SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	No. of Ports	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XCZU5CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM								IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250			CMOS			.72 V						S-PBGA-B784	4			e1
XCZU5EG-3SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY	BGA784,28X28,32	.873 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			3.32 mm			23 mm						30	250	23 mm		CMOS			.9 V					.8 mm	S-PBGA-B784	4			e1
10AS016C4U19I3LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V					GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel		-40 Cel			BOTTOM			3.25 mm			19 mm								19 mm		TSMC			.9 V					.8 mm	S-PBGA-B484
10AS032H3F35E2SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V					GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel		0 Cel			BOTTOM			3.35 mm			35 mm		ALSO OPERATES AT 0.95V NOMINAL SUPPLY						35 mm		TSMC			.9 V					1 mm	S-PBGA-B1152
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.56 mm			21 mm						30	260	21 mm		CMOS			1 V					.8 mm	S-PBGA-B625	3			e1
AM6234ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM			.89 mm			13 mm								13 mm		CMOS			.75 V					.5 mm	S-PBGA-B425
AM6254ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM			.89 mm			13 mm							250	13 mm		CMOS			.75 V					.5 mm	S-PBGA-B425	3
AM6412BKCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V					GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM			2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS			.75 V					.8 mm	S-PBGA-B441
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel		-40 Cel			BOTTOM			1 mm			7 mm								7 mm		CMOS			3.3 V					.65 mm	S-PBGA-B100
ATMXT640UD-CCU001	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	3.14 V	85 Cel		-40 Cel			BOTTOM			.6 mm			6 mm								6 mm		CMOS			3.3 V					.5 mm	S-PBGA-B88
ATSAM4C16CB-AUTR	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V					FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel		-40 Cel			QUAD			1.2 mm			14 mm								14 mm		CMOS			1.2 V					.5 mm	S-PQFP-G100
ATWINC1510B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD			1 mm			5 mm					48 MHz			5 mm		CMOS			3.3 V					.4 mm	S-PQCC-N40				e3
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100				GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.17 mm			10.4 mm						30	260	10.4 mm	1572864	CMOS			1.2 V					.65 mm	S-PBGA-B161	3			e1
CP2130-F01-GM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD			.8 mm			4 mm						NOT SPECIFIED	NOT SPECIFIED	4 mm		CMOS			3.3 V					.5 mm	S-XQCC-N24
CY8C6136BZI-F14	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1 mm			9 mm								9 mm		CMOS			1.8 V					.65 mm	S-PBGA-B124	3			e1
CY8C6144AZI-S4F93	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel		-40 Cel			QUAD			1.6 mm			12 mm								12 mm		CMOS			1.8 V					.5 mm	S-PQFP-G80	3
CY8C6144LQI-S4F62	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel		-40 Cel			QUAD			1 mm			8 mm								8 mm		CMOS			1.8 V					.4 mm	S-XQCC-N68	3
CY8C6244AZI-S4D62	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel		-40 Cel			QUAD			1.6 mm			10 mm								10 mm		CMOS			1.8 V					.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D82	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel		-40 Cel			QUAD			1.6 mm			10 mm								10 mm		CMOS			1.8 V					.5 mm	S-PQFP-G64	3
CYB06445LQI-S3D42	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel		-40 Cel	PURE TIN		QUAD			1 mm			8 mm								8 mm		CMOS			1.8 V					.4 mm	S-XQCC-N68	3
CYPD3125-40LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD			.6 mm			6 mm								6 mm		CMOS			3.3 V					.5 mm	S-XQCC-N40	3			e4
CYW20721B2KUMLG	Infineon Technologies	SYSTEM ON CHIP		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.76 V	85 Cel		-30 Cel			QUAD			.6 mm			5 mm								5 mm		CMOS			3 V					.4 mm	S-XQCC-N40
D2-74083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V					FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-10 Cel	MATTE TIN		QUAD			1.6 mm			14 mm						30	260	14 mm		CMOS			1.8 V					.4 mm	S-PQFP-G128	3			e3
DM6446ANB6C2127VC	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V					.8 mm	S-PBGA-B361	3			e1
DM6446AZWTKEDACOM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V					.8 mm	S-PBGA-B361	3			e1
DM6446GB6C0121MV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V					.8 mm	S-PBGA-B361	3			e1
EFR32MG13P632F512GM32-D	Silicon Labs	SYSTEM ON CHIP		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel		-40 Cel			QUAD			.9 mm			5 mm								5 mm		CMOS			3.3 V					.5 mm	S-XQCC-N32
EFR32MG13P632F512GM48-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel		-40 Cel			QUAD			.9 mm			7 mm								7 mm		CMOS			3.3 V					.5 mm	S-XQCC-N48
EFR32MG21B020F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel			QUAD			.9 mm			4 mm								4 mm		CMOS			3 V					.4 mm	S-XQCC-N32
EFR32MG24A021F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD			.9 mm			5 mm								5 mm		CMOS			3 V					.4 mm	S-XQCC-N40
FT245BM	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V					FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	TIN LEAD		QUAD			1.6 mm			7 mm							250	7 mm		CMOS			5 V					.8 mm	S-PQFP-G32	3	Not Qualified		e0
LM8330TME/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		128			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM		20	.675 mm			2.01 mm						30	260	2.01 mm		CMOS		.03 mA	1.8 V					.4 mm	S-PBGA-B25	1			e1		20
LM8330TMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		128			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM		20	.675 mm			2.01 mm						30	260	2.01 mm		CMOS		.03 mA	1.8 V					.4 mm	S-PBGA-B25	1			e1		20
MCIMX257DJM4A,557	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	70 Cel		-20 Cel			BOTTOM			1.6 mm			17 mm		ALSO REQUIRES 3.3 V I/O SUPPLY						17 mm		CMOS			1.45 V					.8 mm	S-PBGA-B400
MCIMX286DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel			BOTTOM			1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS			1.45 V					.8 mm	S-PBGA-B289	3
MCIMX6D5EYM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM			1.6 mm			21 mm		24MHZ NOMINAL FREQ AVAILABLE				40	260	21 mm		CMOS								.8 mm	S-PBGA-B624	3			e1
MCIMX6D6AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel			BOTTOM			2.16 mm			21 mm						40	260	21 mm		CMOS								.8 mm	S-PBGA-B624	3
MCIMX6U5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.6 mm			21 mm						40	260	21 mm		CMOS			1.4 V					.8 mm	S-PBGA-B624	3			e1
MCIMX6X2EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM			1.53 mm			17 mm						40	260	17 mm		CMOS								.8 mm	S-PBGA-B400	3			e1
MCIMX6X4AVM08AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.52 mm			19 mm						40	260	19 mm		CMOS								.8 mm	S-PBGA-B529	3			e1
MCIMX6Y2CVM05AAR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.32 mm			14 mm						40	260	14 mm		CMOS								.8 mm	S-PBGA-B289	3			e1
MIMX8MN3DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V					GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel		0 Cel			BOTTOM			1.01 mm			11 mm						40	260	11 mm		CMOS			.95 V					.5 mm	S-PBGA-B306	3
MIMX8QX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel		-40 Cel			BOTTOM			2.52 mm			21 mm						40	260	21 mm		CMOS			1.1 V					.8 mm	S-PBGA-B609	3
MIMXRT106ACVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel			BOTTOM			1.43 mm			10 mm						40	260	10 mm		CMOS								.65 mm	S-PBGA-B196	3
MPFS095TL-FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		0 Cel			BOTTOM			1.4 mm			16 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm		CMOS			1 V					.5 mm	S-PBGA-B536
MPFS095TS-FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		-40 Cel			BOTTOM			1.4 mm			16 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm		CMOS			1 V					.5 mm	S-PBGA-B536
MPFS250TLS-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel		-40 Cel			BOTTOM			2.99 mm			35 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						35 mm		CMOS			1 V					1 mm	S-PBGA-B1152
MSP430F6747AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16	FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES		1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES	I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		25 rpm	e4	8	62

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.