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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
ATMXT224S-MAUR036	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel		-40 Cel			QUAD		.6 mm			6 mm								6 mm		CMOS			3.3 V						.35 mm	S-XQCC-N56
AM6421BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY				30	250	17.2 mm		CMOS			.75 V						.8 mm	S-PBGA-B441	3
ATMXT224S-MAUR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	1.71 V	85 Cel		-40 Cel			QUAD		.6 mm			6 mm								6 mm		CMOS			1.8 V						.35 mm	S-XQCC-N56
MCIMX515DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			19 mm						40	260	19 mm		CMOS			1.1 V		Graphics Processors				.8 mm	S-PBGA-B529	3	Not Qualified		e1
MCIMX6S8DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm						40	260	21 mm		CMOS									.8 mm	S-PBGA-B624	3			e1
SCANSTA112SMX	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM		1.5 mm			10 mm				0		NOT SPECIFIED	235	10 mm		CMOS			3.3 V		Other Microprocessor ICs				.8 mm	S-PBGA-B100	3	Not Qualified		e0
EFR32MG24B010F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS			3 V						.4 mm	S-XQCC-N40
AM5716AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V						GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm						30	250	23 mm		CMOS			1.15 V						.8 mm	S-PBGA-B760	3			e1
EFR32MG21A010F768IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel	MATTE TIN		QUAD		.9 mm			4 mm						40	260	4 mm		CMOS			3 V						.4 mm	S-XQCC-N32	2			e3
EFR32MG24B020F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS			3 V						.4 mm	S-XQCC-N40
MCIMX6Y2CVM08AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel		-40 Cel			BOTTOM		1.32 mm			14 mm						40	260	14 mm		CMOS									.8 mm	S-PBGA-B289
VCBU68WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm						30	260	13 mm		CMOS			1.35 V						.65 mm	S-PBGA-B338	3			e1
XC7Z100-1FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel		-40 Cel			BOTTOM		3.1 mm			35 mm								35 mm		CMOS			1 V						1 mm	S-PBGA-B1156
AM4376BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS			1.26 V						.65 mm	S-PBGA-B491	3			e1
ATMXT224S-MAUR043	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel		-40 Cel			QUAD		.6 mm			6 mm								6 mm		CMOS			3.3 V						.35 mm	S-XQCC-N56
SLS32AIA020X2USON10XTMA4	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	105 Cel		-40 Cel	NICKEL GOLD PALLADIUM SILVER		DUAL		.6 mm			3 mm								3 mm		CMOS			5 V						.5 mm	S-PDSO-N10	1
CSR8670C-IBBH-R	Qualcomm	MICROPROCESSOR CIRCUIT		BALL	112	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY								BOTTOM											NOT SPECIFIED	NOT SPECIFIED			CMOS										S-PBGA-B112
DS8007-ENG	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6 V					3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel		-40 Cel	TIN LEAD		QUAD		1.6 mm			7 mm								7 mm		CMOS		325 mA	3.3 V		Other Microprocessor ICs				.5 mm	S-PQFP-G48	1	Not Qualified		e0
DS8007-ENG+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6 V					3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		QUAD		1.6 mm			7 mm						30	260	7 mm		CMOS		325 mA	3.3 V		Other Microprocessor ICs				.5 mm	S-PQFP-G48	1	Not Qualified		e3
MCIMX6X1AVK08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			14 mm						40	260	14 mm		CMOS			1.8 V						.65 mm	S-PBGA-B400	3			e1
MKW41Z512VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD											40	260			CMOS			3.3 V							S-XQCC-N48	3			e4
MSP430F67791AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		25 rpm	e4	8	62
XC7Z014S-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel		0 Cel			BOTTOM		1.6 mm			19 mm								19 mm		CMOS			1 V						.8 mm	S-PBGA-B484
AM6442BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY					250	17.2 mm		CMOS			.75 V						.8 mm	S-PBGA-B441	3		1000 rpm
EFR32MG24A021F1024IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS			3 V						.4 mm	S-XQCC-N40
SLB9670XQ2.0	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V						CHIP CARRIER	LCC32,.2SQ,20	1.65 V	85 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS			1.8 V						.5 mm	S-PQCC-N32	1
AM6442BSDFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS			.75 V						.8 mm	S-PBGA-B441			1000 rpm
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY, FINE PITCH			100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm						30	250	21 mm		CMOS			.72 V						.8 mm	S-PBGA-B625	3			e1
AM6411BKCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY					250	17.2 mm		CMOS			.75 V						.8 mm	S-PBGA-B441	3
ATMXT224S-MAUR033	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel		-40 Cel			QUAD		.6 mm			6 mm								6 mm		CMOS			3.3 V						.35 mm	S-XQCC-N56
D2-92683-QR-T	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-10 Cel	MATTE TIN		QUAD		.9 mm			10 mm						30	260	10 mm		CMOS			1.8 V						.5 mm	S-PQCC-N72	3			e3
EFR32MG24B210F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS			3 V						.4 mm	S-XQCC-N48
MCIMX6Q6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel			BOTTOM		2.16 mm			21 mm						40	260	21 mm		CMOS									.8 mm	S-PBGA-B624	3
MPFS250T-1FCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		0 Cel			BOTTOM		2.92 mm			19 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS			1 V						.8 mm	S-PBGA-B484
MSP430F67791IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0		30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F6779AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		25 rpm	e4	8	62
FCM8531QY	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V						FLATPACK, LOW PROFILE	QFP32,.35SQ,32	4.5 V	85 Cel		-40 Cel			QUAD		1.6 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS			5 V					I2C; SPI; UART	.8 mm	S-PQFP-G32
RF430FRL152HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY	YES							CHIP CARRIER, VERY THIN PROFILE			70 Cel		0 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			4 mm		IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE		0		30	260	4 mm		CMOS								I2C; SPI	.5 mm	S-PQCC-N24	2			e4
SLI9670AQ20FW1311XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V	AEC-Q100					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	105 Cel		-40 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD		.9 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY						5 mm		CMOS			1.8 V						.5 mm	S-XQCC-N32	3
TMS320DM368ZCE48	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm						30	260	13 mm		CMOS			1.35 V						.65 mm	S-PBGA-B338	3			e1
XC7Z012S-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel		0 Cel			BOTTOM		1.6 mm			19 mm								19 mm		CMOS			1 V						.8 mm	S-PBGA-B485
CC2540F256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			COMPARATORS, TIMER(4)			30	260	6 mm	8192	CMOS			3 V		Other uPs/uCs/Peripheral ICs			SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4		21
MSP430F6779IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0	25 MHz	30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
NT3H2111W0FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER		1.67 V	105 Cel		-40 Cel			QUAD		.5 mm			1.6 mm								1.6 mm		CMOS			1.8 V							S-XQCC-N8
XAM6442ASFGGAALV	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY					250	17.2 mm		CMOS			.75 V						.8 mm	S-PBGA-B441	3		1000 rpm	e1
XC7Z100-L2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel		-40 Cel			BOTTOM		3.1 mm			35 mm								35 mm		CMOS			1 V						1 mm	S-PBGA-B1156
AM4378BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS			1.325 V						.65 mm	S-PBGA-B491	3			e1
AM6231ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm								13 mm		CMOS			.75 V						.5 mm	S-PBGA-B425

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.