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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
NRF52832-QFAA-R	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm		CMOS		3 V		.4 mm	S-XQCC-N48
NRF52832-QFAA-R7	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm		CMOS		3 V		.4 mm	S-XQCC-N48
NRF52832-QFAA-T	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm		CMOS		3 V		.4 mm	S-XQCC-N48
NRF5340-QKAA-R7	Nordic Semiconductor Asa	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	94	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC94,.27SQ,16	1.7 V	105 Cel	-40 Cel			QUAD	.85 mm	7 mm				7 mm		CMOS		3 V		.4 mm	S-XQCC-N94
NRF52832-QFAB-R	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm		CMOS		3 V		.4 mm	S-XQCC-N48
NRF5340-QKAA-R	Nordic Semiconductor Asa	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	94	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC94,.27SQ,16	1.7 V	105 Cel	-40 Cel			QUAD	.85 mm	7 mm				7 mm		CMOS		3 V		.4 mm	S-XQCC-N94
XC7Z020-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm				17 mm		CMOS		1 V		.8 mm	S-PBGA-B400	3		e1
MIMXRT1062CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.43 mm	10 mm		40	260	10 mm		CMOS				.65 mm	S-PBGA-B196	3		e1
MIMXRT1062CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.43 mm	10 mm		40	260	10 mm		CMOS				.65 mm	S-PBGA-B196	3		e1
AR1100-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel	-40 Cel	MATTE TIN		QUAD	1 mm	5 mm	ALSO OPERATES AT 5V SUPPLY			5 mm		CMOS		3.3 V		.65 mm	S-PQCC-N20			e3
XC7Z010-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm				17 mm		CMOS		1 V		.8 mm	S-PBGA-B400	3		e1
MIMXRT1062CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER		BOTTOM	1.52 mm	12 mm		40	260	12 mm		CMOS				.8 mm	S-PBGA-B196	3		e2
XC7Z020-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm		CMOS		1 V		.8 mm	S-PBGA-B484
XC7Z030-1SBG485C	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	2.44 mm	19 mm				19 mm		CMOS		1 V		.8 mm	S-PBGA-B485
MIMXRT1062CVJ5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER		BOTTOM	1.52 mm	12 mm		40	260	12 mm		CMOS				.8 mm	S-PBGA-B196	3		e2
XC7Z020-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	1.6 mm	19 mm				19 mm		CMOS		1 V		.8 mm	S-PBGA-B484
MFRC52202HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel			QUAD				30	260				100 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MIMXRT1176CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel			BOTTOM	1.52 mm	14 mm		40	260	14 mm		CMOS				.8 mm	S-PBGA-B289	3
XC7Z020-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm		CMOS		1 V		.8 mm	S-PBGA-B484
MCIMX287CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm		CMOS		1.45 V		.8 mm	S-PBGA-B289	3	Not Qualified	e1
MCIMX535DVV1C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V		0.9/1.25,1.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER		BOTTOM	1.85 mm	19 mm		40	260	19 mm		CMOS		1.25 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e2
NRF52832-QFAB-T	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm		CMOS		3 V		.4 mm	S-XQCC-N48
MIMX8MM6DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER		BOTTOM	1.25 mm	14 mm		40	260	14 mm		CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
NRF52810-QCAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel			QUAD	.95 mm	5 mm		NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		3 V		.5 mm	S-XQCC-N32
SLB9670VQ20FW785XTMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel	-20 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD	.9 mm	5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			5 mm		CMOS		1.8 V		.5 mm	S-PQCC-N32	1
ESP32-C3FN4	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel	-40 Cel			QUAD	.9 mm	5 mm	ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY			5 mm		CMOS		3.3 V		.5 mm	S-PQCC-N32
NRF52810-QFAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel			QUAD	.95 mm	6 mm		NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS		3 V		.4 mm	S-XQCC-N48
XC7Z010-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm				17 mm		CMOS		1 V		.8 mm	S-PBGA-B400	3		e1
PN5321A3HN/C106,55	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/5	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	-30 Cel	NICKEL PALLADIUM GOLD		QUAD				30	260				150 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N40	2	Not Qualified	e4
XC7Z020-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm				17 mm		CMOS		1 V		.8 mm	S-PBGA-B400	3		e1
XC7Z020-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm				17 mm		CMOS		1 V		.8 mm	S-PBGA-B400	3		e1
NRF52810-QCAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel			QUAD	.95 mm	5 mm		NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		3 V		.5 mm	S-XQCC-N32
XTDA4VHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel			BOTTOM	3.341 mm	31 mm				31 mm		CMOS		.8 V		.8 mm	S-PBGA-B1414
NRF52810-QFAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel			QUAD	.95 mm	6 mm		NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS		3 V		.4 mm	S-XQCC-N48
XC7Z030-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm				27 mm		CMOS		1 V		1 mm	S-PBGA-B676
XC7Z020-L1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm				19 mm		CMOS		1 V		.8 mm	S-PBGA-B484
XC7Z010-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm				13 mm		CMOS		1 V		.8 mm	S-PBGA-B225
XC7Z010-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm				17 mm		CMOS		1 V		.8 mm	S-PBGA-B400	3		e1
MCIMX535DVV1CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V		0.9/1.25,1.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER		BOTTOM	1.85 mm	19 mm		40	260	19 mm		CMOS		1.25 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e2
CY8C3866AXI-039	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm	14 mm		40	260	14 mm	65536 Bits	CMOS		3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G100	3	Not Qualified	e4
NRF52832-QFAB-R7	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm		CMOS		3 V		.4 mm	S-XQCC-N48
MIMXRT1064CVJ5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,31	1.15 V	105 Cel	-40 Cel			BOTTOM	1.52 mm	12 mm		40	260	12 mm		CMOS				.8 mm	S-PBGA-B196	3
MFRC52202HN1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel			QUAD				30	260				100 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MIMXRT1064CVL5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel			BOTTOM	1.43 mm	10 mm		40	260	10 mm		CMOS				.65 mm	S-PBGA-B196	3
NRF52810-QCAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel			QUAD	.95 mm	5 mm		NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		3 V		.5 mm	S-XQCC-N32
ESP32-C3FH4	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	105 Cel	-40 Cel			QUAD	.9 mm	5 mm	ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY			5 mm		CMOS		3.3 V		.5 mm	S-PQCC-N32
CY8C3866AXI-039T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	N	QUAD	1.6 mm	14 mm				14 mm	524288 Bits	CMOS		3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G100	3	Not Qualified
MIMX8MM6DVTLZAAR	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER		BOTTOM	1.25 mm	14 mm		40	260	14 mm		CMOS		1 V		.5 mm	S-PBGA-B486	3		e2

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.