 mm			CMOS		.85 V			.8 mm	S-PBGA-B784	4			e1
XC7Z010-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		0 Cel			BOTTOM	1.5 mm		13 mm				13 mm			CMOS		1 V			.8 mm	S-PBGA-B225
XC7Z030-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		27 mm				27 mm			CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM	3.24 mm		27 mm				27 mm			CMOS		1 V			1 mm	S-PBGA-B676
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM	3.24 mm		27 mm				27 mm			CMOS		1 V			1 mm	S-PBGA-B676
XC7Z045-1FFG900C	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel		0 Cel			BOTTOM	3.24 mm		27 mm				27 mm			CMOS		1 V			1 mm	S-PBGA-B900
XC7Z045-2FF900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.35 mm		31 mm				31 mm			CMOS		1 V			1 mm	S-PBGA-B900
XC7Z045-2FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel			BOTTOM	3.24 mm		27 mm				27 mm			CMOS		1 V			1 mm	S-PBGA-B900
XCVC1902-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm		45 mm				45 mm			CMOS		.7 V			.92 mm	S-PBGA-B2197				e1
XCVC1902-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	4 mm		45 mm				45 mm			CMOS		.8 V			.92 mm	S-PBGA-B2197				e1
XCVE1752-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm		45 mm				45 mm			CMOS		.8 V			.92 mm	S-PBGA-B2197				e1
XCVE2002-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V				GRID ARRAY		.676 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM										CMOS		.7 V				S-PBGA-B784				e1
XCVE2302-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.66 mm		23 mm				23 mm			CMOS		.8 V			.8 mm	S-PBGA-B784				e1
XCVM1102-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY		.775 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM										CMOS		.8 V				S-PBGA-B784				e1
XCVM1802-1LSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm		40 mm				40 mm			CMOS		.7 V			.92 mm	S-PBGA-B1760				e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.