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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
SLB9670XQ20FW785XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-40 Cel		BOTTOM	.9 mm		5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY						5 mm		CMOS		1.8 V			.5 mm	S-PQCC-N32
CC1310F128RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm		5 mm					NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V			.5 mm	S-PQCC-N32	3			e4
SE050B2HQ1/Z01SFZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm		3 mm					30	260	3 mm		CMOS		1.8 V			.4 mm	S-PQCC-N20	1			e4
XC7Z030-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	3.24 mm		27 mm							27 mm		CMOS		1 V			1 mm	S-PBGA-B676
MIMXRT1172CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel		BOTTOM	1.52 mm		14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3
XC7Z007S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.6 mm		17 mm							17 mm		CMOS		1 V			.8 mm	S-PBGA-B400
XCZU5CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY						Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250			CMOS		.72 V				S-PBGA-B784	4			e1
NRF52811-QFAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel		QUAD	.9 mm		6 mm							6 mm		CMOS		3 V			.4 mm	S-XQCC-N48
XC7Z020-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		0 Cel		BOTTOM	1.6 mm		19 mm							19 mm		CMOS		1 V			.8 mm	S-PBGA-B484
MCIMX6S7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3			e1
CC1310F32RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm		4 mm					NOT SPECIFIED	260	4 mm	28672	CMOS		3.3 V			.4 mm	S-PQCC-N32	3			e4
XC7Z035-3FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel		BOTTOM	3.35 mm		31 mm							31 mm		CMOS		1 V			1 mm	S-PBGA-B900
XC7Z015-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		0 Cel		BOTTOM	1.6 mm		19 mm							19 mm		CMOS		1 V			.8 mm	S-PBGA-B485
CY8C4247AZS-M485	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel		-40 Cel		QUAD	1.6 mm		10 mm							10 mm		CMOS		1.8 V			.5 mm	S-PQFP-G64	3
CC1310F128RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	1 mm		4 mm					30	260	4 mm	28672	CMOS		3.3 V			.4 mm	S-PQCC-N32	3			e4
CY8C6247BZI-D54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm		9 mm							9 mm		CMOS		1.8 V			.65 mm	S-PBGA-B124	3			e1
XC7Z035-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		27 mm							27 mm		CMOS		1 V			1 mm	S-PBGA-B676
MIMX8MM3DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm					40	260	14 mm		CMOS		1 V			.5 mm	S-PBGA-B486	3			e2
NRF52811-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel		QUAD	.9 mm		6 mm							6 mm		CMOS		3 V			.4 mm	S-XQCC-N48
XC7Z045-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm							27 mm		CMOS		1 V			1 mm	S-PBGA-B676
AM6254ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel		BOTTOM	.89 mm		13 mm						250	13 mm		CMOS		.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
CC2541F128RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	8	6 mm		TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V	Other uPs/uCs/Peripheral ICs	I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4	23
XC7Z030-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	2.54 mm		27 mm							27 mm		CMOS		1 V			1 mm	S-PBGA-B676
AM6231ASGGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel		BOTTOM	.89 mm		13 mm						250	13 mm		CMOS		.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
FT800Q-R	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel		-40 Cel		QUAD	1 mm		7 mm							7 mm		CMOS		3.3 V			.5 mm	S-XQCC-N48	3
MIMX8MM3CVTKZAA	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm					40	260	14 mm		CMOS		.95 V			.5 mm	S-PBGA-B486	3			e2
CC2541F128RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	8	6 mm		TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V	Other uPs/uCs/Peripheral ICs	I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4	23
MTCH6102-I/MV	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.16SQ,16	1.8 V	85 Cel		-40 Cel	MATTE TIN	QUAD	.55 mm		4 mm					40	260	4 mm		CMOS		3 V			.4 mm	S-PQCC-N28	1			e3
XC7Z045-2FF676E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm		27 mm							27 mm		CMOS		1 V			1 mm	S-PBGA-B676
XC7Z020-3CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		0 Cel		BOTTOM	1.6 mm		19 mm							19 mm		CMOS		1 V			.8 mm	S-PBGA-B484
MIMX8MN5DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm					40	260	14 mm		CMOS		1 V			.5 mm	S-PBGA-B486	3			e2
MIMXRT1061CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.52 mm		12 mm					40	260	12 mm		CMOS					.8 mm	S-PBGA-B196	3			e2
XC7Z100-2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.1 mm		35 mm							35 mm		CMOS		1 V			1 mm	S-PBGA-B1156
CY8C6136BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm		9 mm							9 mm		CMOS		1.8 V			.65 mm	S-PBGA-B124	3			e1
ST33HTPH2X32AHD8	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel		QUAD	1 mm		5 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE				NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		1.8 V			.5 mm	S-XQCC-N32
MCIMX6U5DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm					40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3			e1
MFRC52201HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel		QUAD								30	260				100 mA		Other Microprocessor ICs		.5 mm	S-PQCC-N32	1	Not Qualified
MIMXRT1061CVJ5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.52 mm		12 mm					40	260	12 mm		CMOS					.8 mm	S-PBGA-B196	3			e2
MCIMX7D2DVM12SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	85 Cel		0 Cel		BOTTOM	1.42 mm		19 mm					40	260	19 mm		CMOS		1.225 V			.75 mm	S-PBGA-B541	3
MCIMX6Y2DVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3			e1
USB4640-HZH-03	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.3 V	TS 16949	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.1 V	70 Cel		0 Cel	MATTE TIN	QUAD	1 mm		7 mm			0	24 MHz			7 mm		CMOS	60 mA	1.2 V	Bus Controllers		.5 mm	S-PQCC-N48		Not Qualified		e3
CY8C4024AZI-S413	Infineon Technologies	PSoC	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	QUAD	1.6 mm		7 mm							7 mm		CMOS		1.8 V			.5 mm	S-PQFP-G48	3
MCIMX6U5DVM10ACR	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm					40	260	21 mm		CMOS		1.4 V			.8 mm	S-PBGA-B624	3			e1
MCIMX6Q5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE				40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3			e1
MCIMX6G3CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3			e1
TDA8035HN/C1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		5 mm					30	260	5 mm		CMOS	220 mA	3.3 V	Other Microprocessor ICs		.5 mm	S-PQCC-N32	1	Not Qualified		e4
XC7Z035-1FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.35 mm		31 mm							31 mm		CMOS		1 V			1 mm	S-PBGA-B900
XC7Z015-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.6 mm		19 mm							19 mm		CMOS		1 V			.8 mm	S-PBGA-B485

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.