SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XC7Z030-2SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel		0 Cel		BOTTOM	2.44 mm		19 mm					19 mm		CMOS		1 V			.8 mm		S-PBGA-B485
MCIMX6D7CVT08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O		40	260	21 mm		CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6U5DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm		CMOS					.8 mm		S-PBGA-B624	3		e1
XC7Z030-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
CY8C21434-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.93 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY		40	260	5 mm		CMOS		5 V	Microcontrollers		.5 mm		S-XQCC-N32	3	Not Qualified	e4
MCIMX6X4EVM10AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm			40	260	19 mm		CMOS					.8 mm		S-PBGA-B529	3		e1
MCIMX6Y1CVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm			40	260	14 mm		CMOS					.8 mm		S-PBGA-B289	3		e1
TMS320DM365ZCED30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32	30	260	13 mm		CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
TMS320F28PLC84PNT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V				FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		12 mm			30	260	12 mm		CMOS		3.3 V			.5 mm		S-PQFP-G80	3		e4
XC7Z014S-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.6 mm		19 mm					19 mm		CMOS		1 V			.8 mm		S-PBGA-B484
EFR32MG24B220F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel		QUAD	.9 mm		6 mm					6 mm		CMOS		3 V			.4 mm		S-XQCC-N48
MCIMX6Q6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel		BOTTOM	2.16 mm		21 mm			40	260	21 mm		CMOS		1.4 V			.8 mm		S-PBGA-B624	3
SCANSTA112VSX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1.2 mm		14 mm		0	NOT SPECIFIED	260	14 mm		CMOS		3.3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G100	3	Not Qualified	e4
SLB9670XQ20FW762XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-40 Cel		BOTTOM	.9 mm		5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY				5 mm		CMOS		1.8 V			.5 mm		S-PQCC-N32
CY8C21434-24LFXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.93 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY		40	260	5 mm		CMOS		5 V	Microcontrollers		.5 mm		S-XQCC-N32	3	Not Qualified	e4
EFR32MG21A020F768IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel	MATTE TIN	QUAD	.9 mm		4 mm			40	260	4 mm		CMOS		3 V			.4 mm		S-XQCC-N32	2		e3
TMS320DM368ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32	30	260	13 mm		CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
XC7Z100-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B900
CY8C21434-24LKXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY		40	260	5 mm		CMOS		5 V	Microcontrollers		.5 mm		S-XQCC-N32	3	Not Qualified	e4
CY8C21434-24LKXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY		40	260	5 mm		CMOS		5 V	Microcontrollers		.5 mm		S-XQCC-N32	3	Not Qualified	e4
MCIMX6G1CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm			40	260	14 mm		CMOS					.8 mm		S-PBGA-B289	3		e1
MIMXRT1061CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm		10 mm			40	260	10 mm		CMOS					.65 mm		S-PBGA-B196	3		e1
AM4376BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS		1.26 V			.65 mm		S-PBGA-B491	3		e1
CC1310F32RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm		7 mm			NOT SPECIFIED	260	7 mm	28672	CMOS		3.3 V			.5 mm		S-PQCC-N48	3		e4
MCIMX6L8DVN10AA	NXP Semiconductors	SoC		BALL	432	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm			40	260	13 mm		CMOS					.5 mm		S-PBGA-B432	3		e1
SLB9665XQ20FW563XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM SILVER	QUAD	.9 mm		5 mm					5 mm		CMOS		3.3 V			.5 mm		S-PQCC-N32	3
USB2660I-JZX-03-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949		3.3	CHIP CARRIER	LCC64,.30SQ,16	3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	.9 mm		7.5 mm					7.5 mm			275 mA	3.3 V	Bus Controllers		.4 mm		S-PQCC-N64		Not Qualified	e3
EFR32MG21A010F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel	MATTE TIN	QUAD	.9 mm		4 mm			40	260	4 mm		CMOS		3 V			.4 mm		S-XQCC-N32	2		e3
SCANSTA112SMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		10 mm		0	30	260	10 mm		CMOS		3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B100	4	Not Qualified	e1
XC7Z015-3CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		0 Cel		BOTTOM	1.6 mm		19 mm					19 mm		CMOS		1 V			.8 mm		S-PBGA-B485
XC7Z035-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676
MCIMX7D7DVM10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,30	1.045 V	95 Cel		0 Cel		BOTTOM	1.4 mm		19 mm			40	260	19 mm		CMOS		1.1 V			.75 mm		S-PBGA-B541	3
XC7Z045-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.24 mm		27 mm					27 mm		CMOS		1 V			1 mm		S-PBGA-B676	4		e1
AM4372BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm			30	260	17 mm		CMOS		1.26 V			.65 mm		S-PBGA-B491	3		e1
MCIMX515DJM8CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm			40	260	19 mm		CMOS		1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e1
MCIMX6X4CVM08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm			40	260	19 mm		CMOS					.8 mm		S-PBGA-B529	3		e1
ST33HTPH2X32AHD4	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel		QUAD	1 mm		5 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE		NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		1.8 V			.5 mm		S-XQCC-N32
CC1310F64RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm		5 mm			NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V			.5 mm		S-PQCC-N32	3		e4
EFR32MG21A010F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel	MATTE TIN	QUAD	.9 mm		4 mm			40	260	4 mm		CMOS		3 V			.4 mm		S-XQCC-N32	2		e3
MCIMX6X1CVK08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		14 mm			40	260	14 mm		CMOS					.8 mm		S-PBGA-B400	3		e1
ZL30250LDG1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel		-40 Cel		QUAD	1 mm		5 mm	IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY				5 mm		CMOS		1.8 V			.5 mm		S-XQCC-N32
XC7Z015-1CL485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.6 mm		19 mm					19 mm		CMOS		1 V			.8 mm		S-PBGA-B485
AM5716AABCX	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm			30	250	23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760	3		e1
AM6231ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel		BOTTOM	.89 mm		13 mm					13 mm		CMOS		.75 V			.5 mm		S-PBGA-B425
MCIMX6S5EVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm		CMOS					.8 mm		S-PBGA-B624	3		e1
MCIMX7D3DVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	95 Cel		0 Cel		BOTTOM	1.1 mm		12 mm			40	260	12 mm		CMOS		1.1 V			.4 mm		S-PBGA-B488	3
MPFS250T-FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		-40 Cel		BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY				16 mm		CMOS		1 V			.5 mm		S-PBGA-B536
SE051P2HQ1/Z011AZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel		QUAD	.33 mm		3 mm				260	3 mm		CMOS		1.8 V			.4 mm		S-XQCC-N20	1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.