SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
AM4379BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.3 mm			17 mm					30	260	17 mm			CMOS	1.325 V				.65 mm	S-PBGA-B491	3			e1
AM6251ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel				BOTTOM	.89 mm			13 mm							13 mm			CMOS	.75 V				.5 mm	S-PBGA-B425
MCIMX286CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel				BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm			CMOS	1.45 V				.8 mm	S-PBGA-B289	3
MCIMX356AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			17 mm					40	260	17 mm			CMOS	1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX6Y0DVM05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel		0 Cel				BOTTOM	1.32 mm			14 mm					40	260	14 mm			CMOS					.8 mm	S-PBGA-B289	3
MIMXRT117HCVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel				BOTTOM	1.52 mm			14 mm							14 mm			CMOS					.8 mm	S-PBGA-B289
MPFS025T-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel				BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm			CMOS	1 V				.8 mm	S-PBGA-B484
SE050A1HQ1/Z01SGZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD SILVER			QUAD	.33 mm			3 mm					30	260	3 mm			CMOS	1.8 V				.4 mm	S-PQCC-N20	1			e4
UCD3138ARGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES		QUAD	1 mm			9 mm			0	2 MHz	30	260	9 mm			CMOS	3.3 V			I2C; UART	.5 mm	S-PQCC-N64	2			e4
XC7Z100-1FFG900C	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel		0 Cel				BOTTOM	3.24 mm			27 mm							27 mm			CMOS	1 V				1 mm	S-PBGA-B900
A2F200M3F-FGG256I	Microchip Technology	SoC FPGA		BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY, LOW PROFILE		1.425 V	100 Cel		-40 Cel	MATTE TIN			BOTTOM									30	250				CMOS	1.5 V					S-PBGA-B256	3
AM5718AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.96 mm			23 mm					30	250	23 mm			CMOS	1.15 V				.8 mm	S-PBGA-B760	3		1500 rpm	e1
AM6251AKGGHHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel		0 Cel				BOTTOM	.89 mm			13 mm							13 mm			CMOS	.75 V				.5 mm	S-PBGA-B425
AM6254ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel				BOTTOM	.89 mm			13 mm							13 mm			CMOS	.75 V				.5 mm	S-PBGA-B425
DM365ZCES	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.3 mm			13 mm			32		30	260	13 mm			CMOS	1.35 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
DM365ZCEW	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.3 mm			13 mm			32		30	260	13 mm			CMOS	1.35 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
EFR32MG24A010F1024IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel				QUAD	.9 mm			5 mm							5 mm			CMOS	3 V				.4 mm	S-XQCC-N40
MCIMX257DJM4AR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY				40	260	17 mm			CMOS	1.45 V	Microprocessors			.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX6X4CVM08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.52 mm			19 mm					40	260	19 mm			CMOS					.8 mm	S-PBGA-B529	3			e1
MCIMX7D3DVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	95 Cel		0 Cel				BOTTOM	1.1 mm			12 mm					40	260	12 mm			CMOS	1.225 V				.4 mm	S-PBGA-B488	3
MCIMX7D7DVM10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	95 Cel		0 Cel				BOTTOM	1.42 mm			19 mm					40	260	19 mm			CMOS	1.225 V				.75 mm	S-PBGA-B541	3
OMAPL132EZWTA2R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	16 mm			CMOS	1.2 V				.8 mm	S-PBGA-B361	3		200 rpm	e1
OMAPL138EZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm			CMOS	1.3 V			I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
STV0991FAH	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel				BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm			CMOS	1.1 V				.65 mm	S-PBGA-B201
STV0991FAH/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel				BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm			CMOS	1.1 V				.65 mm	S-PBGA-B201
TCI6630K2LXCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER			BOTTOM									30	245				CMOS	.95 V					S-PBGA-B900	4			e1
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY			125 Cel		-40 Cel				BOTTOM														CMOS						S-PBGA-B484
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	3.32 mm			23 mm					30	250	23 mm			CMOS	.85 V				.8 mm	S-PBGA-B784	4			e1
XC7Z030-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel				BOTTOM	3.24 mm			27 mm							27 mm			CMOS	1 V				1 mm	S-PBGA-B676
XCZU5EV-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM									30	250				CMOS	.9 V					S-PBGA-B784	4			e1
XTDA4AHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel		0 Cel				BOTTOM	3.341 mm			31 mm							31 mm			CMOS	.8 V				.8 mm	S-PBGA-B1414
XTDA4APXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel		0 Cel				BOTTOM	3.341 mm			31 mm							31 mm			CMOS	.8 V				.8 mm	S-PBGA-B1414
AM5718AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.96 mm			23 mm					30	250	23 mm			CMOS	1.15 V				.8 mm	S-PBGA-B760	3		1500 rpm	e1
AM6252ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel				BOTTOM	.89 mm			13 mm							13 mm			CMOS	.75 V				.5 mm	S-PBGA-B425
ATSAM4C8CB-AUR	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel		-40 Cel	MATTE TIN			QUAD	1.6 mm			14 mm					40	260	14 mm			CMOS	1.2 V				.5 mm	S-PQFP-G100	3			e3
CC430F5145IRGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD			QUAD	1 mm	16384	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm		2048	CMOS	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CY8C3446LTI-073	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		N	QUAD	1 mm			7 mm					20	260	7 mm	65536 Bits		CMOS	3.3 V	Other uPs/uCs/Peripheral ICs			.5 mm	S-XQCC-N48	3	Not Qualified		e4
D2-45057-QR	Renesas Electronics	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	85 Cel		-10 Cel	NICKEL PALLADIUM GOLD			QUAD	1 mm			10 mm							10 mm			CMOS	1.8 V				.5 mm	S-PQCC-N68	3			e4
LS1043AXE8QQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY, FINE PITCH		.87 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.07 mm			23 mm	ALSO OPERATES AT 1V SUPPLY NOM				30	250	23 mm			CMOS	.9 V				.8 mm	S-PBGA-B780	3			e1
MCIMX351AVM4B	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.22 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			17 mm					40	260	17 mm			CMOS					.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX6QP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.16 mm			21 mm					40	260	21 mm			CMOS	1.4 V				.8 mm	S-PBGA-B624	3			e1
MCIMX6X3CVN08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.53 mm			17 mm					40	260	17 mm			CMOS					.8 mm	S-PBGA-B400	3			e1
MCIMX6X3CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.53 mm			17 mm					40	260	17 mm			CMOS					.8 mm	S-PBGA-B400	3			e1
STV0991FA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel				BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm			CMOS	1.1 V				.65 mm	S-PBGA-B201
STV0991FA/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel				BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm			CMOS	1.1 V				.65 mm	S-PBGA-B201
STV0991FAR/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel				BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm			CMOS	1.1 V				.65 mm	S-PBGA-B201
TCI6630K2LXCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER			BOTTOM									30	245				CMOS	.95 V					S-PBGA-B900	4			e1
CY8C6244AZI-S4D93	Infineon Technologies	SoC		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel		-40 Cel				QUAD	1.6 mm			12 mm							12 mm			CMOS	1.8 V				.5 mm	S-PQFP-G80	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.