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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
ESP32-C3	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	105 Cel		-40 Cel			QUAD	.9 mm		5 mm	ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY					5 mm			CMOS		3.3 V			.5 mm		S-PQCC-N32
XC7Z030-1SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM	2.44 mm		19 mm						19 mm			CMOS		1 V			.8 mm		S-PBGA-B485
CY8CMBR3116-LQXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.55 mm		4 mm	Capacitive Touch Sense Controller					4 mm			CMOS		1.8 V			.5 mm		S-XQCC-N24	3		e4
NRF52810-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel			QUAD	.95 mm		6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm			CMOS		3 V			.4 mm		S-XQCC-N48
SE050C2HQ1/Z01SDZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.33 mm		3 mm				30	260	3 mm			CMOS		1.8 V			.4 mm		S-PQCC-N20	1		e4
MCIMX6Q6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm			CMOS					.8 mm		S-PBGA-B624	3		e1
TMS320DM368ZCED48F	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	8192	13 mm			32	30	260	13 mm			CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
FT245BL-REEL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V			FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	MATTE TIN		QUAD	1.6 mm		7 mm				30	260	7 mm			CMOS		5 V			.8 mm		S-PQFP-G32	3		e3
XC7Z007S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel		0 Cel			BOTTOM	1.6 mm		17 mm						17 mm			CMOS		1 V			.8 mm		S-PBGA-B400
MCIMX6Q6AVT10ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel			BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm			CMOS					.8 mm		S-PBGA-B624	3
MCIMX7D5EVM10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	105 Cel		-20 Cel			BOTTOM	1.42 mm		19 mm				40	260	19 mm			CMOS		1.225 V			.75 mm		S-PBGA-B541	3
MIMXRT1171CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel			BOTTOM	1.52 mm		14 mm				40	260	14 mm			CMOS					.8 mm		S-PBGA-B289	3
MCIMX6Y2CVM08AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.32 mm		14 mm				40	260	14 mm			CMOS					.8 mm		S-PBGA-B289	3		e1
MIMXRT1052CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.52 mm		10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE			40	260	10 mm			CMOS					.65 mm		S-PBGA-B196	3		e1
SLB9670VQ20FW785XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-20 Cel			QUAD	.9 mm		5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY					5 mm			CMOS		1.8 V			.5 mm		S-PQCC-N32	3
CC2541F256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8	6 mm		TIMER(4)	0	30	260	6 mm		8192	CMOS		3 V	Other uPs/uCs/Peripheral ICs	I2C; SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified	e4	23
XC7Z020-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm		17 mm						17 mm			CMOS		1 V			.8 mm		S-PBGA-B400	3		e1
MIMXRT1173CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel			BOTTOM	1.52 mm		14 mm				40	260	14 mm			CMOS					.8 mm		S-PBGA-B289	3
XC7Z010-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm		17 mm						17 mm			CMOS		1 V			.8 mm		S-PBGA-B400	3		e1
MIMX8QX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM	2.52 mm		21 mm				40	260	21 mm			CMOS		1.1 V			.8 mm		S-PBGA-B609	3		e2
SLM9670AQ20FW1311XTMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	105 Cel		-40 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD	.9 mm		5 mm	ALSO OPERATES WITH 3.3V SUPPLY					5 mm			CMOS		1.8 V			.5 mm		S-XQCC-N32	1
MFRC52201HN1,115	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel			QUAD							30	260					100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MCIMX6Q7CVT08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm			CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1
MIMXRT117FCVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel			BOTTOM	1.52 mm		14 mm						14 mm			CMOS					.8 mm		S-PBGA-B289
CC1310F128RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		5 mm				NOT SPECIFIED	260	5 mm		28672	CMOS		3.3 V			.5 mm		S-PQCC-N32	3		e4
MIMXRT1052CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM	1.52 mm		12 mm				40	260	12 mm			CMOS					.8 mm		S-PBGA-B196	3		e2
MIMXRT1064CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel			BOTTOM	1.43 mm		10 mm				40	260	10 mm			CMOS					.65 mm		S-PBGA-B196	3
FT245BL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V			FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	MATTE TIN		QUAD	1.6 mm		7 mm				30	260	7 mm			CMOS		5 V			.8 mm		S-PQFP-G32	3	Not Qualified	e3
CY8C3866AXI-040T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		14 mm						14 mm	65536 Bits		CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PQFP-G100	3	Not Qualified
XC7Z010-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm		17 mm						17 mm			CMOS		1 V			.8 mm		S-PBGA-B400
MCIMX6Q5EYM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE			40	260	21 mm			CMOS					.8 mm		S-PBGA-B624	3		e1
FT245RQ-REEL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel		-40 Cel			QUAD	1 mm		5 mm						5 mm			CMOS					.5 mm		S-XQCC-N32	3	Not Qualified
MIMX8MN6DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER		BOTTOM	1.25 mm		14 mm				40	260	14 mm			CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
MFRC52202HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel			QUAD							30	260					100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
CY8C3866AXI-040	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm		14 mm				40	260	14 mm	65536 Bits		CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PQFP-G100	3	Not Qualified	e4
MCIMX6S7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm			CMOS					.8 mm		S-PBGA-B624	3		e1
MIMX8MM5DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER		BOTTOM	1.25 mm		14 mm				40	260	14 mm			CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
NRF52811-QCAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel			QUAD	.9 mm		5 mm						5 mm			CMOS		3 V			.5 mm		S-XQCC-N32
MCIMX6Y2DVM09AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.32 mm		14 mm				40	260	14 mm			CMOS		1.275 V			.8 mm		S-PBGA-B289	3		e1
SE050C1HQ1/Z01SCZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.33 mm		3 mm				30	260	3 mm			CMOS		1.8 V			.4 mm		S-PQCC-N20	1		e4
XC7Z007S-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm		17 mm						17 mm			CMOS		1 V			.8 mm		S-PBGA-B400
XC7Z030-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		27 mm						27 mm			CMOS		1 V			1 mm		S-PBGA-B676
XC7Z020-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm		17 mm						17 mm			CMOS		1 V			.8 mm		S-PBGA-B400
XC7Z015-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel		0 Cel			BOTTOM	1.6 mm		19 mm						19 mm			CMOS		1 V			.8 mm		S-PBGA-B485
XC7Z015-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm		19 mm						19 mm			CMOS		1 V			.8 mm		S-PBGA-B485
XCZU4CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	250				CMOS		.85 V					S-PBGA-B784	4		e1
XC7Z007S-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel		0 Cel			BOTTOM	1.5 mm		13 mm						13 mm			CMOS		1 V			.8 mm		S-PBGA-B225
ATSAMA5D27-WLSOM1	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	188	DIE	SQUARE	UNSPECIFIED	YES	5.5 V			UNCASED CHIP		3 V	85 Cel		-40 Cel			UPPER							NOT SPECIFIED	NOT SPECIFIED				CMOS		3.3 V					S-XUUC-N188

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.