SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
XC7Z035-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel			BOTTOM	2.54 mm		27 mm							27 mm		CMOS	1 V			1 mm	S-PBGA-B676
PN7150B0HN/C11006E	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel		-30 Cel			QUAD	1 mm		6 mm						260	6 mm		CMOS	1.8 V			.5 mm	S-XQCC-N40	3
XC7Z014S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel		0 Cel			BOTTOM	1.6 mm		17 mm							17 mm		CMOS	1 V			.8 mm	S-PBGA-B400
MCIMX6Q7CVT08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm		CMOS	1.4 V			.8 mm	S-PBGA-B624	3			e1
PN7120A0EV/C10801Y	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES		1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM								30	260				1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm	S-PBGA-B49	3	Not Qualified		e1
STSPIN32F0TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	45 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8 V	125 Cel		-40 Cel			QUAD	1 mm		7 mm					NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS				.5 mm	S-XQCC-N48
MPFS250TFCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM	2.92 mm		19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS	1 V			.8 mm	S-PBGA-B484
CC2541F256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8	6 mm		TIMER(4)	0		30	260	6 mm	8192	CMOS	3 V	Other uPs/uCs/Peripheral ICs	I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4	23
SLB9670XQ20FW740XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-40 Cel			BOTTOM	.9 mm		5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY						5 mm		CMOS	1.8 V			.5 mm	S-PQCC-N32
XCZU2CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM								30	250			CMOS	.85 V				S-PBGA-B784	4			e1
AM6231AKGGHHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel		0 Cel			BOTTOM	.89 mm		13 mm							13 mm		CMOS	.75 V			.5 mm	S-PBGA-B425
W5300	Wiznet	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		3 V	80 Cel		0 Cel			QUAD	1.6 mm		14 mm					40	260	14 mm		CMOS	3.3 V			.5 mm	S-PQFP-G100	3
MCIMX6U8DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm					40	260	21 mm		CMOS				.8 mm	S-PBGA-B624	3			e1
MCIMX6Y2CVM05ABR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.32 mm		14 mm					40	260	14 mm		CMOS				.8 mm	S-PBGA-B289	3			e1
AM4378BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		17 mm					30	260	17 mm		CMOS	1.325 V			.65 mm	S-PBGA-B491	3			e1
ATSAM4C16CB-AUR	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		14 mm					40	260	14 mm		CMOS	1.2 V			.5 mm	S-PQFP-G100	3			e3
CY8C6247BZI-D34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm		9 mm							9 mm		CMOS	1.8 V			.65 mm	S-PBGA-B124	3			e1
XC7Z007S-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		0 Cel			BOTTOM	1.5 mm		13 mm							13 mm		CMOS	1 V			.8 mm	S-PBGA-B225
UCD3138128PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.2 mm		12 mm					30	260	12 mm		CMOS	3.3 V			.5 mm	S-PQFP-G80	3			e4
XC7Z007S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel			BOTTOM	1.6 mm		17 mm							17 mm		CMOS	1 V			.8 mm	S-PBGA-B400
AM6234ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM	.89 mm		13 mm						250	13 mm		CMOS	.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
XC7Z035-2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM	3.35 mm		31 mm							31 mm		CMOS	1 V			1 mm	S-PBGA-B900
MIMX8MN1DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER		BOTTOM	1.25 mm		14 mm					40	260	14 mm		CMOS	1 V			.5 mm	S-PBGA-B486	3			e2
MCIMX286CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS	1.45 V			.8 mm	S-PBGA-B289	3	Not Qualified		e1
XC7Z045-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		27 mm							27 mm		CMOS	1 V			1 mm	S-PBGA-B676
EFR32MG21A020F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel	MATTE TIN		QUAD	.9 mm		4 mm					40	260	4 mm		CMOS	3 V			.4 mm	S-XQCC-N32	2			e3
OMAPL138EZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS	1.3 V		I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
XC7Z014S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm		17 mm							17 mm		CMOS	1 V			.8 mm	S-PBGA-B400
EFR32MG21A020F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel	MATTE TIN		QUAD	.9 mm		4 mm					40	260	4 mm		CMOS	3 V			.4 mm	S-XQCC-N32	2			e3
MCIMX283CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS	1.45 V			.8 mm	S-PBGA-B289	3	Not Qualified		e1
XC7Z030-1FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		-40 Cel			BOTTOM	2.54 mm		23 mm							23 mm		CMOS	1 V			1 mm	S-PBGA-B484
XCZU4CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM								30	250			CMOS	.85 V				S-PBGA-B784	4			e1
AM5716AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm		23 mm					30	250	23 mm		CMOS	1.15 V			.8 mm	S-PBGA-B760	3			e1
D2-92633-LR	Renesas Electronics	SoC	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-10 Cel	MATTE TIN		QUAD	1.6 mm		14 mm					30	260	14 mm		CMOS	1.8 V			.4 mm	S-PQFP-G128	3			e3
MCIMX6Y2DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel		0 Cel			BOTTOM	1.32 mm		14 mm					40	260	14 mm		CMOS				.8 mm	S-PBGA-B289	3
MCIMX6Q6AVT10ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm					40	260	21 mm		CMOS				.8 mm	S-PBGA-B624	3			e1
SLB9670XQ20FW763XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-40 Cel			BOTTOM	.9 mm		5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY						5 mm		CMOS	1.8 V			.5 mm	S-PQCC-N32
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		7 mm	DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF				30	260	7 mm	81920	CMOS	3 V			.5 mm	S-PQCC-N48	3			e4	30
XC7Z030-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM	2.54 mm		27 mm							27 mm		CMOS	1 V			1 mm	S-PBGA-B676
CC1310F64RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		4 mm					NOT SPECIFIED	260	4 mm	28672	CMOS	3.3 V			.4 mm	S-PQCC-N32	3			e4
XC7Z010-L1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.5 mm		13 mm							13 mm		CMOS	1 V			.8 mm	S-PBGA-B225
AM6252ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM	.89 mm		13 mm						250	13 mm		CMOS	.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
MCIMX6Q5EYM12AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS				.8 mm	S-PBGA-B624	3			e1
MCIMX6S5EVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm					40	260	21 mm		CMOS				.8 mm	S-PBGA-B624	3			e1
ST33HTPH2X32AHD5	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel			QUAD	1 mm		5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY				NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS	1.8 V			.5 mm	S-XQCC-N32
XC7Z014S-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm		17 mm							17 mm		CMOS	1 V			.8 mm	S-PBGA-B400
AM6232ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM	.89 mm		13 mm						250	13 mm		CMOS	.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
XC7Z012S-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM	1.6 mm		19 mm							19 mm		CMOS	1 V			.8 mm	S-PBGA-B485

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.