SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MCIMX356AJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			17 mm						40	260	17 mm		CMOS			1.8 V						.8 mm	S-PBGA-B400	3	Not Qualified		e1
SLB9670VQ12FW643XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-20 Cel	NICKEL GOLD PALLADIUM SILVER			QUAD		.9 mm			5 mm		ALSO OPERATES WITH 3.3V NOM SUPPLY						5 mm		CMOS			1.8 V						.5 mm	S-PQCC-N32	3
SSD1926QL9	Solomon Systech	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.98 V						FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1.62 V	85 Cel		-30 Cel				QUAD		1.6 mm			14 mm								14 mm		CMOS			1.8 V						.4 mm	S-PQFP-G128
TDA8026ET/C2,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES						3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel		-25 Cel				BOTTOM												260					260 mA	3.3 V		Other Microprocessor ICs				.8 mm	S-PBGA-B64	2	Not Qualified
UCD3138128APFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.2 mm			12 mm				0	2 MHz	30	260	12 mm		CMOS			3.3 V					I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4
XC7Z012S-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		0 Cel				BOTTOM		1.6 mm			19 mm								19 mm		CMOS			1 V						.8 mm	S-PBGA-B485
66AK2G12ABY60	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	70 Cel		0 Cel	TIN SILVER COPPER			BOTTOM		1.56 mm			21 mm						30	260	21 mm		CMOS			.9 V						.8 mm	S-PBGA-B625	3			e1
AM4377BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS			1.325 V						.65 mm	S-PBGA-B491	3			e1
CC2543RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm			5 mm				0		30	260	5 mm		CMOS			3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; UART; USART	.5 mm	S-PQCC-N32	3	Not Qualified		e4
MPFS250T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		0 Cel				BOTTOM		1.4 mm			16 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm		CMOS			1 V						.5 mm	S-PBGA-B536
OMAPL138EZCEA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	13 mm		CMOS			1.3 V						.65 mm	S-PBGA-B361	3			e1
SE050B1HQ1/Z01SEZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD SILVER			QUAD		.33 mm			3 mm						30	260	3 mm		CMOS			1.8 V						.4 mm	S-PQCC-N20	1			e4
XC7Z014S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel				BOTTOM		1.6 mm			17 mm								17 mm		CMOS			1 V						.8 mm	S-PBGA-B400
XCZU5CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	250			CMOS			.85 V							S-PBGA-B784	4			e1
MCIMX6S5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			21 mm						40	260	21 mm		CMOS									.8 mm	S-PBGA-B624	3			e1
CC430F5147IRGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm	32768	4	7 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER		20 MHz	30	260	7 mm	4096	CMOS			3.3 V		Microcontrollers		FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4		30
CM108AH	C-media Electronics		COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES						5	FLATPACK	QFP48,.35SQ,20		70 Cel		-15 Cel				QUAD																		5 V		Other Microprocessor ICs				.5 mm	S-PQFP-G48		Not Qualified
CY8C6116BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1 mm			9 mm								9 mm		CMOS			1.8 V						.65 mm	S-PBGA-B124	3			e1
MCIMX6S5DVM10ACR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			21 mm						40	260	21 mm		CMOS									.8 mm	S-PBGA-B624	3			e1
OMAPL138EZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.65 mm	S-PBGA-B361	3		456 rpm	e1
TCI6630K2LCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V				TIN SILVER COPPER			BOTTOM											30	245			CMOS			.95 V							S-PBGA-B900	4			e1
AM6234ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel				BOTTOM		.89 mm			13 mm							250	13 mm		CMOS			.75 V						.5 mm	S-PBGA-B425	3
AM6441BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel				BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY				30	250	17.2 mm		CMOS			.75 V						.8 mm	S-PBGA-B441	3
CC1310F32RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS			3.3 V						.5 mm	S-PQCC-N32	3			e4
CY8C6244AZI-S4D92	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel		-40 Cel				QUAD		1.6 mm			10 mm								10 mm		CMOS			1.8 V						.5 mm	S-PQFP-G64	3
OMAPL138EZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER			BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
XA7Z020-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100				1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		N	BOTTOM		1.6 mm			17 mm						30	260	17 mm		CMOS					Other uPs/uCs/Peripheral ICs				.8 mm	S-PBGA-B400	3	Not Qualified		e1
EFR32FG23A010F256GM48-C	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel		-40 Cel				QUAD		.9 mm			6 mm								6 mm		CMOS			3.3 V						.4 mm	S-XQCC-N48
MCIMX280DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS			1.45 V						.8 mm	S-PBGA-B289	3			e1
MCIMX286DVM4B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS			1.45 V						.8 mm	S-PBGA-B289	3	Not Qualified		e1
MPFS250T-1FCG1152E	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel		0 Cel				BOTTOM		2.99 mm			35 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						35 mm		CMOS			1 V						1 mm	S-PBGA-B1152
MPXY8500DK016T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel		-40 Cel				QUAD		2.3 mm			9 mm						NOT SPECIFIED	NOT SPECIFIED	9 mm		CMOS			3 V						.65 mm	S-XQCC-N32
MSP430F67641AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD		1.6 mm		8	14 mm				0		30	260	14 mm	8192	CMOS			3.3 V					I2C; SPI; UART	.5 mm	S-PQFP-G100	3			e4
P1015NSN5DFB	NXP Semiconductors	SoC		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel		0 Cel				BOTTOM		1.79 mm			23 mm						40	260	23 mm		CMOS			1 V						.8 mm	S-PBGA-B561	3
S6J32GEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel		-40 Cel				QUAD		1.7 mm			28 mm								28 mm		CMOS			1.2 V						.5 mm	S-PQFP-G208
ST33HTPH2E32AHD0	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel				QUAD		1 mm			5 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE				NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS			1.8 V						.5 mm	S-XQCC-N32
XUF216-512-TQ128-C20A	Xmos	MICROPROCESSOR CIRCUIT		GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.95 V	70 Cel		0 Cel				QUAD		1.2 mm			14 mm								14 mm		CMOS			1 V						.4 mm	S-PQFP-G128
A5000R2HQ1/Z016UZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel				QUAD		.33 mm			3 mm							260	3 mm		CMOS			1.8 V						.4 mm	S-XQCC-N20	1
AM6411BSCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel				BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY					250	17.2 mm		CMOS			.75 V						.8 mm	S-PBGA-B441	3
CC1310F32RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm	28672	CMOS			3.3 V						.4 mm	S-PQCC-N32	3			e4
EFR32MG13P632F512GM32-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel		-40 Cel				QUAD		.9 mm			5 mm								5 mm		CMOS			3.3 V						.5 mm	S-XQCC-N32
MC13212	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	NICKEL GOLD			BOTTOM		1 mm			9 mm						30	250	9 mm		CMOS			2.7 V						.5 mm	S-PBGA-B71	3	Not Qualified		e4
MCIMX6D6AVT08AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, FINE PITCH		1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm		24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS			1.4 V						.8 mm	S-PBGA-B624	3			e1
MIMXRT1051CVL5A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel				BOTTOM		1.43 mm			10 mm								10 mm		CMOS									.65 mm	S-PBGA-B196
MPFS250T-1FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel		-40 Cel				BOTTOM		2.99 mm			35 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						35 mm		CMOS			1 V						1 mm	S-PBGA-B1152
MSP430F6779AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		25 rpm	e4	8	62
OMAPL138EZCED4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.65 mm	S-PBGA-B361	3		456 rpm	e1
A7101CHTK2/T0BC2VJ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel		-25 Cel				DUAL		1 mm			4 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY					260	4 mm		CMOS			1.8 V						.8 mm	S-PDSO-N8	1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.