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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
STSPIN32F0ATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	45 V				CHIP CARRIER, HEAT SINK/SLUG		6.7 V	125 Cel		-40 Cel		QUAD			7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS		8 V			.5 mm		S-XQCC-N48
FT245RQ	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3.3 V	85 Cel		-40 Cel		QUAD	1 mm		5 mm		8	12.02 MHz	40	260	5 mm		CMOS		5 V		USB	.5 mm		S-XQCC-N32	3
SAM9X60D1G-I/LZB	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	152	QMA	SQUARE	UNSPECIFIED	YES	5.5 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel		QUAD	2.45 mm		28 mm						28 mm		CMOS		3.3 V			.65 mm		S-XQMA-N152
FT245BL-T/R	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V				FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm		7 mm				30	260	7 mm		CMOS		5 V			.8 mm		S-PQFP-G32	3			e3
XC7Z035-1FFG900C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel		0 Cel		BOTTOM	3.35 mm		31 mm						31 mm		CMOS		1 V			1 mm		S-PBGA-B900
MCIMX6G2CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm				40	260	14 mm		CMOS					.8 mm		S-PBGA-B289	3			e1
LS1021AXN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm		CMOS		1 V			.8 mm		S-PBGA-B525	3			e1
OMAPL138EZWTD4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm		CMOS		1 V			1 mm		S-PBGA-B676
MIMXRT106FCVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel		BOTTOM	1.43 mm		10 mm				40	260	10 mm		CMOS					.65 mm		S-PBGA-B196	3
PN7150B0HN/C11002E	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel		-30 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		6 mm				30	260	6 mm		CMOS		1.8 V			.5 mm		S-XQCC-N40	3			e4
MCIMX6G2CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel		BOTTOM	1.23 mm		9 mm				40	260	9 mm		CMOS					.5 mm		S-PBGA-B272	3
MCIMX257CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm		CMOS		1.45 V	Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
TMS320DM368ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm		CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
MCIMX6S5DVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm		CMOS					.8 mm		S-PBGA-B624	3			e1
MIMX8MM1DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm				40	260	14 mm		CMOS		1 V			.5 mm		S-PBGA-B486	3			e2
SE051C2HQ1/Z01XDZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel		QUAD	.33 mm		3 mm					260	3 mm		CMOS		1.8 V			.4 mm		S-XQCC-N20	1
NRF52811-QCAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel		QUAD	.9 mm		5 mm						5 mm		CMOS		3 V			.5 mm		S-XQCC-N32
XCZU3CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250			CMOS		.85 V					S-PBGA-B784	4			e1
XC7Z035-2FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel		BOTTOM	3.35 mm		31 mm						31 mm		CMOS		1 V			1 mm		S-PBGA-B900
MIMX8MN5DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel		0 Cel		BOTTOM	1.01 mm		11 mm				40	260	11 mm		CMOS		.95 V			.5 mm		S-PBGA-B306	3
XC7Z045-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm		CMOS		1 V			1 mm		S-PBGA-B900
MCIMX6S5DVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm		CMOS					.8 mm		S-PBGA-B624	3			e1
MCIMX6U5EVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm		CMOS					.8 mm		S-PBGA-B624	3			e1
MCP2221-I/ML	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	TS 16949		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm		4 mm						4 mm		CMOS	15 mA	3.3 V	Serial IO/Communication Controllers		.65 mm		S-PQCC-N16		Not Qualified		e3
XC7Z030-2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	2.44 mm		19 mm						19 mm		CMOS		1 V			.8 mm		S-PBGA-B485
XC7Z045-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XC7Z030-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		27 mm						27 mm		CMOS		1 V			1 mm		S-PBGA-B676
XCZU3CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250			CMOS		.85 V					S-PBGA-B784	4			e1
USB2660I-JZX-03	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm		9 mm						9 mm		CMOS	275 mA	3.3 V	Bus Controllers		.5 mm		S-PQCC-N64		Not Qualified		e3
XC7Z045-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm		27 mm						27 mm		CMOS		1 V			1 mm		S-PBGA-B676
MIMXRT1052CVL5A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel		BOTTOM	1.52 mm		10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE					10 mm		CMOS					.65 mm		S-PBGA-B196
XCC1312R1F3RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		7 mm	DIMENSION CONSIDER BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF			30	260	7 mm		CMOS		3 V			.5 mm		S-PQCC-N48	3			e4
XC7Z045-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm		27 mm						27 mm		CMOS		1 V			1 mm		S-PBGA-B676
MIMX8MM1CVTKZAA	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm				40	260	14 mm		CMOS		.95 V			.5 mm		S-PBGA-B486	3			e2
NT3H2111W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.67 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 mm		1.6 mm				30	260	1.6 mm		CMOS		1.8 V			.5 mm		S-PQCC-N8	1			e4
XC7Z007S-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.5 mm		13 mm						13 mm		CMOS		1 V			.8 mm		S-PBGA-B225
CC1310F128RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	1 mm		4 mm				30	260	4 mm	28672	CMOS		3.3 V			.4 mm		S-PQCC-N32	3			e4
CC1312R1F3RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		7 mm	DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF			30	260	7 mm	81920	CMOS		3 V			.5 mm		S-PQCC-N48	3			e4	30
XC7Z030-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm		CMOS		1 V			1 mm		S-PBGA-B676
FT245RQ-TRAY	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel		-40 Cel		QUAD	1 mm		5 mm				40	260	5 mm		CMOS					.5 mm		S-XQCC-N32	3	Not Qualified
PN7150B0HN/C11006Y	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel		-30 Cel		QUAD	1 mm		6 mm					260	6 mm		CMOS		1.8 V			.5 mm		S-XQCC-N40	3
XC7Z045-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	2.54 mm		27 mm						27 mm		CMOS		1 V			1 mm		S-PBGA-B676
CC1310F64RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm		7 mm				NOT SPECIFIED	260	7 mm	28672	CMOS		3.3 V			.5 mm		S-PQCC-N48	3			e4
STSPIN32F0	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	45 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8 V	125 Cel		-40 Cel		QUAD	1 mm		7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS					.5 mm		S-XQCC-N48
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm		CMOS		1.1 V			.8 mm		S-PBGA-B529	3			e2
NRF52833-QIAA-B-R	Nordic Semiconductor Asa	SoC		NO LEAD	73		SQUARE	UNSPECIFIED	YES	5.5 V						1.7 V	105 Cel		-40 Cel		QUAD				ALSO AVAILABLE WITH QFN-40 AND WLCSP-95 PACKAGE							CMOS							S-XQCC-N73
CY8C21434-24LQXIT	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			40	260	5 mm		CMOS		5 V			.5 mm		S-XQCC-N32	3	Not Qualified		e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.