SoC FPGA Other Function uPs,uCs & Peripheral ICs 35

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)
A2F200M3F-CSG288I	Microchip Technology	SoC FPGA	BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA288,21X21,20	1.425 V	100 Cel	-40 Cel		BOTTOM	1.05 mm	11 mm			11 mm	CMOS	1.5 V	.5 mm	S-PBGA-B288	3
1SX250HN3F43E2VG	Intel	SoC FPGA
A2F200M3F-FGG256I	Microchip Technology	SoC FPGA	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	GRID ARRAY, LOW PROFILE		1.425 V	100 Cel	-40 Cel	MATTE TIN	BOTTOM			30	250		CMOS	1.5 V		S-PBGA-B256	3
AGFA006R16A2E3V	Intel	SoC FPGA	BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	0 Cel		BOTTOM									R-PBGA-B1546
AGFA027R24C2E3E	Intel	SoC FPGA	BALL	2340		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	0 Cel		BOTTOM									R-PBGA-B2340
AGFB012R24B2E2V	Intel	SoC FPGA
AGFB027R24C2E2V	Intel	SoC FPGA
AGFB027R25A2E2V	Intel	SoC FPGA
AGIB022R31B1E2V	Intel	SoC FPGA	BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	0 Cel		BOTTOM									R-PBGA-B3184
AGIB027R31B2E3E	Intel	SoC FPGA	BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	0 Cel		BOTTOM									R-PBGA-B3184
AGIB027R31B2I1V	Intel	SoC FPGA	BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	-40 Cel		BOTTOM									R-PBGA-B3184
AGIB027R31B2I3V	Intel	SoC FPGA	BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	-40 Cel		BOTTOM									R-PBGA-B3184
AGIB027R31B3E3E	Intel	SoC FPGA	BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	0 Cel		BOTTOM									R-PBGA-B3184
1SX280LN2F43I2VG	Intel	SoC FPGA
1SX165HU3F50I2VG	Intel	SoC FPGA
1SX250HN1F43I2VG	Intel	SoC FPGA
1SX280HN1F43E1VG	Intel	SoC FPGA
1SX280HN3F43I3VG	Intel	SoC FPGA
A2F200M3F-FG484	Microchip Technology	SoC FPGA	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	GRID ARRAY		1.425 V	85 Cel	0 Cel	TIN LEAD	BOTTOM						CMOS	1.5 V		S-PBGA-B484	3
AGIB027R31B1E1VAA	Intel	SoC FPGA
A2F200M3F-1FG484I	Microchip Technology	SoC FPGA	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	GRID ARRAY		1.425 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM						CMOS	1.5 V		S-PBGA-B484	3
A2F200M3F-FG256I	Microchip Technology	SoC FPGA													TIN LEAD											3
A2F200M3F-1FGG256I	Microchip Technology	SoC FPGA													TIN SILVER COPPER				30	250						3
A2F200M3F-CS288I	Microchip Technology	SoC FPGA													TIN LEAD SILVER
MPFS250TL-FCG1152I	Microchip Technology	SoC FPGA	BALL	1152		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	-40 Cel		BOTTOM						CMOS			R-PBGA-B1152
1SX165HN1F43E2VG	Intel	SoC FPGA
1SX250LU3F50I3XG	Intel	SoC FPGA
1SX280HN3F43E1VG	Intel	SoC FPGA
AGFA006R16A3E3V	Intel	SoC FPGA	BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	0 Cel		BOTTOM									R-PBGA-B1546
1SX250LN2F43I2VG	Intel	SoC FPGA
1SX165HN2F43E2VG	Intel	SoC FPGA
1SX250LN3F43I2VG	Intel	SoC FPGA
AGFB014R24B2E2V	Intel	SoC FPGA
1SX280HU1F50I1VG	Intel	SoC FPGA
A2F200M3F-1CSG288	Microchip Technology	SoC FPGA	BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	GRID ARRAY, THIN PROFILE, FINE PITCH		1.425 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						CMOS	1.5 V		S-PBGA-B288	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.