MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
TMS320DM369ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		32768	13 mm				32		30	260	13 mm		CMOS					Digital Signal Processors			ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TCI6638K2KSAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
MSP430F6769IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0	25 MHz	30	260	20 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
CC430F6143IRGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm	8192		9 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY				30	260	9 mm	2048	CMOS			3.3 V		Microcontrollers		FLASH		.5 mm		S-PQCC-N64	3	Not Qualified	20 rpm	e4
MSP430F67621IPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm		4	12 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		0		30	260	12 mm	4096	CMOS			3.3 V					I2C; SPI; UART	.5 mm		S-PQFP-G80	3			e4
MSP430F67761AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	262144	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
TCI6636K2HCSAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
MSP430F67451AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
TCI6638K2KADAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
TCI6638K2KDAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
TCI6638K2KADAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
MSP430F67451IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	131072	16	14 mm				0		30	260	20 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
TCI6636K2HCSAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
MSP430F6747AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
TCI6636K2HAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
CC1310F128RHB	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V						QUAD		1 mm			5 mm								5 mm		CMOS									.5 mm		S-PQCC-N32
MSP430F67461IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	262144	16	14 mm				0		30	260	20 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
TCI6636K2HDDAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V						BOTTOM		3.75 mm			40 mm								40 mm		CMOS			1 V						1 mm		S-PBGA-B1517
MSP430F6748IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	16	14 mm				0	25 MHz	30	260	20 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
ADMC200AP	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V					CHIP CARRIER		4.75 V	85 Cel		-40 Cel	TIN LEAD		QUAD		4.45 mm			24.1808 mm								24.1808 mm		CMOS			5 V						1.27 mm		S-PQCC-J68		Not Qualified		e0
AD897JS	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES						FLATPACK			70 Cel		0 Cel	TIN LEAD		QUAD		2.39 mm			10 mm		ALSO REQUIRES 12V SUPPLY						10 mm		CMOS			5 V						.65 mm		S-PQFP-G52		Not Qualified		e0
AD6620AS	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)		QUAD		3.4 mm			14 mm						30	240	14 mm		CMOS			3.3 V		DSP Peripherals				.65 mm		S-PQFP-G80	3	Not Qualified		e0
AD1818JS	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V					FLATPACK, FINE PITCH		4.75 V	70 Cel		0 Cel	TIN LEAD		QUAD		3.4 mm			14 mm								20 mm		CMOS			5 V						.5 mm		R-PQFP-G128		Not Qualified		e0
ADSP-SC583KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC587KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel		0 Cel			BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADN2855ACPZ-R7	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			5 mm						30	260	5 mm		CMOS			3.3 V						.5 mm		S-XQCC-N32	3	Not Qualified		e3
ADSP-21583-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V						BOTTOM		1.5 mm			19 mm								19 mm		CMOS			1.1 V						.8 mm		S-PBGA-B349
ADSP-21584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz		260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC589BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz		260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-21584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADUCM330WDCPZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel			QUAD		1 mm			6 mm								6 mm		CMOS									.5 mm		S-XQCC-N32
ADSP-SC584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel		0 Cel			BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC584-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V						BOTTOM		1.5 mm			19 mm								19 mm		CMOS			1.1 V						.8 mm		S-PBGA-B349
ADSP-SC587BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz		260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-21583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC584BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC589BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
AD891AJD	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO						IN-LINE			70 Cel		0 Cel	TIN LEAD		DUAL		5.08 mm			7.62 mm								19.43 mm		CMOS									2.54 mm		R-CDIP-T14		Not Qualified		e0
ADUCM331WDCPZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel		-40 Cel			QUAD		1 mm			6 mm								6 mm		CMOS									.5 mm		S-XQCC-N32
ADSP-SC582KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3			e1
ADSP-SC584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADUCM350BBCZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.35 mm			8 mm						30	260	8 mm		CMOS			3 V						.5 mm		S-PBGA-B120	3			e1
ADSP-SC584CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz	30	260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-21584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz		260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC571-SWZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3.13 V	70 Cel		0 Cel			QUAD		1.6 mm			24 mm						NOT SPECIFIED	NOT SPECIFIED	24 mm		CMOS			3.3 V						.5 mm		S-PQFP-G176
ADSP-SC573-BCZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	70 Cel		0 Cel			BOTTOM		1.5 mm			17 mm								17 mm		CMOS			3.3 V						.8 mm		S-PBGA-B400
ADSP-SC584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel			BOTTOM		1.5 mm			19 mm					500 MHz		260	19 mm		CMOS			1.1 V					SPI; UART	.8 mm		S-PBGA-B349	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.