SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
XC7Z030-3FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		0 Cel			BOTTOM	2.54 mm		23 mm					23 mm		CMOS	1 V			1 mm		S-PBGA-B484
MCIMX7D3EVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	105 Cel		-20 Cel			BOTTOM	1.1 mm		12 mm			40	260	12 mm		CMOS	1.225 V			.4 mm		S-PBGA-B488	3
MCIMX6Q7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O		40	260	21 mm		CMOS	1.4 V			.8 mm		S-PBGA-B624	3			e1
STSPIN32F0A	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	45 V				CHIP CARRIER, HEAT SINK/SLUG		6.7 V	125 Cel		-40 Cel			QUAD			7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS	8 V			.5 mm		S-XQCC-N48
XA7Z020-1CLG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel		-40 Cel	TIN SILVER COPPER	N	BOTTOM	1.6 mm		19 mm			30	260	19 mm		CMOS		Other uPs/uCs/Peripheral ICs		.8 mm		S-PBGA-B484	3	Not Qualified		e1
AX8052F143-3-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM		QUAD	1 mm		5 mm			30	260	7 mm		CMOS	3 V			.5 mm		R-PQCC-N40	1
PN7150B0HN/C11002Y	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel		-30 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		6 mm			30	260	6 mm		CMOS	1.8 V			.5 mm		S-XQCC-N40	3			e4
XC7Z045-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V			1 mm		S-PBGA-B900
XC7Z010-3CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		0 Cel			BOTTOM	1.5 mm		13 mm					13 mm		CMOS	1 V			.8 mm		S-PBGA-B225
MCIMX6Y2CVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.32 mm		14 mm			40	260	14 mm		CMOS				.8 mm		S-PBGA-B289	3			e1
XC7Z020-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm		17 mm					17 mm		CMOS	1 V			.8 mm		S-PBGA-B400	3			e1
FT800Q-T	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel		-40 Cel			QUAD	1 mm		7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS	3.3 V			.5 mm		S-XQCC-N48
XC7Z030-2FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		0 Cel			BOTTOM	2.54 mm		23 mm					23 mm		CMOS	1 V			1 mm		S-PBGA-B484
CC-WMX-J97C-TN	Digi International	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES					GRID ARRAY			70 Cel		-20 Cel			BOTTOM			50 mm					50 mm		CMOS				2 mm		S-XBGA-N400
TMS320DM368ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	8192	13 mm		32	30	260	13 mm		CMOS	1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
MIMXRT1051CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM	1.52 mm		12 mm			40	260	12 mm		CMOS				.8 mm		S-PBGA-B196	3			e2
MIMXRT1064DVL6BR	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	95 Cel		0 Cel			BOTTOM	1.43 mm		10 mm			40	260	10 mm		CMOS				.65 mm		S-PBGA-B196	3
FT245RL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	SQUARE	PLASTIC/EPOXY	YES	5.25 V				SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel		-40 Cel			DUAL	2 mm		5.3 mm			40	260	10.2 mm		CMOS				.65 mm		S-PDSO-G28	3
TMS320DM368ZCED	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	8192	13 mm		32	30	260	13 mm		CMOS	1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
XC7Z010-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel		0 Cel			BOTTOM	1.5 mm		13 mm					13 mm		CMOS	1 V			.8 mm		S-PBGA-B225
NRF52811-QCAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel			QUAD	.9 mm		5 mm					5 mm		CMOS	3 V			.5 mm		S-XQCC-N32
XC7Z010-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.5 mm		13 mm					13 mm		CMOS	1 V			.8 mm		S-PBGA-B225
MIMXRT1061CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.43 mm		10 mm			40	260	10 mm		CMOS				.65 mm		S-PBGA-B196	3			e1
XC7Z030-2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		23 mm					23 mm		CMOS	1 V			1 mm		S-PBGA-B484
CC1310F128RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		7 mm			NOT SPECIFIED	260	7 mm	28672	CMOS	3.3 V			.5 mm		S-PQCC-N48	3			e4
MIMXRT1051CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.43 mm		10 mm			40	260	10 mm		CMOS				.65 mm		S-PBGA-B196	3			e1
ESP32-PICO-V3-02	Espressif Systems (Shanghai)	SoC		NO LEAD	48	HQCCN	SQUARE		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG	LCC48,.27SQ,20	3 V	85 Cel		-40 Cel			QUAD	1.21 mm		7 mm					7 mm		CMOS	3.3 V			.5 mm		S-XQCC-N48
XC7Z010-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm		17 mm					17 mm		CMOS	1 V			.8 mm		S-PBGA-B400	3			e1
XC7Z035-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V			1 mm		S-PBGA-B676
MCIMX6Q6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE		40	260	21 mm		CMOS				.8 mm		S-PBGA-B624	3			e1
XC7Z015-L1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm		19 mm					19 mm		CMOS	1 V			.8 mm		S-PBGA-B485
XC7Z035-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V			1 mm		S-PBGA-B676
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V			.65 mm		S-PBGA-B491	3			e1
CC1310F128RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		7 mm			30	260	7 mm	28672	CMOS	3.3 V			.5 mm		S-PQCC-N48	3			e4
MC-10105F1-821-FNA-M1-A	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1,3.3	GRID ARRAY	BGA196,14X14,40	.9 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.71 mm		15 mm	ALSO OPERATES AT 3.3 V				15 mm		CMOS	1 V	Other uPs/uCs/Peripheral ICs		1 mm		S-PBGA-B196		Not Qualified		e1
NRF52811-QFAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel			QUAD	.9 mm		6 mm					6 mm		CMOS	3 V			.4 mm		S-XQCC-N48
XC7Z007S-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.5 mm		13 mm					13 mm		CMOS	1 V			.8 mm		S-PBGA-B225
CY8C21434-24LTXI	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY		40	260	5 mm		CMOS	5 V			.5 mm		S-XQCC-N32	3	Not Qualified		e4
MCIMX6U7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE		40	260	21 mm		CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6S7CVM08ACR	NXP Semiconductors	SYSTEM ON CHIP		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE		40	260	21 mm		CMOS				.8 mm		S-PBGA-B624	3			e1
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		27 mm					27 mm		CMOS	1 V			1 mm		S-PBGA-B676
MIMXRT1175CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel			BOTTOM	1.52 mm		14 mm			40	260	14 mm		CMOS				.8 mm		S-PBGA-B289	3
CY8C21434-24LTXIT	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY		40	260	5 mm		CMOS	5 V			.5 mm		S-XQCC-N32	3			e4
SLS32AIA010MSUSON10XTMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel		-25 Cel			DUAL	.6 mm		3 mm					3 mm		CMOS	3.3 V			.5 mm		S-PDSO-N10	1
AM6442BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM	2.652 mm		17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		30	250	17.2 mm		CMOS	.75 V			.8 mm		S-PBGA-B441	3		1000 rpm
XC7Z100-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.24 mm		27 mm					27 mm		CMOS	1 V			1 mm		S-PBGA-B900
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS	1.325 V			.65 mm		S-PBGA-B491	3			e1
OSD3358-1G-ISM	Octavo Systems	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY	BGA256,16X16,50		85 Cel		-40 Cel			BOTTOM	2.58 mm		21 mm					21 mm		CMOS	1.1 V			1.27 mm		S-PBGA-B256

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.