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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
AM5716AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm						30	250	23 mm		CMOS		1.15 V						.8 mm		S-PBGA-B760	3			e1
AM6442BSFFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY					250	17.2 mm		CMOS		.75 V						.8 mm		S-PBGA-B441	3		1000 rpm
CMX7341Q3	Cml Microcircuits	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD		1 mm			6 mm								6 mm		CMOS		3.3 V						.5 mm		S-XQCC-N48
MIMX8MN1DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V						GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel		0 Cel			BOTTOM		1.01 mm			11 mm						40	260	11 mm		CMOS		.95 V						.5 mm		S-PBGA-B306	3
MPFS250TS-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel		-40 Cel			BOTTOM		2.99 mm			35 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						35 mm		CMOS		1 V						1 mm		S-PBGA-B1152
TCI6630K2LCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM											30	245			CMOS		.95 V								S-PBGA-B900	4			e1
TCI6630K2LCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V						BOTTOM															CMOS		.95 V								S-PBGA-B900
TCI6630K2LDCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM											30	245			CMOS		.95 V								S-PBGA-B900	4			e1
TCI6630K2LDCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM											30	245			CMOS		.95 V								S-PBGA-B900	4			e1
TDA8029HL/C207,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES						1.8/5,3/5	FLATPACK	QFP32,.35SQ,32		90 Cel		-40 Cel			QUAD												260							Other Microprocessor ICs				.8 mm		S-PQFP-G32	1	Not Qualified
TMS320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		16384	16 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm		CMOS		1.2 V		Digital Signal Processors			I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
XAZU5EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY, FINE PITCH			125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS		.85 V						.8 mm		S-PBGA-B784	4			e1
XCZU4CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS		.85 V								S-PBGA-B784	4			e1
ATWINC1500B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			5 mm					48 MHz			5 mm		CMOS		3.3 V						.4 mm		S-PQCC-N40				e3
CC1310F64RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm						30	260	7 mm	28672	CMOS		3.3 V						.5 mm		S-PQCC-N48	3			e4
EFR32BG24A010F1024IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS		3 V						.4 mm		S-XQCC-N40
EFR32BG24A010F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS		3 V						.4 mm		S-XQCC-N40
EFR32BG24A020F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS		3 V						.4 mm		S-XQCC-N48
EFR32BG24B220F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS		3 V						.4 mm		S-XQCC-N48
EFR32MG24A020F1536IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS		3 V						.4 mm		S-XQCC-N40
MCIMX283DVM4B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V						.8 mm		S-PBGA-B289	3	Not Qualified		e1
MCIMX6U5EVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm						40	260	21 mm		CMOS								.8 mm		S-PBGA-B624	3			e1
MSP430F6777AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
MSP430F67791AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
OMAPL138EZCE3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V					I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
XC7Z030-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM		3.24 mm			27 mm								27 mm		CMOS		1 V						1 mm		S-PBGA-B676
XCZU4CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250			CMOS		.72 V								S-PBGA-B784	4			e1
XVF3000-TQ128-CA	Xmos	MICROPROCESSOR CIRCUIT		GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.95 V	70 Cel		0 Cel			QUAD		1.2 mm			14 mm								14 mm		CMOS		1 V						.4 mm		S-PQFP-G128
AR1100T-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			5 mm		ALSO OPERATES AT 5V SUPPLY						5 mm		CMOS		3.3 V						.65 mm		S-PQCC-N20				e3
ATMXT641TD-ATR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949					FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	85 Cel		-40 Cel			QUAD		1.2 mm			14 mm								14 mm		CMOS		3.3 V						.5 mm		S-PQFP-G100
CY8C4045LQI-S411	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm			4 mm						30	260	4 mm		CMOS		1.8 V						.5 mm		S-XQCC-N24	3			e4
EFR32BG24B220F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS		3 V						.4 mm		S-XQCC-N48
LS1021AXE7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm			19 mm						40	260	19 mm		CMOS		1 V						.8 mm		S-PBGA-B525	3			e1
LS1046AXE8Q1A	NXP Semiconductors	SoC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.61 mm			23 mm						30	250	23 mm		CMOS		1 V						.8 mm		S-PBGA-B780	3			e1
MCIMX534AVV8C	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100				1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM		1.85 mm			19 mm						40	260	19 mm		CMOS		1.1 V		Graphics Processors				.8 mm		S-PBGA-B529	3	Not Qualified		e2
MCIMX6X4AVM08AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.52 mm			19 mm						40	260	19 mm		CMOS								.8 mm		S-PBGA-B529	3			e1
MKW01Z128CHN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	60	VBCC	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD		BOTTOM		.98 mm			8 mm						40	260	8 mm		CMOS		3.3 V						.5 mm		S-PBCC-B60	3			e4
MPFS250T-1FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		-40 Cel			BOTTOM		1.4 mm			16 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm		CMOS		1 V						.5 mm		S-PBGA-B536
MPFS250T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel		-40 Cel			BOTTOM		2.92 mm			23 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						23 mm		CMOS		1 V						.8 mm		S-PBGA-B784
MSP430F6777AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
SCANSTA112VS	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)		QUAD		1.2 mm			14 mm				0		NOT SPECIFIED	260	14 mm		CMOS		3.3 V		Other Microprocessor ICs				.5 mm		S-PQFP-G100	3	Not Qualified		e0
SCIMX538DZK1C	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	529	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V					0.9/1.25,1.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA529,23X23,32	1.2 V						BOTTOM		.986 mm			12 mm						NOT SPECIFIED	NOT SPECIFIED	12 mm		CMOS		1.25 V		Graphics Processors				.5 mm		S-PBGA-B529		Not Qualified
XAZU7EV-1FBVB900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY	BGA900,30X30,40		125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.97 mm			31 mm				0		30	245	31 mm		CMOS		.85 V					CAN, I2C, SPI, UART	1 mm		S-PBGA-B900	4			e1
XC7Z014S-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		0 Cel			BOTTOM		1.6 mm			19 mm								19 mm		CMOS		1 V						.8 mm		S-PBGA-B484
XC7Z035-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM		2.54 mm			27 mm								27 mm		CMOS		1 V						1 mm		S-PBGA-B676
XCZU4CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY						Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250			CMOS		.72 V								S-PBGA-B784	4			e1
66AK2L06XCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V						GRID ARRAY, FINE PITCH		.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.55 mm			25 mm						30	245	25 mm		CMOS		1.05 V						.8 mm		S-PBGA-B900	4			e1
AM4378BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS		1.26 V						.65 mm		S-PBGA-B491	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.